EBSD Sample preparation Mg.pdf

Trans. Nonferrous Met. Soc. China 22(2012) 18011809
Application of EBSD technique to ultrafine grained and
nanostructured materials processed by severe plastic deformation:
Sample preparation, parameters optimization and analysis
CHEN Yong-jun, Jarle HJELEN, Hans J. ROVEN
Department of Materials Science and Engineering, Norwegian University of Science and Technology,
NO-7491, Trondheim, Norway
Received 10 November 2011; accepted 25 June 2012
Abstract: With the help of FESEM, high resolution electron backscatter diffraction can investigate the grains/subgrains as small as a
few tens of nanometers with a good angular resolution (~0.5°). Fast development of EBSD speed (up to 1100 patterns per second)
contributes that the number of published articles related to EBSD has been increasing sharply year by year. This paper reviews the
sample preparation, parameters optimization and analysis of EBSD technique, emphasizing on the investigation of ultrafine grained
and nanostructured materials processed by severe plastic deformation (SPD). Detailed and practical parameters of the
electropolishing, silica polishing and ion milling have been summarized. It is shown that ion milling is a real universal and promising
polishing method for EBSD preparation of almost all materials. There exists a maximum value of indexed points as a function of step
size. The optimum step size depends on the magnification and the board resolution/electronic step size. Grains/subgrains and texture,
and grain boundary structure are readily obtained by EBSD. Strain and stored energy may be analyzed by EBSD.
Key words: electron backscatter diffraction (EBSD); sample preparation; parameters optimization; step size; severe plastic
deformation (SPD)
1 Introduction
Electron backscatter diffraction (EBSD) based on
scanning electron microscopy (SEM) is a powerful
technique to automatically and quantitatively measure
the grain/subgrain size, local texture, point-to-point
orientations, strain and phase identification [14]. With
the help of field emission SEM (FESEM), high
resolution EBSD can investigate the grains/subgrains as
small as a few tens of nanometers [4] with a good
angular resolution (~0.5°) [5]. It has been established
that EBSD has a lot of advantages over transmission
electron microscopy (TEM), such as simple sample
preparation, automatic scanning and indexing, ultra-fast
speed, large area investigation and a lot of post-
processing results derived from one EBSD scan. After
two important steps of development [4], the EBSD speed
has increased gradually with the fast development of
camera technique. It has increased sharply up to 1100
patterns per second (PPS) by adopting the offline EBSD
techniques (Fig. 1). Therefore, the number of published
articles related to EBSD has been increasing sharply year
by year (Fig. 2, data are searched from www.scopus.com).
In recent years, severe plastic deformation (SPD)
[6], e.g. equal channel angular pressing (ECAP), high
pressure torsion (HPT), cyclic extrusion compression
(CEC) and accumulative roll bonding (ARB), has been
increasingly used in processing ultrafine grained (UFG,
grain size in the range 1001000 nm) or nanostructured
(100 nm) materials directly from bulk samples. SPD
techniques can easily reach an equivalent strains 10,
which in turn leads to an equiaxed microstructure with a
high density of grain boundaries (high angle grain
boundaries (HAGBs) 60%). In order to understand the
grain refining mechanism induced by SPD and to control
the microstructure evolution, EBSD is very important to
be employed, especially increasing demand for in situ
heating and tension, and 3D EBSD investigation.
EBSD patterns are generated by backscatter
diffraction of a stationary beam of high-energy electrons
from a volume of crystal material within 50 nm depth in
Foundation item: Project (192450/I30) supported by the Norwegian Research Council under the Strategic University Program
Corresponding author: CHEN Yong-jun; Tel: +47-73594921; E-mail: happywinner01@gmail.com
DOI: 10.1016/S1003-6326(11)61390-3

