STMicroelectronics Proximity & Flood Illuminator in the Apple iPhone X - reverse costing report published by System Plus

©2018 by System Plus Consulting | STMicroelectronics Proximity Sensor & Flood Illuminator 1
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STMicroelectronics Proximity Sensor & Flood Illuminator
Time of Flight & Illumination device from Apple iPhone X
IMAGING report by Stéphane ELISABETH
January 2018 – version 1

Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o STMicroelectronics
o STMicroelectronics Portfolio
o FligthSense Technology
o Supply Chain
o Apple iPhone X Teardown
Physical Analysis 24
o Summary of the Physical Analysis 25
o Package 27
 Package View & Dimensions
 Package Opening:
Overview, Wire Bonding, Flood Illuminator
 Package Cross-Section:
Adhesives, Ceramic Substrate, PCB Substrate, Diffuser, Filters, FOV, Heat Sink
o VCSEL #1 & #2 Die 52
 Die View & Dimensions
 Die Overview & Cavity
 Die Cross-Section
 Die Process Characteristic
o VCSEL Driver Die 84
 Die Overview & Marking
 Die Delayering & main ID Block
o SPAD Detector Die 95
 Die Overview & Marking: Active Area, SPADs
 Die Delayering & main ID Block
Comparison with STMicroelectronics FligthSense PortFolio 120
o Package, Function, FOV, Optical Blocking Package, SPAD Detector & VCSELs, SPADs
Manufacturing Process 127
o SPAD Detector Die Front-End Process & Fabrication Unit.
o VCSEL Drive Die Front-End Process & Fabrication Unit
o VCSELs Die Front-End Process & Fabrication Unit
o OLGA Packaging Process & Fabrication unit
Cost Analysis 144
o Summary of the cost analysis 145
o Yields Explanation & Hypotheses 146
o SPADs Detector & VCSEL Driver die 149
 Die Front-End Cost
 Die Wafer & Die Cost
o VCSELs Die 153
 Die Front-End Cost
 Die Front-End Cost per process steps
 Die Wafer & Die Cost
o Component 159
 Packaging Cost
 Component Cost
Estimated Selling Price 163
Feedbacks 167
Company services 169

Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
o Glossary
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
• This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the
STMicroelectronics Proximity Sensor & Flood Illuminator in Apple iPhone X.
• Located in the front above the main speaker, the proximity sensor & flood illuminator is packaged using optical LGA. The device is a
custom version for Apple. In the past, STMicroelectronics has already release a custom proximity sensor two times smaller (2.80 x
2.40 mm) than the devices in it’s portfolio. This new version came along with a flood illuminator used in the true depth system. The
sensor is still based on FlighSenseTM technology.
• In this report, the complete microsystem is analyzed from the two illumination device which are a Vertical-Cavity Surface-Emitting
Laser (VCSEL) to the collector based on the Single Photon Avalanche Diode (SPAD) developed by STMicroelectronics. The report
includes a complete cost analysis and price estimation of the device based on a detailed description of the package, the ToF detector,
the VCSEL and the other VCSEL for the flood illumination.
• It also features a complete technology comparison with the STMicroelectronics ToF portfolio since the first generation, the VL53L0X
the VL6180X, and the last custom proximity sensor from the Apple iPhone 8.
Executive Summary

Chain
o STMicroelectronics
o Time of Fligth Technology
o Apple iPhone X Teardown
Physical Analysis
Physical Comparison
Cost Analysis
Feedbacks
About System Plus
Apple iPhone X Teardown
Apple iPhone X Opened View
©2018 by System Plus Consulting
NIR Camera Sensor Spectral Sensor
RGB Camera
DOT projector Proximity Sensor
& Flood Illuminator
The NIR Camera Sensor, the RGB
camera and the DOT projector are
together.
The proximity sensor & flood
illuminator is separated to the True
depth system.

