Heimann Sensor 32 x 32-array thermopile LWIR image sensor with silicon lens 2018 teardown reverse costing report published by System Plus

©2018 SystemPlusConsulting| Heimann Sensor–HTPA32x32 Thermopile 1
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Heimann Sensor HTPA32x32d
32x32 Infrared ThermopileArray Sensor
Imaging report by SylvainHALLEREAU
April 2018

Table of Contents
Overview/ Introduction 4
o ExecutiveSummary
o Reverse CostingMethodology
Company Profil 4
Physical Analysis 16
o Physical AnalysisMethodology
o Package
 PackageViews,Dimensions& Marking
 PackageOpening
o Silicon Lens
 View, Dimensions
 Cross-Section
 Lens coating
o EERPOM Die
o ThermopileDie
 View, Dimensions& Marking
 MEMS Opening
 Cross-Section
 ROIC Characteristics
 ProcessCharacteristics
o Comparison HTPA32x32d- ISC1403L
ManufacturingProcessFlow 78
o Global Overview
o EEPROM Front-End Process
o EEPROM WaferFabrication Unit
o ROIC Front-End Process
o ROIC Wafer Fabrication Unit
o ThermopileFront-End Process
o ThermopileWafer Fabrication Unit
o ThermopileBack-End 0 :Probetest& Dicing
o Silicon Lens Front-End Process
o PackageAssembly Unit
o Back-End:Final test
CostAnalysis 95
o Yields Explanation & Hypotheses
o EEPROM Die
 Front-End Cost
 Wafer & Die Cost
o Silicon Lens
 Front-End Cost
o ThermopileDie
 Front-End Cost
o Component
 Back-End :PackagingCost
 Back-End :Final TestCost
 ComponentCost
Estimated PriceAnalysis 111
o Definition of Prices
o ManufacturerFinancial ratios
o Estimated Manufacturerprice
o Sellingprice100K,500k,1M & 10MUnits
Company services 116

Overview / Introduction
o ExecutiveSummary
o Reverse Costing
Methodology
CompanyProfil & Supply
Chain
Physical Analysis
Manufacturing ProcessFlow
Cost Analysis
Selling PriceAnalysis
About System Plus
• This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and
selling price of the HTPA32x32d from Heimann Sensor.
• The HTPA32x32d is an Infrared Thermopile Array Sensor with a resolution of 32x32 Pixel in a TO39 package. Thank
to the integrated EEPROM and the I²C interface it is very friendly to integrate in a system.
• The framerate can be set internally via the sensor clock and ADC-resolution up to 15 Hz (highest resolution) or up
to 60 Hz (lowest resolution).
• Heimann Sensor offers now low cost solution with cheap silicon lens instead of expensive germanium lens.
• The report includes technology and cost analysis of the HPTA32x32d. These analyses provide the technical
intelligence necessary to understand this technology. Simulations for low volume and high manufacturing volume
are performed in order to estimate the price if the thermopile is largely employed.
• A comparison between the HPTA32x32d, the oldest thermopile from Heimann Sensor and the ISC1403 lower
definition microbolometer from Flir.
ExecutiveSummary

o ExecutiveSummary
o Reverse Costing
Methodology
Chain
Physical Analysis
Cost Analysis
About System Plus
The reverse costinganalysis is conductedin 3 phases:
Teardown
analysis
• Package is analyzed and measured
• The dies are extractedinorder to get overall data: dimensions,main blocks,pad number and pin
out, die marking
• Setupof the manufacturing process.
Costing
analysis
• Setupof the manufacturing environment
• Cost simulationof the process steps
Selling price
analysis
• Supply chainanalysis
• Analysis of the sellingprice
Reverse CostingMethodology

Chain
Physical Analysis
o Summary
o Package
o Silicon Lens
o EEPROM Die
o MEMS Die
Cost Analysis
About System Plus
Package View & Dimensions
PackageTop View – Optical View
9 mm
9mm
• Package: 4-pinTO39
• Dimensions: 9 x 9 x 10.5 mm
PackageSide View – Optical View
PackageBottomView – Optical View
10.5mm
4.5mm
2.49 mm

Chain
Physical Analysis
o Summary
o Package
o Silicon Lens
o EEPROM Die
o MEMS Die
Cost Analysis
About System Plus
Package Opening
Package opening(metal sawn)lets appear 2 dies connectedwithwire bondingand a siliconlens.
The sensor is filledwithN2 inert gas. There is no getter in the case.

