![5
ZA1 Series
[Actual Size]
ZA8 Series
[Actual Size]
1,00 mm pitch with
up to 1,024 contacts
per square inch
Fastener options
0,80 mm pitch with
up to 1,200 contacts
per square inch
Ultra low profile
1,00 mm body height
Adhesive-bonded cover film
Etched Ni & Au plated contacts
Adhesive-bonded formed BeCu
Cu plated through-hole in PCB core
Dual compression
contact system
Single compression
with solder balls
save PCB real estate • reduce cost • eliminate reworks & scrap • gain design flexibility
MODULARIZATION WITH Z-RAY™](https://image.slidesharecdn.com/47edc6ea-ef7e-4049-9d19-0447e608384f-150209140845-conversion-gate01/85/IC2B_Solutions_Guide-5-320.jpg)
![10
DESIGN RULES & GUIDELINES
Samtec Microelectronics Group has an extensive offering of advanced package design and assembly capabilities as well as the
ability to assist in choosing the best technology and materials for your specific application.
In addition to substrate and package design, flip chip, die attach, wirebond and sealing, our capabilities also include thermal
management, wafer dicing, lid attach and marking.
The following dimensions are designed to help release product to manufacturing as quickly as possible. Please contact Samtec
Microelectronics Group at SME@samtec.com if you have tighter requirements.
ADVANCED DESIGN + ASSEMBLY CAPABILITIES
Flip Chip
PACKAGE SIZE
Smallest size (approx.): 10 mm x 10 mm
Largest size (approx.): 63 mm x 63 mm
SOLDER BALL MATERIAL TYPE
Eutectic Pb:Sn = 37:63
Pb-Free
SUBSTRATE BGA SOLDER BALL SIZE
Smallest (approx.): 0.018" diameter
Largest (approx.): 0.025" diameter
FLUX
TacFlux–025 & WS–609
Other no-clean flux-types, water soluble flux-types
SUBSTRATE BGA PAD PITCH
Closest pitch (approx.):
0,80 mm x 0,80 mm
Furthest pitch: no constraint
Any configuration of the pad
layout is acceptable
Basic guidelines for laying out flip chip substrates including pad design rules, package sizes, solder ball specs, flux, pad pitch and
layout, and general structure:
LAYER THICKNESS (TYPICAL)
Location Standard (µm) Custom (µm)
Core Substrate 800 400*
Core Cu 25 21
Build Up Cu 14.5 2
Insulation Layer 33 12
Solder Resist Layer 21 18
Nickel Plating 3 ~ 7
Gold Plating 0.03 ~ 0.12
No. of Build Up Layers: 1, 2, 3, 4 per side; No. of Core Layers: 2, 4
*Coreless also available
SPECIFICATIONS (TYPICAL)
Item Standard (µm) Custom (µm)
A Flip Chip Pad Dia.
(Solder Resist Opening)
100 75
B Flip Chip Pad Metal
Land Diameter
145 100
C Flip Chip Pad Pitch 225 130
D Solder Bump Height 32 +/- 5
Cu Plating Ni Plating Au Plating Solder Bump
(Pb:Sn = 37:63)
Cu Plating Ni Plating Au Plating PTH
Solder Resist
2nd Build Up
1st Build Up
Core Substrate (BT Resin)
1st Build Up
2nd Build Up
Solder Resist
[FRONT]
[BACK]
TYPICAL SUBSTRATE STRUCTURE
D
C
B
A
Solder Bump
Solder Resist
Filled Via
FLIP CHIP PAD DESIGN RULE](https://image.slidesharecdn.com/47edc6ea-ef7e-4049-9d19-0447e608384f-150209140845-conversion-gate01/85/IC2B_Solutions_Guide-10-320.jpg)
IC2B_Solutions_Guide
- 1. JANUARY 2015 CAPABILITIES + DESIGN SOLUTIONS GUIDE IC-TO-BOARD
- 2. 2 Advanced IC Packaging FLIP CHIP AND UNDERFILL DAM AND ENCAPSULATION FINE PITCH WIREBOND PRECISION DIE ATTACH Micro Interposers PROFILE AND PITCH FLEXIBILITY ULTRA HIGH DENSITY TERMINATION FLEXIBILITY ULTRA LOW PROFILE Samtec combines Advanced IC Packaging and Ultra Micro Interposer technologies to achieve optimized interconnect paths - from the bare die to an interface 100 meters away, and all insertion points in between - with expertise in: –– Package and substrate design –– System modeling and prototyping –– Assembly and electrical testing of finished goods –– Ultra low profile, high density and dual compression contact micro interposers –– Advanced IC packaging, including die attach, wirebond, flip chip, dam and encapsulation, and micro optics Samtec offers end-to-end signal integrity support including full channel analysis, high data rate simulations, break out routing and application assistance. Visit SamtecMicroelectronics.com or contact the Microelectronics Group at SME@samtec.com. END-TO-END SYSTEM DESIGN + CAPABILITIES ADVANCED IC PACKAGING + MICRO INTERPOSERS STREAMLINED INTERCONNECT PATH
