Delphi Integrated Radar and Camera System (RACam) 2016 teardown reverse costing report published by Yole Developpement

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Electronic Costing & Technology Experts
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January 2016 - Version 1 written by David LE GAC

Delphi - RACam System
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1. Overview/Introduction 3
– Executive Summary
– Company Profile : Delphi
– Reverse Costing Methodology
2. Physical Analysis 8
 Global view of the Radar
 Views and Dimensions of the Radar
 Radar Disassembly
 Camera Module Global View, Dimensions and Disassembly
 Lens Module
 MCU Board
• MCU Board – Top Side – Global View
• MCU Board – Top Side – High Definition Photo
• MCU Board – Top Side – Components Markings
• MCU Board – Top Side – Components Identification
• MCU Board – Bottom Side – Global View
• MCU Board – Bottom Side – High Definition Photo
• MCU Board – Bottom Side – Components Markings
• MCU Board – Bottom Side – Components Identification
 RF Board
 Camera Module Board
 Waveguide Board
 Antenna Board
 RF Design
 Cross Sections and EDX Analysis
 RF Dies views, dimensions and detail functions
 Mobileye EyeQ3 Package views, dimensions and opening
3. Cost Analysis 58
– Estimation of the cost of the PCBs
– Estimation of the Cost of the MCU
– Estimation of the Cost of the CMOS Image Sensor
– BOM Cost - MCU Board
– BOM Cost - RF Board
– BOM Cost - Camera Module
– BOM Cost - Housing
– Material Cost Breakdown
– Accessing the Added Value (AV) cost
– MCU Board Manufacturing Flow
– Details of the MCU Board AV Cost
– RF Board Manufacturing Flow
– Details of the RF Board AV Cost
– Details of the Housing Assembly AV Cost
– Added Value Cost Breakdown
– Manufacturing Cost Breakdown
4. Estimated Price Analysis 100
– Estimation of the Manufacturing Price
Contact 103

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This Reverse Costing analysis has been conducted in several phases :
• The initialization of the analysis
Pictures of the elements to be studied.
Identification of the components.
• Description of the material in the “SYScost+” software
Creation of an “estimation project” of the studied board with SYScost+software.
Construction of the Bill of Material (BOM).
• Assessing the material
Searching for the price of each reference among distributors and manufacturers.
Assessing the cost of the PCB and of the unaccounted references (unknown by distributors)
The BOM is valued with SYScost+ : price simulation according to the requested quantities.
• Assessing the assembling and test phases
Assembly and test lines are modeled with the SYScost+ software.
The assembly and tests costs are estimated.
• Production cost & selling price
Estimation of the production cost & selling price.
• Report
A report is edited.
SYScost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More
information on the software can be found at www.systemplus.fr.

Return to TOC
Global views of the Radar.
Total Weight: 530.8g
Label #1.

Return to TOC

Return to TOC
• The Reverse costing analysis represents the best cost/price evaluation given the publically
available data, completed with industry expert estimates.
• These results are open for discussion. We can re-evaluate this system with your information.
Please contact us:
• Consulting and Specific Analysis
– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.
Email: laferriere@yole.fr
– Japan: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.
Email: onozawa@yole.fr
– RoW: Jean-Christophe Eloy, President & CEO, Yole Développement
Email: eloy@yole.fr
• Report business
– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.
Email: laferriere@yole.fr
– Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service
Email: khamassi@yole.fr
– Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.
Email: onozawa@yole.fr
– Korea: Hailey Yang, Business Development Manager, Korean Office
Email: yang@yole.fr
– Taiwan/China: Mavis Wang, Business Development Manager, Chinese Office
– Email: wang@yole.fr
• Financial services
– Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr
• General: info@yole.fr