Chain
Physical Analysis
o Summary
o Package
o VCSEL #1
o VCSEL #2
o VCSEL Driver
o SPAD Detector
Physical Comparison
Cost Analysis
Feedbacks
About System Plus
Summary of the Physical Analysis

Chain
Physical Analysis
o Summary
o Package
o VCSEL #1
o VCSEL #2
o VCSEL Driver
o SPAD Detector
Physical Comparison
Cost Analysis
Feedbacks
About System Plus
Package Views & Dimensions

Chain
Physical Analysis
o Summary
o Package
o VCSEL #1
o VCSEL #2
o VCSEL Driver
o SPAD Detector
Physical Comparison
Cost Analysis
Feedbacks
About System Plus
Package Opening

Chain
Physical Analysis
o Summary
o Package
o VCSEL #1
o VCSEL #2
o VCSEL Driver
o SPAD Detector
Physical Comparison
Cost Analysis
Feedbacks
About System Plus
Package Cross-Section #1

Chain
Physical Analysis
o Summary
o Package
o VCSEL #1
o VCSEL #2
o VCSEL Driver
o SPAD Detector
Physical Comparison
Cost Analysis
Feedbacks
About System Plus
VCSEL #1 Die Overview

Chain
Physical Analysis
o Summary
o Package
o VCSEL #1
o VCSEL #2
o VCSEL Driver
o SPAD Detector
Physical Comparison
Cost Analysis
Feedbacks
About System Plus
VCSEL #1 Die – Cross-Section

Chain
Physical Analysis
o Summary
o Package
o VCSEL #1
o VCSEL #2
o VCSEL Driver
o SPAD Detector
Physical Comparison
Cost Analysis
Feedbacks
About System Plus
VCSEL #2 Die View and Dimensions

Chain
Physical Analysis
o Summary
o Package
o VCSEL #1
o VCSEL #2
o VCSEL Driver
o SPAD Detector
Physical Comparison
Cost Analysis
Feedbacks
About System Plus
VCSEL #2 Die Cross-Section

Chain
Physical Analysis
o Summary
o Package
o VCSEL #1
o VCSEL #2
o VCSEL Driver
o SPAD Detector
Physical Comparison
Cost Analysis
Feedbacks
About System Plus
VCSEL Driver Die View & Dimensions

Chain
Physical Analysis
o Summary
o Package
o VCSEL #1
o VCSEL #2
o VCSEL Driver
o SPAD Detector
Physical Comparison
Cost Analysis
Feedbacks
About System Plus
SPAD Detector Die View & Dimensions

Chain
Physical Analysis
o Summary
o Package
o VCSEL #1
o VCSEL #2
o VCSEL Driver
o SPAD Detector
Physical Comparison
Cost Analysis
Feedbacks
About System Plus
SPAD Detector Die – SPADs

Chain
Physical Analysis
o Summary
o Package
o VCSEL #1
o VCSEL #2
o VCSEL Driver
o SPAD Detector
Physical Comparison
Cost Analysis
Feedbacks
About System Plus
SPAD Detector Die – Die Cross-Section

Chain
Physical Analysis
Physical Comparison
o Package
o Function
o FOV
o Optical Blocking Package
o SPAD Detector & VCSELs
o SPADs Cells
Cost Analysis
Feedbacks
About System Plus
Comparison with STMicroelectronics Portfolio – Optical Blocking Package

Chain
Physical Analysis
Physical Comparison
o SPAD Detector Process
o SPAD Detector Fab Unit
o VCSEL Driver Process
o VCSEL Driver Fab Unit
o VCSEL #1 Process
o VCSEL #1 Fab Unit
o VCSEL #2 Process Flow
o VCSEL #2 Fab Unit
o Assembly Unit
o Packaging Process Flow
Cost Analysis
Feedbacks
About System Plus
Global Overview

Chain
Physical Analysis
Physical Comparison
o VCSEL #1 Process
o VCSEL #1 Fab Unit
o VCSEL #2 Fab Unit
o Assembly Unit
Cost Analysis
Feedbacks
About System Plus
VCSEL #2 Wafer Process Flow (1/3)

Chain
Physical Analysis
Physical Comparison
o VCSEL #1 Process
o VCSEL #1 Fab Unit
o VCSEL #2 Fab Unit
o Assembly Unit
Cost Analysis
Feedbacks
About System Plus
Assembly Process Flow (1/3)