- 4. 4 4 MICRO INTERPOSERS Samtec’s Z-Ray™ micro array interposers are ultra low profile, ultra high density, and highly customizable solutions ideal for complex IC-to-Board applications. –– Ultra low profile, high density arrays, with BeCu micro-formed contacts on 0,80 mm and 1,00 mm pitches –– Ultra flexible, with a variety of standard and custom configurations, including dual compression, solder ball, and an array of sizes and shapes –– Assembled into rugged low profile FR4 substrate under high pressure and temperature –– Choice of fastener options, including application specific designs, screw downs, quick install (easy on/off) and thermal spreaders Contact zray@samtec.com for more information. END-TO-END SYSTEM DESIGN + CAPABILITIES STANDARD & CUSTOM Z-RAY™ MICRO INTERPOSER CAPABILITIES Series ZA8 ZA1 Capabilities Pitch 0,80 mm 1,00 mm > 0,65 mm Stack Height 1,00 mm 0,50 mm to 4,00 mm Total I/Os 100 - 400 1,000+ Ruggedizing Screw Down Holes, Alignment Holes Latches, Thermal Spreaders, Quick-Release Spring Constraints Construction Single Layer FR4 Multi-layer FR4 (e.g., Pitch Spreaders) Terminations Dual Compression, Compression + Solder Ball TM Z-Ray™ Ultra Low Profile Interposers ULTRA HIGH DENSITY Choice of 0,80 or 1,00 mm pitch grid ZA8 Series for up to 1,200 contacts / in2 ZA1 Series for up to 1,024 contacts / in2 ULTRA LOW PROFILE One piece design Low profile 1,00 mm body height Low 25 g of normal force with .008" (0,20 mm) contact deflection ULTRA FLEXIBLE Customer-specific stack heights, pin counts, pitches, shapes and plating thicknesses Alignment and fastener options Customizable in X-Y-Z axes Quick-turn customizations with minimal NRE and tooling charges Also Available & In Development ULTRA HIGH DENSITY Z-Ray™ on 0,635 mm pitch and 1000+ I/Os in development MULTI-LAYER SYSTEM Pitch spreaders and other embedded interconnect circuitry MICRO COAX CABLES 34 AWG micro twinax cable on 0,80 mm pitch, 8 and 16 pairs standard
- 5. 5 ZA1 Series [Actual Size] ZA8 Series [Actual Size] 1,00 mm pitch with up to 1,024 contacts per square inch Fastener options 0,80 mm pitch with up to 1,200 contacts per square inch Ultra low profile 1,00 mm body height Adhesive-bonded cover film Etched Ni & Au plated contacts Adhesive-bonded formed BeCu Cu plated through-hole in PCB core Dual compression contact system Single compression with solder balls save PCB real estate • reduce cost • eliminate reworks & scrap • gain design flexibility MODULARIZATION WITH Z-RAY™
- 6. 6 ADVANCED IC PACKAGING Samtec Microelectronics Group is positioned to provide you with complete signal chain support - from custom package and substrate design, to connector and cable selection, through signal integrity testing and debug of your full system - helping you ensure an optimized signal path. –– Advanced IC package and substrate design –– Flip chip, die attach, wirebond, dam, encapsulation and lid attach –– Modeling and prototyping –– Testing and debug –– In-house optical engine design, manufacturing and packaging Samtec’s worldwide Signal Integrity Group is dedicated to helping you determine and implement the most streamlined signal path possible, with support including full channel analysis, high data rate simulation, break out region design and routing, interconnect selection and application assistance. Visit SamtecMicroelectronics.com for more information, or contact the Microelectronics or Signal Integrity Groups directly at SME@samtec.com or SIG@samtec.com. DESIGN, MANUFACTURING AND SUPPORT Complex Package Assembly FLIP CHIP & UNDERFILL PRECISION DIE ATTACH FINE PITCH & LOW PROFILE WIREBOND DAM, ENCAPSULATION & LID ATTACH