CHEN Yong-jun, et al/Trans. Nonferrous Met. Soc. China 22(2012) 18011809
1802
Fig. 1 Collected patterns per second as function of year
Fig. 2 Published articles related to EBSD as function of year
the specimen [3,7]. Therefore, the sample preparation is
extremely crucial. This paper is concerned with the
sample preparation, parameters optimization and results
analysis.
2 Sample preparation
Despite a number of recommended preparation
methods are available on internet, in publications or
books, detailed and practical information about the
preparation parameters is still missing. In general, almost
all samples for EBSD observation need to be
mechanically polished carefully. The suggested steps
based on the experience in our group for the mechanical
polishing sequence are listed in Table 1. When preparing
soft materials (e.g. pure Al and its alloys), it is
recommended to grind with a soap coating on SiC paper
to avoid deep scratches or being embedded by hard
particles. The grinding/polishing force depends on the
hardness of materials, and less force is normally used
with softer materials. Some materials such as magnesium
alloys should never touch water after the last step listed
in Table 1.
Table 1 Basic mechanical polishing sequence
Step Method Lubricant Time
1 80 grit SiC paper Water Until plane
2 600 grit SiC paper Water 2090 s
5 6 m diamond solution Ethanol 15 min
Normally, the samples cannot be used for EBSD
after 1 m diamond polishing. There are three main
methods (electropolishing, silica polishing and ion
milling) for the final polishing of EBSD samples to
achieve good quality of patterns.
2.1 Electropolishing
Electropolishing is a popular polishing method for
the final step of EBSD preparation. It is one of the most
effective methods for samples processed by SPD because
it removes the microstrain induced by mechanical
polishing. Electropolishing is a process by which surface
material is removed from the sample by passage of
electric current while the sample is made an anode (or
positive terminal) in a designed solution.
In general, the fresh surface which is easy to oxidize
is recommended to be electropolished below room
temperature. Sample preparation for some materials like
Mg alloys, which is known to be very difficult, should be
performed carefully. EBSD observation should be done
immediately followed by electropolishing due to the easy
oxidation on free surface.
The electropolishing parameters of some commonly
used materials are listed in Table 2. It can be seen that
almost all materials require a subzero temperature to
avoid the oxidizing problem. The electrolytes of AC2
and A3 are the product names of Struers Company. More
information can be found from Ref. [8]. Normally, the
electrolytes that are used to produce TEM thin foils can
be used on electropolishing of bulk specimens [9]. For
some materials like magnesium alloys, it is very useful to
have an additional mechanical polishing with diluted
OPS solution just before electropolishing [10].
The quality of the polished surface is controlled by
some parameters, e.g. voltage, temperature, flow rate and
polishing time. It is important to note that some solutions
have a short shelf life [9]. The common problems,
possible causes and the actions during electropolishing,
are listed in Table 3 [15]. Although Table 3 is an
instruction manual for the electropolishing machine of
Lectropol-5 made by Struers Company, it works to shoot
most problems during electropolishing.

CHEN Yong-jun, et al/Trans. Nonferrous Met. Soc. China 22(2012) 18011809 1803
Table 2 Summary of electropolishing parameters of some commonly used materials
Material Electrolyte Voltage/V Polishing time/s Temperature/°C Ref.
AZ31 Mg alloy AC2 15 1015 30 [10]
Pure Ti A3 40 1525 30 [12]
Al alloys 20% perchloric acid and 80% ethanol 20 25 30 [11]
Steel 5% (volume fraction) perchloric acid 40 40 [13]
Nb single crystal 30 mL HF+40 mL H2SO4+130 mL lactic acid 20 120 5 [14]
Table 3 Common problems, possible causes and actions during electropolishing [15]
Problem Possible cause Action
Surface not polished or
only partly polished
1. Current density insufficient;
2. Electrolyte used;
3. Insufficient quantity of electrolyte
1. Increase voltage to get higher current;
2. Renew electrolyte;
3. Add electrolyte
Spots that have not
been polished
1. Gas bubbles/voltage too high;
2. Gas/bubbles/ flow rate too high;
3. Electrolyte temperature too high
1. Decrease the voltage;
2. Adjust flow rate;
3. Check electrolyte temperature
Polished surface is
etched
1. Chemical attack of the grain boundaries
after switching off the current;
2. Voltage too low
1. Remove and clean the specimen immediately
after current is switched off;
2. Increase voltage
Pitting
1. Time too long;
2. Voltage too high;
3. Insufficient anodic layer
1. Improve preparation prior to polishing;
2. Decrease the time;
3. Decrease the voltage;
4. Decrease the flow rate
Deposits on surface Insoluble reaction products
1. Use a different electrolyte or a freshly mixed one;
2. Increase the voltage
Wavy surface
1. Time too short;
2. Flow rate not correct;
3. Electrolyte used;
4. Selective polishing because of different phases;
5. Wrong electrolyte;
6. Unsuitable preparation
1. Increase the time;
2. Try to decrease/or increase the flow rate;
3. Replace the electrolyte;
4. Improve preparation prior to polishing;
5. Use different electrolyte with other polishing area;
6. Improve the preparation prior to polishing
Figure 3 shows the EBSD orientation maps with
successful electropolishing on light metals before and
after SPD [1,2,10]. It is well known that the pattern
quality of the EBSD deteriorates with increasing density
of defects like dislocations and accumulated strain in
materials processed by SPD. Therefore, the
microstructures without SPD (Figs. 3(a) and (c)) can be
easily characterized by EBSD and the image quality (IQ)
is very high. Materials processed by SPD are very
difficult to be investigated by EBSD and, therefore
sometimes non-indexed points (black points) present in
the heavily deformed area (Fig. 3(d)). In general, the
electropolishing parameters that work for materials
processed by SPD can be used for the same material
without SPD. The materials with higher atomic number
like nickel and steel can yield stronger Kikuchi patterns,
thus the sample preparation is not so critical. However,
the sample preparation for AlMg alloys (low atomic
number) processed by SPD, especially for high
magnesium content, is very difficult. In this case, short
annealing at low temperature could be a nice way to
improve the pattern quality [11].
2.2 Silica polishing
Electropolishing works very well for EBSD
preparation of many samples. However, there is no
universal electrolyte working for all materials and the
non-conductive materials cannot be prepared by
electropolishing. As a solution working for nearly all
materials, colloidal sillica is a commercially available
solution which consists of negatively charged particles of
silicon dioxide (SiO2) with a pH value between 8 and
11 [9]. When polishing with this solution, the sample
surface is slightly etched and the deformation layer

