Texas Instruments’ Time of Flight Image Sensor 2017 teardown reverse costing report published by Yole Developpement

©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 1
21 rue la Noue Bras de Fer
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Texas Instruments OPT8241
Industrial 3D ToF
Imaging report by Stéphane ELISABETH
July 2017

SOMMAIRE
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 6
o Texas Instruments
o Softkinetic PortFolio
o Texas Instruments ToF Solution
o 3D Imaging & Sensing Market
Physical Analysis 13
o Synthesis of the Physical Analysis
o Package 15
 Package Views: Dimensions, Marking, Block Diagram
 Package Opening: RDL, Line/Space Width, Optical Filter
 Package Cross-Section : RDL, Bumps, Optical Filter
o Die 30
 Die View & Dimensions
 Delayering & main Blocs
 Die Process: Transistor, Pixels technology
 Die Cross-Section: Transistor, Metal Layers, Pixels
 Die Process Characteristic
Physical Comparison 44
 Infineon 3D ToF Image Sensor
 STMicroelectronics SPAD technology
 Melexis MLX75023
Manufacturing Process 50
o Synthesis of the main parts
o Image Sensor Die Front-End Process & Fabrication Unit
o Glass BGA Packaging Process Flow
Cost Analysis 57
o Synthesis of the cost analysis
o Yields Explanation & Hypotheses 60
o Image Sensor die 62
 Die Front-End Cost
 Die Wafer Cost
 Die Cost
o Packaging 65
 Packaging Cost
 Packaging Cost per steps
o Component Cost 68
Estimated Manufactured Price 70
Company services 74

Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price
of the Texas Instruments OPT8241.
The OPT8241 3D ToF imager is packaged using Chip-On-Glass (COG) technology. The device comprises a system-on-chip (SoC)
and glass filter in the same component in thin, 0.7 mm-thick, packaging.
This report analyzes the complete component, from the glass near-infrared band-pass filter to the collector based on ToF pixel
licenses developed by Sony/Softkinetic and adapted by Texas Instruments. The report includes a complete cost analysis and
price estimation of the device based on a detailed description of the package, and the ToF imager.
It also features a complete ToF pixel technology comparison with the Infineon/pmd, STMicroelectronics and Melexis
automotive ToF imagers, which are all also based on Sony/Softkinetic technology, with details on the companies’ design
choices.

Chain
Physical Analysis
o Synthesis
o Package
o Package Opening
o Package Cross-Section
o Image Sensor Die
o Image Sensor Cross-Section
Physical Comparison
Cost Analysis
About System Plus
ToF Process Flow

Chain
Physical Analysis
o Synthesis
o Package
o Package Opening
o Image Sensor Die
Physical Comparison
Cost Analysis
About System Plus
Package View & Dimensions

Chain
Physical Analysis
o Synthesis
o Package
o Package Opening
o Image Sensor Die
Physical Comparison
Cost Analysis
About System Plus
Package Cross-Section – RDL

Chain
Physical Analysis
o Synthesis
o Package
o Package Opening
o Image Sensor Die
Physical Comparison
Cost Analysis
About System Plus
Image Sensor Die Dimensions

Chain
Physical Analysis
o Synthesis
o Package
o Package Opening
o Image Sensor Die
Physical Comparison
Cost Analysis
About System Plus
Image Sensor Die – Pixels

Chain
Physical Analysis
o Synthesis
o Package
o Package Opening
o Image Sensor Die
Physical Comparison
Cost Analysis
About System Plus
Image sensor Die Cross-Section – Pixels

Chain
Physical Analysis
Physical Comparison
o Infineon CIS
o STMicro. SPAD
o Melexis MLX75023
Cost Analysis
About System Plus
Comparison With ST ToF Detector using SPAD technology

Chain
Physical Analysis
Physical Comparison
o Synthesis
o Front-End Process &
Fabrication Unit
o Packaging Process Flow
Cost Analysis
About System Plus
Global Overview

Chain
Physical Analysis
Physical Comparison
Cost Analysis
o Synthesis
o Supply Chain
o Yield Hypotheses
o Front-End Cost &
Wafer/Die Cost
o Packaging Cost
o Component Cost
About System Plus
ToF Imager Front-End Cost

Chain
Physical Analysis
Physical Comparison
Cost Analysis
o Synthesis
o Supply Chain
o Yield Hypotheses
o Front-End Cost &
Wafer/Die Cost
o Packaging Cost
o Component Cost
About System Plus
Packaging Cost

Chain
Physical Analysis
Physical Comparison
Cost Analysis
o Synthesis
o Supply Chain
o Yield Hypotheses
o Front-End Cost &
Wafer/Die Cost
o Packaging Cost
o Component Cost
About System Plus
Component Cost

Chain
Physical Analysis
Physical Comparison
Cost Analysis
o Definition of Prices
o Manufacturer Financial
o Manufacturer Price
About System Plus
Estimated Manufacturer Price