Delphi RACam
Integrated Radar and Camera
Title: Delphi RACam
Pages: 104
Date: January 2016
Format: pdf + xls
PRICE:
Full report: EUR 3,490
A compact, cost-effective and high-performance Advanced Driving Assistance
System (ADAS)
The visual detection is performed by a 1/3” CMOS Image Sensor supplied by
a leader in the CIS automotive industry. The sensor is surmounted by a
specific 7-lens module and the Mobileye EyeQ3 SoC is used for video
processing. Concerning the radar function, Receiver and Transmitter chips
from Infineon using SiGe HBT technology are assembled by wire bonding on
the RF Board. The Antenna board uses a PTFE-based substrate and is
equipped with planar antennas for transmission and reception of the RF
signals.
Based on a complete teardown analysis of the Delphi RACam, the report
provides the bill-of-material (BOM) and the manufacturing cost of the
system. The report also includes analysis of the Image Sensor and Lens
module. A structural analysis, with a comparison with Bosch MRR1,
highlights the technical choices in RF design made by Delphi.
A physical analysis and manufacturing cost estimation of the Infineon RF
chips is available in a separate report, which also includes a comparison with
MMICs used in the Bosch MRR1 Radar.
COMPLETE TEARDOWN WITH:
• Detailed Photos
• Material Analysis
• PCBs Cross Section and EDX
• Lens-module Cross Section and EDX
• CIS Analysis and Cost estimation
• MCU cost estimation
• RF Design structural Analysis
• Comparison with Bosch MRR1
• Bill of Material
• Manufacturing Process Flow
• Manufacturing Cost Analysis
• Manufacturing Price Estimation
Delphi is the first to provide a
single system combining 76Ghz
Radar and Vision Sensing. With a
compact design the system can be
integrated behind the windshield
and enables a broad array of
active safety features, as lane
tracking, collision avoidance or
adaptive cruise control.

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TABLE OF CONTENTS
Overview/Introduction
• Executive Summary
• Company Profile : Delphi
• Reverse Costing Methodology
Physical Analysis
• Global View of the Radar
• Views and Dimensions of the Radar
• Radar Disassembly
• Camera Module Disassembly
• Lens Module
• Electronic Boards
 MCU Board
 RF Board
 Camera Module Board
 Waveguide Board
 Antenna Board
• RF Design
• Cross Section and EDX Analysis
• RRN7740 and RTN7750
 Views and Dimensions
 Detail Functions
• Mobileye EyeQ3
 Views and Dimensions
 Openning
Cost Analysis
• Estimation of the cost of the PCBs
• Estimation of the Cost of the MCU
• Estimation of the Cost of the CMOS Image
Sensor
• BOM Cost - MCU Board
• BOM Cost - RF Board
• BOM Cost - Camera Module
• BOM Cost - Housing
• Material Cost Breakdown
• Accessing the Added Value (AV) cost
• MCU Board Manufacturing Flow
• RF Board Manufacturing Flow
• Details of the Housing Assembly &
Functional Test Costs
• Added Value Cost Breakdown
• Manufacturing Cost Breakdown
Estimated Price Analysis
• Estimation of the Manufacturing Price
ANALYSIS PERFORMED WITH OUR COSTING TOOLS SYSCost+
SYSCost+
Author:
David Le Gac
David is in charge of reverse
costing with a focus on boards
and systems. He worked for
Lacroix Electronics where he
was in charge of components
database. David holds a master
degree in microelectronics from
the University of Rennes.
SYSCost+
Defining the cost of an
electronic system requires an
estimation of all component
costs, including PCB, housing
and connectors, and a
simulation of the cost of the
assembly and test process at
the board and system level.
The costing modules included
in SYScost+ answer all these
requirements and help costing
engineers get accurate
calculations.
SYScost+ is flexible in order to
be used in multiple applica-
tions.
Stéphane has a deep knowledge
of Materials characterizations
and Electronics systems. He
holds an Engineering Degree in
Electronics and Numerical
Technology, and a PhD in
Materials for Microelectronics.
Author:
Stéphane
Elisabeth

Bosch Mid Range Radar
MRR Sensor
Infineon 77GHz eWLB
RRN7745P & RTN7735P
Mobileye EyeQ3®
Automotive Vision-Based SoC
A compact, cost-effective and
high-performance driving
assistance system.
New Receiver & Transmitter
components with a SiGe:C HBT
technology from Infineon.
3rd Generation Mobileye Processor
For Vision Based Driver Assistance
Systems.
Pages: 80
Date: October 2015
Full report: EUR 2,490*
Pages: 104
Date: October 2015
Pages: 55
Date: April 2015
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Delphi Integrated Radar and Camera System (RACam) 2016 teardown reverse costing report published by Yole Developpement

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Delphi Integrated Radar and Camera System (RACam) 2016 teardown reverse costing report published by Yole Developpement