- 7. Full signal chain support Interposer integration Flip chip & underfill Fine pitch and low profile wirebond Precision die attach PCB design with signal integrity support Dam, encapsulation and lid attach Custom package design & assembly MICRO OPTICS DESIGN & PACKAGING on-board & mid-board engines • high speed micro flyover • future-proof & equalized copper • optics@samtec.com Engine miniaturization
- 8. 8 INDUSTRY-SPECIFIC APPLICATIONS Samtec Microelectronics Group is positioned to support many industry-specific IC packaging applications. We provide leading-edge technologies and on-going development to ensure we are on the forefront of advanced IC packaging design and manufacturing. Our manufacturing facility in Colorado Springs, Colorado, supports all areas of advanced IC packaging design, assembly, testing and manufacturing. Our technologies are supported by a reliable and accessible manufacturing infrastructure, along with full in-house signal integrity and system support. Samtec adheres to a number of industry standard certifications and practices, including: –– TS 16949 –– ISO 9001 –– ISO/TS Quality Manual –– Environmental Compliance (RoHS) –– MIL-STD-883 –– ITAR Regulation Compliance Visit SamtecMicroelectronics.com for more information, or contact the Microelectronics or Signal Integrity Groups directly at SME@samtec.com or SIG@samtec.com. LEADING-EDGE TECHNOLOGIES + CONTINUOUS INNOVATION MEDICAL & HEALTHCARE Technologies / Capabilities –– MEMs –– Image packaging –– Custom IC package design –– Stacked and custom die –– Chip-scale interconnects End Products –– Neuromodulation –– Implantable pressure sensors –– Surgical assistance robotics –– Endoscopes –– Ultrasound –– DNA and blood analyzers –– Control devices –– Ventilators –– Implantable devices –– Diagnostic meters –– Patient monitoring –– Heart rate and fitness monitoring –– Optical 3D surface scanners –– ECG, portable ECG and EEG
- 9. 9 AVIONICS & DEFENSE Technologies / Capabilities –– Compliant to MIL-STD-883 –– ITAR Compliant –– Tin-only and Tin-Lead –– Custom design and assembly End Products –– PAA (Phased Array Antenna) –– Missile control –– Data converters –– Avionic pressure sensors –– Hermetic package assemblies –– Laser modules –– Digital signal processors –– Microcontrollers –– Power management –– Analog to digital converters –– FIFOs –– Autonomous vehicle modules Technologies / Capabilities –– Micro footprint –– Flip chip, MEMs, BGA –– Thermal management –– Custom design and assembly –– Optics packaging End Products –– Geophone seismic sensors –– Downhole sensor assemblies –– Communications –– Automotive –– Optical assemblies –– Smart grid and energy –– Test and measurement –– Digital storage –– Automation –– Motor drive and control –– Servers OIL, INDUSTRIAL & COMMERCIAL
- 10. 10 DESIGN RULES & GUIDELINES Samtec Microelectronics Group has an extensive offering of advanced package design and assembly capabilities as well as the ability to assist in choosing the best technology and materials for your specific application. In addition to substrate and package design, flip chip, die attach, wirebond and sealing, our capabilities also include thermal management, wafer dicing, lid attach and marking. The following dimensions are designed to help release product to manufacturing as quickly as possible. Please contact Samtec Microelectronics Group at SME@samtec.com if you have tighter requirements. ADVANCED DESIGN + ASSEMBLY CAPABILITIES Flip Chip PACKAGE SIZE Smallest size (approx.): 10 mm x 10 mm Largest size (approx.): 63 mm x 63 mm SOLDER BALL MATERIAL TYPE Eutectic Pb:Sn = 37:63 Pb-Free SUBSTRATE BGA SOLDER BALL SIZE Smallest (approx.): 0.018" diameter Largest (approx.): 0.025" diameter FLUX TacFlux–025 & WS–609 Other no-clean flux-types, water soluble flux-types SUBSTRATE BGA PAD PITCH Closest pitch (approx.): 0,80 mm x 0,80 mm Furthest pitch: no constraint Any configuration of the pad layout is acceptable Basic guidelines for laying out flip chip substrates including pad design rules, package sizes, solder ball specs, flux, pad pitch and layout, and general structure: LAYER THICKNESS (TYPICAL) Location Standard (µm) Custom (µm) Core Substrate 800 400* Core Cu 25 21 Build Up Cu 14.5 2 Insulation Layer 33 12 Solder Resist Layer 21 18 Nickel Plating 3 ~ 7 Gold Plating 0.03 ~ 0.12 No. of Build Up Layers: 1, 2, 3, 4 per side; No. of Core Layers: 2, 4 *Coreless also available SPECIFICATIONS (TYPICAL) Item Standard (µm) Custom (µm) A Flip Chip Pad Dia. (Solder Resist Opening) 100 75 B Flip Chip Pad Metal Land Diameter 145 100 C Flip Chip Pad Pitch 225 130 D Solder Bump Height 32 +/- 5 Cu Plating Ni Plating Au Plating Solder Bump (Pb:Sn = 37:63) Cu Plating Ni Plating Au Plating PTH Solder Resist 2nd Build Up 1st Build Up Core Substrate (BT Resin) 1st Build Up 2nd Build Up Solder Resist [FRONT] [BACK] TYPICAL SUBSTRATE STRUCTURE D C B A Solder Bump Solder Resist Filled Via FLIP CHIP PAD DESIGN RULE
- 11. 11 A B C TOP DOWN DIE ATTACH REQUIREMENTS Description Organic (min) Inches (µm) Ceramic (min) Inches (µm) Minimum Die Size 0.010" (250) 0.010" (250) A Overlap of Die Attach Ground Plane to Die Edge 0.020" (500) 0.020" (500) B Space Between Die Attach Ground Plane to Wirebond Pad 0.020" (500) 0.020" (500) C Space Between Fiducial Edge to Die Attach Ground Plane Edge 0.010" (250) 0.006" (150) Die Attach –– Maximum length to width ratio for components: 5:1 –– Saw kerfs must be at least 25μm and into the dicing tape (through the entire wafer thickness) –– Die attach materials can be non-conductive, conductive, die-attach-films (DAF) and solder preforms; other processes can be discussed per customer requirements –– Minimum distance between surrounding square of fiducial and neighboring objects must be 0,048 mm –– Gray level contrast between background and fiducial must be a minimum of 100 gray levels out of 256 –– Background of fiducial must not have a structure & background must be single-colored gray level –– Maximum die size for dipping: 50 mm x 50 mm –– No waffle-pack handling for die < 1 mm2 Plating and layout requirements for substrate pad design as well as wire parameters: –– Wedge Bond: ENIG plating is acceptable; typical wire types are Al, Au and Pt –– Ball Bond: ENEPIG plating is recommended; typical wire types are Au and Cu Processes that use Au ball bond, require Gold plate per MIL-G–45204, Type III, Grade A, Class 1: –– 99.9% purity minimum –– < 90 Knoop hardness –– 50μ" thick, minimum Wirebond WIREBOND DESIGN RULES Rule Description Organic (min) Inches (µm) Ceramic (min) Inches (µm) A Wirebond Pad 0.004" (100) 0.003" (75) B Wirebond Pad Pitch 0.008" (200) 0.006" (150) C Overlap of Wirebond Lead Edge to Via 0.008" (200) 0.007" (175) D Space Solder Mask to Wirebond Lead Edge 0.004" (100) - E Overlap of Wirebond Lead Edge to Solder Mask 0.008" (200) - F Space of Die Edge to Wirebond Lead Edge* 0.015" (375) or 2x Die Thickness (whichever is greater) G Maximum Wire Length 0.250" (6350) H Maximum Wire Height 0.100" (2540) *Assumes no ground plane for die attach SUBSTRATE DIE H G F E D B A C SIDE PROFILE SUBSTRATE DIE H G F E D B A C TOP DOWN Dam & Encapsulation –– Maximum encapsulation thickness (board surface to top of encapsulation): 0.024" (600) –– Automated dispense tool heated work area: 12" x 16" –– Total work area: 20" x 30" –– Machine positioning accuracy and repeatability: +/- 0.001" SUBSTRATE DIE E DC B A TOP DOWN PACKAGE ENCAPSULATION RULES Rule Description Organic (min) Inches (µm) A Dam Width 0.012" (300) B Space of Dam to Wirebond Lead Edge 0.012" (300) C Space of Fiducial to Dam* 0.007" (175) D Overlap of Encapsulation to Top of Wirebond Loop 0.007" (175) E Height of Encapsulation** = A / 2 *Must be outside encapsulated region **Board surface to top of encapsulation SUBSTRATE DIE E DC B A SIDE PROFILE