Chain
Physical Analysis
Physical Comparison
Cost Analysis
o Synthesis
o Supply Chain
o Yield Synthesis
o SPAD Detector FE Cost
o SPAD Detector Wafer & Die
Cost
o VCSEL Driver FE Cost
o VCSEL Driver Wafer & Die
Cost
o VCSEL #1 FE Cost
o VCSEL #1 Wafer & Die Cost
o VCSEL #2 FE Cost
o Packaging Cost
o Component Cost
Feedbacks
About System Plus
SPAD Detector Front-End Cost

Chain
Physical Analysis
Physical Comparison
Cost Analysis
o Synthesis
o Supply Chain
o Yield Synthesis
o SPAD Detector FE Cost
o SPAD Detector Wafer & Die
Cost
o VCSEL Driver FE Cost
o VCSEL Driver Wafer & Die
Cost
o VCSEL #1 FE Cost
o VCSEL #2 FE Cost
o Packaging Cost
o Component Cost
Feedbacks
About System Plus
Component Cost

Chain
Physical Analysis
Physical Comparison
Cost Analysis
o Definition of Prices
o Manufacturer Financial
o Estimated Selling Price
Feedbacks
About System Plus
Proximity Sensor & Flood Illuminator Estimated Selling Price

Chain
Physical Analysis
Physical Comparison
Cost Analysis
Feedbacks
About System Plus
o Company services
o Related reports
o Contact
o Legal
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
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COMPLETE TEARDOWN
WITH:
• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process
flow
• Supply chain evaluation
• Manufacturing cost
analysis
• Estimated sales price
• Comparison with
STMicroelectronics’ ToF
portfolio: Previous
generation VL6180X,
actual VL53L0X, and
last custom product in
Apple’s iPhone 8,
Evolution, from
function to SPADs
STMicroelectronics’ Time of Flight Proximity Sensor &
Flood Illuminator in the Apple iPhone X
Title: STMicroelectronics’
ToF Proximity Sensor &
Flood Illuminator
Pages: 172
Date: January 2018
Format: PDF & Excel file
Price: Full report:
EUR 3,490
A unique combination of STMicroelectronics’ latest proximity sensor, based on single-photon
avalanche diode (SPAD) technology and a VCSEL illuminator, all in Apple’s most advanced handset
custom proximity sensor, one which represents the smallest FlightSenseTM device
in its ToF portfolio. And with the Apple X, STMicroelectronics has gained
significant market share by integrating several of its components (from the NIR
camera to the 3D touch controller), including a new custom version of the
proximity sensor featuring a flood illuminator.
Located in the front above the main speaker, the proximity sensor/flood illuminator
is packaged using optical LGA. The device is unique to Apple. In the past,
STMicroelectronics released a custom proximity sensor two times smaller (2.80 x
2.40 mm) than the devices in its portfolio, based on FlightSenseTM technology. This
new version comes with a flood illuminator used in the True Depth system. The flood
illuminator is an NIR VCSEL with a wide beam that illuminates the face and allows for
nighttime user recognition with the NIR camera. The packaging is specially designed
for the flood illuminator’s heat management.
In this report the complete microsystem is analyzed, from the two illumination
devices (which are vertical-cavity surface-emitting lasers (VCSEL)) to the collector
(based on the SPAD developed by STMicroelectronics). Moreover, a complete cost
analysis and price estimate is presented for the device, based on a detailed
description of the package, the ToF detector, the VCSEL, and the second VCSEL for
flood illumination.
Also featured is a complete technology comparison with STMicroelectronics’ ToF
portfolio since its first generation: the VL53L0X, the VL6180X, and the most recent
custom proximity sensor in the Apple iPhone 8.
Ahead of its competitors, Apple has begun
using 3D sensing. For the iPhone’s 10th
anniversary, Apple integrated this new function
under the name “True Depth sensing”. The
system features a near-infrared (NIR) camera, a
dot projector, and a flood illuminator, along
with a proximity sensor. All modules work
together to form a high-end security solution:
facial recognition. Since the Apple 7,
STMicroelectronics has supplied Apple with a