Chain
Physical Analysis
Physical Comparison
Cost Analysis
About System Plus
o Company services
o Related reports
o Feedbacks
o Contact
o Legal
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE SÉVELOPPEMENT
IMAGING
• 3D Imaging and Sensing 2017
• Status of the CMOS Image Sensor Industry 2017
• Imaging Technologies for Automotive 2016
• IR LEDS and Lasers - Technology, Applications and Industry Trends
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
IMAGING
• Lenovo Phab2Pro – Google Tango project – Time of Flight
• STMicroelectronics ToF Sensor
• Melexis Automotive 3D ToF Imager

COMPLETE TEARDOWN
WITH:
• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process
flow
• Supply chain evaluation
• Manufacturing cost
analysis
• Estimated sales price
• ToF pixel comparison
with Infineon,
STMicroelectronics, and
the Melexis MLX75023
Texas Instruments’ Time of Flight Image Sensor
for Industrial Applications
Title: Texas Instruments
Industrial ToF Imager
Pages: 79
Date: July 2017
Format: PDF & Excel file
Price: Full report: EUR 3,490
A look into Texas Instruments’ system-on-chip, including Sony/Softkinetic’s
time-of-flight pixel technology, for industrial applications
Sony/Softkinetic has been investigating this technology deeply, providing
a unique pixel technology to several image sensor manufacturers in three
application areas: consumer, automotive and industrial. For industrial
applications, Sony/Softkinetic has licensed its technology to Texas
Instruments, which is providing ToF imagers for human detection or
robot-human interaction.
The OPT8241 3D ToF imager is packaged using Chip-On-Glass (COG)
technology. The device comprises a system-on-chip (SoC) and glass filter in
the same component in thin, 0.7 mm-thick, packaging.
This report analyzes the complete component, from the glass near-infrared
band-pass filter to the collector based on ToF pixel licenses developed by
Sony/Softkinetic and adapted by Texas Instruments. The report includes a
complete cost analysis and price estimation of the device based on a
detailed description of the package, and the ToF imager.
It also features a complete ToF pixel technology comparison with the
Infineon/pmd, STMicroelectronics and Melexis automotive ToF imagers,
which are all also based on Sony/Softkinetic technology, with details on
the companies’ design choices.
Today, Time-of-Flight (ToF)
systems are among the most
innovative technologies offering
imaging companies an
opportunity to lead the market.
Every major player wants to
integrate these devices to provide
functions such as 3D imaging,
proximity sensing, ambient light
sensing and gesture recognition.

TABLE OF CONTENTS
Manufacturing Process
Flow
• Overview
• ToF Imager Front-End
Process
• ToF Imager Wafer
Fabrication Unit
• Packaging Process Flow
• Final Assembly Unit
Cost Analysis
• Cost Analysis Overview
• The Main Steps Used in the
Economic Analysis
• Yield Hypotheses
• ToF Imager Die Cost
 Front-end cost
 Back-end: tests and dicing
 Wafer and die cost
• Component
 Packaging cost
 Packaging cost by process
step
 Component cost
Estimated Price Analysis
Performed byPerformed by
AUTHORS:
3D Package CoSim+
IC Price +
ANALYSIS PERFORMED WITH OUR COSTING TOOLS 3D PACKAGE COSIM+ AND IC PRICE+
System Plus Consulting offers
powerful costing tools to
evaluate the production cost &
selling price from single chip to
complex structures.
IC Price+
The tool performs the necessary
cost simulation of any Integrated
Circuit: ASICs, microcontrollers,
memories, DSP, smartpower…
3D Package Cosim+
Cost simulation tool to evaluate
the cost of any Packaging
process: Wafer-level packaging,
TSV, 3D integration…
Texas Instruments Company
Profile and Time of Flight
Technology
Physical Analysis
• Physical Analysis Methodology
• Package
 View and dimensions
 Package opening
 Package cross-section: optical
filter, RDL, bumps
• Image Die
 View, dimensions and marking
 Die overview: active area, CPAD
technology
 Die delayering, main block ID and
process
 Cross-section: metal layers, pixel
 Process characteristics
ToF Pixel Physical Comparison
with Infineon, STMicroelectronics,
Melexis Automotive ToF Image
Sensor
• Package, Pixels, Filters
Stéphane
Elisabeth
Stéphane has a
deep knowledge
of materials characterizations
and electronics systems. He
holds an Engineering Degree in
Electronics and Numerical
Technology, and a PhD in
Materials for Microelectronics.
analysis. He has a deep
knowledge in chemical and
physical analyses. He previously
worked in microelectronics R&D
for CEA/LETI in Grenoble and for
STMicroelectronics in Crolles.
Nicolas
Radufe (Lab)
N i c o l a s i s i n
charge of physical
Distributed by

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A cutting-edge ToF imager
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Pages: 80
Date: July 2017
Full report: EUR 3,490*
Pages: 113
Date: March 2017
Pages: 170
Date: January 2017
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