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Fig. 3 EBSD orientation maps with electropolishing for light metals before and after SPD [1,2,10]: (a) As-extruded AZ31 Mg alloys;
(b) AZ31 Mg alloy after 7 passes of CEC; (c) Homogenized Al1Mg alloys; (d) Al1Mg alloy after 4 passes of ECAP;
(e) Commercial pure Ti after 1 pass of ECAP; (f) Commercial pure Ti after 8 passes of ECAP
during mechanical polishing is therefore removed.
Figure 4 shows two pairs of electron micrographs and
EBSD patterns [9]. The effects of polishing time on the
pattern quality are observed. It indicates that silica
polishing needs a very long time to reach a good surface.
From the experience in our group, silica polishing works
for materials with very high atomic number and the
image quality obtained from this method is obviously
lower than that of the same material polished by
electropolishing.
2.3 Ion milling
Ion milling including focused ion beam (FIB) and
ordinary ion milling products (Flat Ion Milling System,
Hitachi IM-3000), is a process using ion beam (Ga+
or
Ar+
) to remove the surface of target material. It has been
widely used in preparing TEM samples and now is a
very universal polishing method for EBSD preparation of
almost all materials. EBSD combined with a dual-beam
FIB has been used in investigating 3D-EBSD image [16].
With the help of FIB ion milling, TEM and EBSD

Fig. 4 Two image pairs showing electron micrographs and EBSD patterns and effects of polishing time on pattern quality observed
[9]: (a, a) 10 min colloidal silica, pattern IQ of 25; (b, b) 30 min colloidal silica, pattern IQ of 166
investigations can be completed in the same area of the
same sample [17].
MICHAEL and GIANNUZZI [17] reported a series
of image pairs of Si obtained with an electron beam at 20,
10 and 5 kV at the same area finally milled with 30 kV
Ga+
, 5 kV Ga+
and 2 kV Ga+
(Fig. 5). The results show
that the improvement in the indexing rate and pattern
quality by low voltage ion milling is obvious at all SEM
operating voltages. This work suggests that ion milling
should be done at a low voltage and low current in order
to obtain nice EBSD patterns.
An example of nice orientation map of GW 103 Mg
alloy polished by Hitachi IM-3000 is shown in Fig. 6.
The image quality seems a little better than that of Mg
alloys with successful electropolishing as shown in Fig. 3.
The polishing parameters of voltage, gas flow and
polishing time are 3 kV, 0.08 cm3
/min and 30 min,
respectively. It is recommended to tilt the sample 80° and
to rotate 360° during polishing. Preparing multiple
samples at the same time is also possible when setting an
eccentricity of rotation.
3 Parameters optimization
The optimum settings of SEM for EBSD can be
Fig. 5 Image pairs showing EBSD pattern quality and
orientation maps of Si obtained with an electron beam at 20 kV
(a, b), 10 kV (c, d) and 5 kV (e, f) (The final ion beam
polishing voltages are shown at the top of figures [17])
summarized as (depending on SEM/EBSD geometry): 1)
the sample is titled to 70°, 2) the accelerating voltage is
20 kV, and 3) the working distance is 20 mm. In order to
obtain a high quality EBSD image, the users should also
pay attention to the vacuum degree. The present authors
recommend waiting for about 50 min after vacuum is
ready in order to minimize the contamination [4].
Besides the settings mentioned above, step size is
one of the most important parameters which need to be
decided during each EBSD scan. The present authors

