Intel Core i7
Download as PPT, PDF1 like903 views
The document provides an overview of Intel's microarchitectures, focusing on the Core i7 processors which utilize a 45nm fabrication process, featuring enhancements like Turbo Boost technology, improved cache latency, and a new chipset architecture facilitating higher data throughput. It highlights key aspects such as quad-core technology, hyper-threading capabilities, and optimized performance for multiprocessor systems using the Quick Path Interconnect (QPI). Additionally, it discusses the importance of chipsets in connecting components within a computer system and mentions the advancements in power efficiency and memory speed with DDR3 RAM.
Intel Core i7
- 1. .
- 2. INDEX Introduction Basics Features Chipset Asus Rampage-2 Internal Representation of core i7 Intel processors ratings Compare i3,i5 & i7 Conclusion 2
- 3. INTRODUCTION The Intel Penryn micro architecture, which included the Core 2 family of processors, was the first mainstream Intel microarchitecture based on the 45nm fabrication process. This allowed Intel to create higher-performance processors that consumed similar or less power than previous-generation processors. The Intel Nehalem microarchitecture that encompasses the Core i7 class of processors uses a 45nm fabrication process for different processors in the Core i7 family. Besides using the power consumption benefits of 45nm, Intel made some dramatic changes in the Nehalem microarchitecture to offer new features and capabilities in the Core i7 family of processors. 3
- 4. BASICS A quad core processor consists of four cores. Quad core technology is a type of technology that includes two separate dual-core dies, where dual-core means a CPU that includes two complete execution cores per physical processor, installed together in one CPU package. In this setup cores 1 and 2 would share a memory cache, and core 3 and 4 another cache. Communication between core 1 and 2 and core 3 and 4 using QPI(Quick Path Interconnect) In computer architecture, 64-bit integers, memory addresses, or other data units are those that are at most 64 bits (8 octets) wide. Also, 64-bit CPU and ALU architectures are those that are based on registers, address buses, or data buses of that size. 4
- 5. FEATURES 1. New Platform Architecture 5
- 6. The previous Intel microarchitectures for a single processor system included three discrete components: a CPU; a Graphics and Memory Controller Hub (GMCH), also known as the Northbridge(a very high speed devices); and an I/O Controller Hub (ICH), also known as the Southbridge. The GMCH and ICH combined are referred to as the chipset. In the older Penryn architecture, the front-side bus (FSB) was the interface for exchanging data between the CPU and the Northbridge. If the CPU had to read or write data into system memory or over the PCI Express bus, then the data had to traverse over the external FSB. In the new Nehalem microarchitecture, Intel moved the memory controller and PCI Express controller from the Northbridge onto the CPU die, reducing the number of external data bus that the data had to traverse. These changes help increase data-throughput and reduce the latency for memory and PCI Express data transactions. These improvements make the Core i7 family of processors ideal for test and measurement applications such as high-speed design validation and high-speed data record and playback. 6
- 7. 2. Higher-Performance Multiprocessor Systems with QPI 7
- 8. 8 Not only was the memory controller moved to the CPU for Nehalem processors, Intel also introduced a distributed shared memory architecture using Intel Quick Path Interconnect (QPI). QPI is the new point-to-point interconnect for connecting a CPU to either a chipset or another CPU. It provides up to 25.6 GB/s of total bidirectional data throughput per link. Intel’s decision to move the memory controller in the CPU and introduce the new QPI data bus has had an impact for single-processor systems. However, this impact is much more significant for multiprocessor systems. Nehalem-based multiprocessor system each CPU has access to local memory but they also can access memory that is local to other CPUs via QPI transactions. For example, one Core i7 processor can access the memory region local to another processor through QPI either with one direct hop or through multiple hops.
- 9. 3. CPU Performance Boost via Intel Turbo Boost Technology 9
- 10. Clock Speed 1.2 GHz (slowest) & 3.5 Ghz (fastest) or 3.9GHz via Turbo Boost Technology. To provide a performance boost for lightly threaded applications and to also optimize the processor power consumption, Intel introduced a new feature called Intel Turbo Boost. Intel Turbo Boost is an innovative feature that automatically allows active processor cores to run faster than the base operating frequency when certain conditions are met. Intel Turbo Boost is activated when the OS requests the highest processor performance state. The maximum frequency of the specific processing core on the Core i7 processor is dependent on the number of active cores, and the amount of time the processor spends in the Turbo Boost state depends on the workload and operating environment. 10
- 11. 4. Improved Cache Latency with Smart L3 Cache 11
- 12. 32 KB L1 instruction and 32 KB L1 data cache per core. 256 KB L2 cache (combined instruction and data) per core. 8 MB L3 (combined instruction and data) shared by all cores. Cache is a block of high-speed memory for temporary data storage located on the same silicon die as the CPU. If a single processing core, in a multicore CPU, requires specific data while executing an instruction set, it first searches for the data in its local caches (L1 and L2). If the data is not available, also known as a cache-miss, it then accesses the larger L3 cache. In an exclusive L3 cache, if that attempt is unsuccessful, then the core performs cache snooping – searches the local caches of other cores – to check whether they have data that it needs. If this attempt also results in a cache-miss, it then accesses the slower system RAM for that information. The latency of reading and writing from the cache is much lower than that from the system RAM, therefore a smarter and larger cache greatly helps in improving processor performance. 12
- 13. 5. Optimized Multithreaded Performance through Hyper- Threading Each of the four cores can process up to two threads simultaneously, so the processor appears to the OS as eight CPUs. Hyper-threading (officially termed Hyper-Threading Technology or HTT) is an Intel technology used to improve parallelization of computations performed on PC microprocessors. 13