Chain
Physical Analysis
o Summary
o Package
o Silicon Lens
o EEPROM Die
o MEMS Die
Cost Analysis
About System Plus
Package Cross-Section1

Chain
Physical Analysis
o Summary
o Package
o Silicon Lens
o EEPROM Die
o MEMS Die
Cost Analysis
About System Plus
ThermopileDie View & Dimensions
XX mm
• Die Area: XX mm²
• Numberof PGDW per X-inchwafer: XX
PGDW: Potential Good Dies per Wafer
Thermopile Overview
XXmm

Chain
Physical Analysis
o Summary
o Package
o Silicon Lens
o EEPROM Die
o MEMS Die
Cost Analysis
About System Plus
Pixel View & Dimensions

Chain
Physical Analysis
o Summary
o Package
o Silicon Lens
o EEPROM Die
o MEMS Die
Cost Analysis
About System Plus
Hot End Thermocouples

Chain
Physical Analysis
o Summary
o Package
o Silicon Lens
o EEPROM Die
o MEMS Die
Cost Analysis
About System Plus
ThermopileCross-Section – Oxide Revelation

Chain
Physical Analysis
o GlobalOverview
o EEPROM Front-End
Process
o ROIC Front-End Process
o ThermopileFront-End
Process
o MEMSBack-End0
o Silicon Lens Front-End
Process
o Packaging Process
Cost Analysis
About System Plus
ThermopileProcess Flow

Chain
Physical Analysis
Cost Analysis
o Economic Hypothesis &
Yields
o EEPROM Wafer & Die
Cost
o Silicon Lens Wafer & Die
Cost
o ThermopileWafer & Die
Cost
o Back-EndCost
o Component Cost
About System Plus
Thermopile Front-End Cost

Chain
Physical Analysis
Cost Analysis
o Economic Hypothesis &
Yields
o EEPROM Wafer & Die
Cost
o Silicon Lens Wafer & Die
Cost
o ThermopileWafer & Die
Cost
o Back-EndCost
o Component Cost
About System Plus
Thermopile Front-End Step Cost

SELLING
P R I C E

Chain
Physical Analysis
Cost Analysis
o FinancialRatios
o Manufacturer Price
o Selling Price
About System Plus
Estimated Manufacturer Price

Company Profil & Supply
Chain
Physical Analysis
Cost Analysis
About System Plus
o Company services
o Feedbacks
o Contact
o Legal
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
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COMPLETE TEARDOWN
WITH:
• Detailedphotos
• Precise
measurements
• Materialsanalysis
• Comparison
betweenHeimann
Sensor and Flir
Microbolometer
• Manufacturing
process flow
• Supply chain
evaluation
• Manufacturing cost
analysis
• Estimatedsales
price
Heimann Sensor 32 x 32-array thermopile LWIR
image sensor with silicon lens
Title: Heimann Sensor
HTPA32x32d
Pages: 121
Date: April 2018
Format: PDF & Excel file
Price: Full report:
EUR 3,490
A small, easy to use, low-power,cheap non-contact
temperature measurement for varying applications
a year, thermopile sensors are cost-competitive compared to micro-
bolometers.
Based on a low-definition, 32 x 32 thermopile sensor, Heimann Sensor’s
HTPA32x32d is dedicated to these markets. Cheaper than a microbolometer
and easier to integrate, the thermopile offers very good performance for
applications that do not require high-resolution imagesanda highframe rate.
The thermopile array sensor consists only of a 0.5cm³ camera (with lens). The
system is made easy for integrators with a digital I²C interface, and includes for
the first time a silicon lens for low-cost applications. The 32 x 32 array sensor
uses a 90µm pixel based on a thermopile technology for a very compact
design.
This report provides a detailed teardown and cost analysis of the thermopile
die, the siliconlens, the EEPROM die, and the packaging.
This report also includes a comparison between the characteristics of the new
and previous versions of the thermopile sensors from Heimann Sensor, and a
comparison with FLIR’s ISC1403 microbolometer. This latter comparison
highlights differences ineachcompany’s technical choices.
Reverse Costing®
Structure,Process& Cost Analysis
LWIR imaging is increasingly used
in myriad applications, from
consumer to industrial. Low-cost,
large arrays (32 x 32 and more)
are specifically adapted to smart
home/smart building applications
for occupant detection, popu-
lation localization, population
counting, fire detection, and
more. For these large markets of
many hundreds of millions units