TABLE OF CONTENTS
Performed by
AUTHORS:
MEMS CoSim+
ANALYSIS PERFORMED WITH OUR COSTING TOOLS MEMS COSIM+ AND IC PRICE+
System Plus Consulting offers
powerful costing tools to
evaluate the production cost
and selling price from single chip
to complex structures.
MEMS CoSim+
Cost simulation tool to evaluate
the cost of any MEMS process or
device.
IC Price+
The tool performs the necessary
cost simulation of any Integrated
Circuit: ASICs, microcontrollers,
DSP, memories, smartpower,
and more.
STMicroelectronics - Company
Profile & Time of Flight (ToF)
Technology
Apple iPhone X Plus - Teardown
Physical Analysis
• Physical Analysis Methodology
• Package
 View and dimensions
 Package opening and wire bonding
process
 Package cross-section: adhesives,
PCB, filters, FOV, diffuser, ceramic
• VCSEL Die
 View and dimensions
 Wire bonding, cavity
 Cross-section
 Process characteristics
• ASIC Die
 View, dimensions and marking
 Die overview - active area, SPADs
technology
 Die delayering, main blocks’ ID and
process
 Cross-section - metal layers, SPADs
 Process characteristics
Dr. Stéphane
Elisabeth
Stéphane has a deep
k n o w l e d g e o f
materials characte-
r i z a t i o n s a n d
electronics systems.
He holds an Engineering Degree in
Electronics and Numerical
Technology, and a PhD in Materials
for Microelectronics.
Physical Comparison with Apple’s
iPhone 8, the VL53L0X, and the
VL6180X
• Package, Functions, FOV, Optical
Blocking Package, ASIC & VCSEL,
SPADs
• Overview
• ASIC and VCSELs Front-End Process
• ASIC and VCSELs Wafer Fabrication
Unit
• Packaging Process Flow
• Final Assembly Unit
Cost Analysis
• Cost Analysis Synthesis
• Economic Analysis - Main Steps Used
• Yield Hypotheses
• ASIC & VCSEL Die Cost
 Front-end cost
 Back-end - tests and dicing
 Wafer and die cost
• Component
 Packaging cost
 Packaging cost per process steps
 Component cost
Estimated Price Analysis
IC Price+
Sylvain Hallereau
Sylvain is in charge of
costing analyses for IC,
power and MEMS. He
has more than 10
years of experience in
power device manufacturing cost
analysis.
He previously worked for 25
years at Atmel Nantes
Technological Analysis Laboratory
and for three years at Hirex
Engineering in Toulouse.
Yvon Le Goff
(Lab)
Yvon has joined
System Plus
Consulting in 2011 to
setup its laboratory.
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Performed by
Apple iPhone X
Infrared Dot Projector
STMicroelectronics’ Near
Infrared Camera Sensor in
the Apple iPhone X
STMicroelectronics Time
of Flight Proximity Sensor
in the Apple iPhone 7 Plus
The world’s most advanced dot
projector for 3D sensing with four
innovative parts: Its package; a
dedicated VCSEL; a folded optic; and
the active DOE.
The first NIR camera sensor with
multiple innovations based on
imager-silicon-on-insulator sub-
strate from SOITEC, supplied and
produced by STMicroelectronics for
the Apple True Depth Module.
A look inside the Single Photon
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be guaranteed to be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the
liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of
any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in
article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the
orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down
payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take
reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that
any Product will be free from infection.
5. Force majeure
The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties,
equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.
6. Protection of the Seller’s IPR
6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the
Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as:
- Information storage and retrieval systems;
- Recordings and re-transmittals over any network (including any local area network);
- Use in any timesharing, service bureau, bulletin board or similar arrangement or public display;
- Posting any Product to any other online service (including bulletin boards or the Internet);
- Licensing, leasing, selling, offering for sale or assigning the Product.
6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall
personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the
copyrights and will guaranty that the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a
maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company,
the joint venture done with a third party etc..cannot access the report and should pay a full license price.
7. Termination
7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such
delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without
solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
8. Miscellaneous
All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due
time.
9. Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which
shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
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