- 12. SAMTEC USA P.O. Box 1147 • New Albany, IN 47151-1147 USA +1-800-SAMTEC-9 (USA & Canada) • Tel: +1-812-944-6733 • Fax: +1-812-948-5047 • Email: info@samtec.com SAMTEC NORTHERN CALIFORNIA 2323 Owen St., Ste 120 • Santa Clara, CA 95054 +1-800-726-8329 (USA & Canada) • Tel: +1-812-944-6733 • Fax: +1-408-217-5171 • Email: samtecsiliconvalley@samtec.com SAMTEC SOUTHERN CALIFORNIA 5410 Trabuco Road • Suite 120 • Irvine, CA 92620 Tel: +1-800-726-8329 • Email: samtecsoutherncalifornia@samtec.com SAMTEC SOUTH AMERICA Rua Alagoas Nr 1460 • Sala 805 • Bairro Savassi • Belo Horizonte - Minas Gerais 30130-160 • Brazil Tel: +55 31 3786 3227 • Fax: +55 31 3786 3229 • Email: brazilsales@samtec.com SAMTEC UNITED KINGDOM 11 Mollins Court • Westfield, Cumbernauld • Scotland G68 9HP Tel: +44 01236 739292 • Fax: +44 01236 727113 • Email: scotland@samtec.com SAMTEC GERMANY Streiflacher Str. 7 • 82110 Germering • Germany • +0800 SAMTEC9 (+0800 / 72 68 329) Germany only Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 • Email: germany@samtec.com SAMTEC FRANCE Val d’ Europe Park • 11, rue du Courtalin - Bâtiment B • 77700 Magny le Hongre • France Tel: +33 1 60 95 06 60 • Fax: +33 1 60 95 06 61 • Email: france@samtec.com SAMTEC ITALY Via Colleoni 25 • Centro Direzionale Colleoni • Palazzo Pegaso Ingresso 3 • 20864 Agrate Brianza-Monza Brianza (MB) • Italy Tel: +39 039 6890337 • Fax: +39 039 6890315 • Email: italy@samtec.com SAMTEC NORDIC/BALTIC Solkraftsvägen 25 • 13570 Stockholm • Sweden Tel: +46 8 4477280 • Fax: +46 8 7420413 • Email: scandinavia@samtec.com SAMTEC BENELUX 11 Mollins Court • Westfield, Cumbernauld • Scotland G68 9HP Tel: +44 01236 739292 • Fax: +44 01236 727113 • Email: benelux@samtec.com SAMTEC ISRAEL 21 Bar-Kochva St. • Concord Tower • B'nei Brak, Israel 51260 Tel: +972 3 7526600 • Fax: +972 3 7526690 • Email: israel@samtec.com SAMTEC INDIA #11, 2nd Floor, Chetana, Dattatreya Road • Basavanagudi • Bangalore • 560 004 India Tel: +91 80 3272 1612 • Fax: +91 80 2662 0967 • Email: india@samtec.com SAMTEC ANZ 2A San Antonio Court • Mentone 3194 • Victoria, Australia Tel: +613 9580 0683 • Fax: +613 9580 0684 • Email: australia@samtec.com SAMTEC SINGAPORE 1 Kallang Sector #05-01/02 • Kolam Ayer Industrial Park • Singapore 349276 Tel: +65 6745 5955 • Fax: +65 6841 1502 • Email: singapore@samtec.com SAMTEC JAPAN Nisso No. 16 Bldg. • 3-8-8, Shinyokohama, Kohoku-ku • Yokohama-shi, Kanagawa 222-0033 Japan Tel: +81 45 475 1385 • Fax: +81 45 475 1340 • Email: japan@samtec.com SAMTEC SHANGHAI Unit 601, Qilai Building • No 889 Yishan Road • Shanghai, China 200233 Tel: +86 21 6083 3766 • Fax: +86 21 5423 4575 • Email: china@samtec.com SAMTEC SHENZHEN Rm 906B 9/F New World Center Tower • Yi Tian Road, Fu Tian District • Shenzhen, China 518026 Tel: +86 755 83776780 • Fax: +86 755 83776767 • Email: hongkong@samtec.com SAMTEC TAIWAN 10F, No. 182, Sec. 2 • Dunhua S. Rd. • Da-an District • Taipei City 10669 • Taiwan (R.O.C.) Tel: 00801 14 9916 (Taiwan only) • Tel: +886 2 2735 6109 • Fax: +886 2 2735 5036 • Email: taiwan@samtec.com SAMTEC HONG KONG Room 18, 13/F, Shatin Galleria • 18-24 Shan Mei Street • Fo Tan, Shatin, Hong Kong Tel: +852 26904858 • Fax: +852 26904842 • Email: hongkong@samtec.com SAMTEC KOREA RM#758, Sungwoo Starwoos Officetel Gumi-dong • Seongnam Si, Bundang-gu, Gyeonggi-Do • 463-860 South Korea Tel: +82 31 717 5685 • Fax: +82 31 717 5681 • Email: korea@samtec.com SAMTEC ONLINE www.samtec.com ISO-9001 and/or TS 16949 Certified 141125