1806
Fig. 6 Orientation map of GW 103 Mg alloy polished by
Hitachi IM-3000
studied the indexed points as a function of step size in
coarse grained (without SPD) and ultrafine grained (after
SPD) Ti [4]. The results show that there exists a
maximum value of indexed points as a function of step
size in both samples. The optimum step size (D0)
depends on the magnification (M) and the board
resolution/electronic step size as follows [4]:
e
0 16
50
2
H C
D
M
˜
where He is the electron image width, m; C is constant
depending on the EBSD hardware. In our set up, C is
80246 m. Figure 7 shows that the optimum step size
decreases sharply at low magnification and decreases
slightly at high magnification. This figure is very useful
to find the optimum magnification when a step size is
decided. Therefore, it is strongly recommended to have a
bigger scan area at high magnification instead of a small
area at very low magnification, as schematically shown
in Fig. 8.
Fig. 7 Optimum step size as function of magnification [4]
Fig. 8 Schematic showing relationship between scan area and
magnification
In general, the minimum grain/subgrain size that
can be investigated is dependent on the spatial resolution
of the equipment. For a FESEM, the spatial resolution of
EBSD tends to get worse slightly as the probe current
increases from 10 nA to 100 nA [4,18]. The chosen step
size should not be smaller than the spatial resolution.
Therefore, a real minimum grain/subgrain size that can
be investigated for each EBSD scan is based on the
chosen step size. At least 5 pixels per grain/subgrain are
required to obtain an accuracy of 10% and a minimum of
~8 pixels per grain/subgrain are required to have an
accuracy of 5% [18].
4 Analysis by EBSD
4.1 Grain/subgrains and texture
A lot of quantitative information can be obtained
from one EBSD scan. Taking the orientation maps of
Figs. 3(e) and (f) for example, the same color means
similar orientation. Low angle grain boundaries
(LAGBs), with misorientations of 1.5°15° and high
angle grain boundaries (HAGBs), with misorientations
above 15°, are marked with thin blue lines and thick
black lines, respectively. It is apparent that Fig. 3(e)
shows a mixture of elongated coarse grains, twins
(examples are marked by A and B) and fine-grain bands.
In Fig. 3(f), the grains are slightly elongated and aligned
at about 11° to the extrusion axis. The grain and subgrain
size distributions (equivalent circle diameter) can be
easily obtained from the orientation maps, as shown in
Fig. 9 [1]. Figure 9 shows the evolution of grain size
with increasing strain of SPD and the mean subgrain and
grain sizes of these distributions. Details can be found in
Ref. [1].
In addition to quantitative study, the orientation map
can also be used for detailed investigation on texture,
special orientations and point to point misorientation.

QUADIR et al [19] analyzed the orientations of the
lamellar bands (LBs) within the Al layer during ARB. It
is clear that there is a dominance of {110}¢112² (brass
texture) in the presence of other rolling components
(Figs. 10(a) and (b)). Figure 10(c) shows that the average
spacing of the HAGBs is about 0.7 Pm. It can be seen
that the LBs are often bowed at boundaries and triple
junctions, which is indicative of recovery.
4.2 Grain boundary structure
Compared with the misorientation of the grain
boundaries investigated by TEM, the grain boundary
map with detailed misorientations provided by EBSD is
much easier. Figures 11 and 12 show a grain boundary
map and associated misorientation distribution of AZ31
Mg alloy after 7 passes of CEC [10]. It is apparent that
the fine grains gather together to form network-shaped
structures (Fig. 11). Figure 12 shows a very strong peak
which can be distinguished at misorientation angles
around 90°, which links with the occurrence of tensile
twinning )
2
1
10
( [20].
Observation of grain boundary structure by EBSD
Fig. 9 Examples of grain and subgrain size distribution of CP Ti processed by 1 pass (a) and 8 passes (b) of ECAP [1]
Fig. 10 EBSD micrograph of Al layer during ARB with special orientations highlighted by colors (a), corresponding (111) pole figure
(b), and point to point misorientation profile along vertical line shown in Fig. 10(a) (c) [19]