TABLEOF CONTENTS
Performed byPerformed by
AUTHORS:
MEMS CoSim+
ANALYSIS PERFORMED WITH OUR COSTING TOOLS MEMS COSIM+ AND IC PRICE+
System Plus Consulting offers
powerful costing tools to
evaluate the production cost
and selling price from single
chip to complex structures.
MEMS CoSim+
Cost simulation tool to
evaluate the cost of any
MEMS process or device.
IC Price+
The tool performs the
necessary cost simulation of
any Integrated Circuit: ASICs,
microcontrollers, DSP,
memories, smartpower, and
more.
• Executive Summary
• Reverse CostingMethodology
Company Profile
• Heimann Sensor
Physical Analysis
• Synthesis of the Physical Analysis
• Physical AnalysisMethodology
• Package
 Packageviews,dimensionsand
marking
 Packageopening
• Silicon Lens
 View, dimensions
 Cross-section and lens coating
• EERPOM Die
• ThermopileDie
 View, dimensionsand marking
 Pixels,thermocouples
 Cross-section
 ROIC characteristics
 Process characteristics
Comparison - Heimann Sensor
HTPA32x32d vs. Flir ISC1403L
Manufacturing Process Flow
• Global Overview
• EEPROM Front-End Process and
Wafer Fabrication Unit
• ROIC Front-End Process and Wafer
Fabrication Unit
• ThermopileFront-End Process and
Wafer Fabrication Unit
• ThermopileBack-End 0: Probe Test
and Dicing
• Silicon Lens Front-End Process
• Back-End - Final Test
Cost Analysis
• Synthesis of the CostAnalysis
• Yields Explanation and Hypotheses
 EEPROM die- front-end cost+
Wafer and diecost
 Silicon lens - front-end cost+
Wafer and diecost
 Thermopiledie- front-end cost+
wafer and diecost
• Component
 Back-end - packagingcost
 Back-end - final testcost
 Component cost
Estimated Price Analysis
IC Price+
analyses for Integrated Circuits,
Power semic-onductors and
LEDs. He has significant
experience in the modeling of
manufacturing costs for
electronics components, Sylvain
holds a Master degree in
Microelectronics from the
University of Nantes, France.
Sylvain
Hallereau
Sylvain has been
Project Manager
at System Plus
Consulting since
2000. He is in
charge of costing
Laboratory of System Plus
Consulting. He previously
worked during 25 years in
Atmel Nantes Technological
Analysis Laboratory as fab
support in physical analysis,
and 3 years at Hirex
Engineering in Toulouse, in a
DPA lab.
Yvon LeGoff
(Lab)
Yvon Le Goff has
joi ned System
Plus Consulting
in 2011, in order
to s etu p th e
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MIcrobolometer
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and i3system 3BOL384_17A
Microbolometer
An infrared camera with a
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Infrared camera and electronic
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Pages: 170
Date: September 2017
Full report: EUR 3,490*
Pages: 98 (Sensor) + 105 (System)
Date: June 2017
Pages: 170
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7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without
solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
8. Miscellaneous
All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time,update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due
time.
9. Governing lawand jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract(orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which
shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
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