1808
Fig. 11 Grain boundary map of AZ31 Mg alloy after 7 passes of
CEC taken from Fig. 3(b)
Fig. 12 Misorientation distribution collected from Fig. 11 [10]
could be a powerful way to study the development of a
certain texture components and the grain boundary
migration during deformation and recrystallization
[21,22], and substructures [23]. Coincidence site lattice
(CSL) is one of the most important fields which are
interested in SPD community. With the help of
commercial softwares, the population of grain boundary
types may be calculated [13].
4.3 Strain and stored energy
The degree of plastic strain and the associated
stored energy are very important for material scientists to
study the growth rate of stress corrosion cracking (SCC)
[24] and the driving force of recrystallization [1],
respectively. Changes in the IQ value and in local
orientation have been used to study the strain and stored
energy [1,24,25]. IQ value, the quality of the diffraction
patterns, indicates the distortion degree of crystal lattices
in the diffraction patterns [26]. Kernel average
misorientation (KAM), one of the functions of
commercial software, e.g. orientation imaging
microscopy (OIM 5.3), shows the distribution of local
misorientation based on a Kernel average misorientation
between neighbors on the scan grid [26]. It is an
important indicator of dislocation density [27] and strain
distribution on individual measurement points [28].
As shown in Fig. 3(e), the commercial pure Ti after
1 pass of ECAP has a very inhomogeneous
microstructure, and in particular shows elongated coarse
grains and fine grain bands. The IQ map of Fig. 3(e) is
shown in Fig. 13. It can be seen that the IQ distribution
varies through the microstructure and in particular, that
the elongated coarse grains (marked by A) are much
brighter than the fine-grain bands (marked by B),
indicating that fine-grain bands have larger stored energy.
Calculation of the stored energy of commercial pure Ti
processed by ECAP 1-8 passes can be found in Ref. [1].
Fig. 13 Image quality map of commercial pure Ti after
1 pass of ECAP, taken from Fig. 3(e)
5 Conclusions
1) Detailed and practical parameters of the
electropolishing, silica polishing and ion milling have
been summarized. Ion milling is a real universal and
promising polishing method for EBSD preparation of
almost all materials.
2) There exists a maximum value of indexed points
as a function of step size. The optimum step size depends
on the magnification and the board resolution/electronic
step size.
3) Grains/subgrains and texture, and grain boundary
structure are readily obtained by EBSD.
4) Strain and stored energy may be analyzed by
EBSD.
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чဇࢋ, Jarle HJELEN, Hans J. ROVEN
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থ㸼᭄䞣䖙䗳๲ࡴǄᴀ᭛䆘䗄њ EBSD ⱘ䆩ḋࠊ໛ǃখ᭄Ӭ࣪੠᭄᥂ߚᵤˈ⡍߿ᰃ೼໻ลᗻবᔶ(SPD)ࠊ໛䍙㒚
᱊੠㒇㉇ᴤ᭭ᮍ䴶ⱘᑨ⫼Ǆᘏ㒧њ⬉࣪ᄺᡯ‫ܝ‬ǃѠ⇻࣪⸙ч⎆ᴎẄᡯ‫ܝ‬੠⾏ᄤᴳᡯ‫ܝ‬ㄝ EBSD 䆩ḋࠊ໛ᡔᴃⱘӬ
㔎⚍੠ᅲ⫼খ᭄Ǆ㒧ᵰ㸼ᯢˈ⾏ᄤᴳᡯ‫ܝ‬ᡔᴃᰃϔ乍䗮⫼ⱘǃ޴Т䗖⫼Ѣ᠔᳝ EBSD 䆩ḋⱘ᳝ᬜᡯ‫ܝ‬ᮍ⊩Ǆ䱣ⴔ
EBSD ᠿᦣℹ䭓ⱘব࣪ˈ㢅ḋⱘᷛᅮ⥛ᄬ೼ϔϾᵕ໻ؐǄ᳔Ӭ࣪ⱘ EBSD ᠿᦣℹ䭓প‫އ‬Ѣ䆩ḋ೒⠛ⱘᬒ໻‫ס‬᭄੠
᭄᥂䞛䲚ᵓⱘߚ䕼⥛(៪⬉ᄤℹ䭓)Ǆᇍ᱊㉦੠Ѯ᱊㉦ǃ㒛ᵘ੠᱊⬠㒧ᵘㄝ䖯㸠ߚᵤᰃ EBSD ⱘ෎ᴀࡳ㛑ǄEBSD
гৃᇍลᗻবᔶⱘᑨব੠ᄬ‫ټ‬㛑ㄝ䖯㸠ߚᵤǄ
݇䬂䆡˖⬉ᄤ㚠ᬷᇘᡔᴃ(EBSD)˗䆩ḋࠊ໛˗খ᭄Ӭ࣪˗ᠿᦣℹ䭓˗໻ลᗻবᔶ (SPD)
(Edited by YUAN Sai-qian)

EBSD Sample preparation Mg.pdf

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EBSD Sample preparation Mg.pdf