- 14. Intel introduced Hyper-Threading Technology on its processors in 2002. Hyper- threading exposes a single physical processing core as two logical cores to allow them to share resources between execution threads and therefore increase the system efficiency. Because of the lack of OSs that could clearly differentiate between logical and physical processing cores, Intel removed this feature when it introduced multicore CPUs. With the release of OSs such as Windows Vista and Windows 7, which are fully aware of the differences between logical and physical core, Intel brought back the hyper-threading feature in the Core i7 family of processors. Hyper-Threading Technology benefits from larger caches and increased memory bandwidth of the Core i7 processors, delivering greater throughput and responsiveness for multithreaded applications. Hyper-threading allows simultaneous execution of two execution threads on the same physical CPU core. 14
- 15. 6. Higher Data-Throughput via PCI Express 2.0 and DDR3 Memory Interface 15
- 16. The new processors feature the PCI Express 2.0 data bus, which doubles the data throughput from PCI Express 1.0. The memory is directly connected to the processor. Three channel memory: each channel can support one or two DDR3 RAM’s. Motherboards for Core i7 have four or six RAM slots. DDR3 RAM (double-data-rate three random access memory ) is a random access memory technology used for high speed storage of the working data in the computer. The benefit of DDR3 is the ability to run its I/O bus at four times the speed of the memory cells it contains, thus enabling faster bus speeds and higher peak throughput than earlier memory technologies. The DDR3 standard allows for chip capacities of 512 megabits to 8 gigabits, effectively enabling a maximum memory module size of 16 gigabytes. There is a significant reduction in power consumption. It needs only 1.5V compared to 1.8V for DDR2. 16
- 17. 7. SOCKET A cpu socket or processor socket providing both power and offering a way to transfer data from the processor to the rest of the PC. 17
- 18. The core i7 uses an LGA1366(Socket B) and is incompatible with the previous versions LGA stands for land grid array and consists of a socket with pins on which the processor is placed. PGA, on the other hand, places the pins on the processor, which are then inserted in a socket with appropriately placed holes. Intel uses the former while AMD uses the latter. Intel supposedly decided to switch to an LGA socket because it provides a larger contact point, allowing, for example, higher clock frequencies. The LGA setup provides higher pin densities, allowing more power contacts and thus a more stable power supply to the chip. Intel gives its LGA sockets names based on the number of pins. LGA 1366, for example, has 1366 individual pins on the socket. 18
- 19. 8. Processor thermal solution using ATS heat sink
- 20. In electronic systems, a heat sink is a passive heat exchanger that cools a device by dissipating heat into the surrounding medium. In computers, heat sinks are used to cool central processing units or graphics processors The processor has a Thermal Design Power of 130W and will slow itself down if the power is exceeded. The Thermal Design Power (TDP) (sometimes called Thermal Design Point) represents the maximum amount of power the cooling system in a computer is required to dissipate The cost per piece is Rs. 47,000 in lots of 1000 units. 20
- 21. CHIPSET 21
- 22. A chipset is a group of integrated circuits, or chips, that are designed to work together, and are usually marketed as a single product. In personal computers based on Intel Pentium-class microprocessors, the term often refers to a specific pair of chips on the motherboard: the northbridge and the southbridge. The northbridge links the CPU to very high-speed devices, especially main memory and graphics controller The southbridge connects to lower-speed peripheral buses (such as PCI or ISA). In many modern chipsets, the southbridge actually contains some on-chip integrated peripherals, such as Ethernet, USB, and audio devices. A chipset is usually designed to work with a specific family of microprocessors. Because it controls communications between the processor and external devices, the chipset plays a crucial role in determining system performance. 22
- 23. The northbridge typically handles communications among the CPU, RAM, AGP or PCI Express, and the southbridge. Some northbridges also contain integrated video controllers, also known as a Graphics and Memory Controller Hub (GMCH) in Intel systems. The southbridge is a chip that implements the "slower" capabilities of the motherboard. Because the southbridge is further removed from the CPU, it is given responsibility for the slower devices on a typical microcomputer. 23
- 24. Asus's ROG series motherboards have an unparalleled reputation within the overclocking community and their Rampage II Extreme motherboard is the next step. Based on ICH10R chipsets, this ATX board is ready to host the newest LGA1366 Core i7 processors for ultimate powerful performance. High end motherboard intended mainly for the gamers with the best features of graphics and overclocking. Provides ultra-realistic graphics and high-impact, professional gaming performance. Up to 12GB of DDR3 1333 RAM can be installed in triple channel mode providing increased performance. Get even more performance – up to 1800Mhz – through overclocking. 24
- 25. Overclocking is the process of forcing a computer component to run at a higher clock rate (more clock cycles per second) than it was designed for or was designated by the manufacturer, usually practiced by personal computer enthusiasts in order to increase the performance of their computers. Operating voltages may also be changed (increased), which can increase the speed at which operation remains stable. 25
- 26. 26
- 27. Brand Desktop Code Name Cores Process Date Laptop Code name Cores Process Date Core i7 Bloomfield Lynnfield Gulftown Sandy Bridge Sandy Bridge- E (3rd)Ivy Bridge Haswell 4 4 6 4 4/6 4 4 45 nm 45 nm 32 nm 32 nm 32 nm 22 nm 22 nm November 2008 September 2009 July 2010 January 2011 November 2011 April 2012 June 2013 Clarksfield Arrandale Sandy Bridge Sandy Bridge Ivy Bridge 4 2 4 2 2 45 nm 32 nm 32 nm 32 nm 22 nm September 2009 January 2010 January 2011 February 2011 May 2012 27
- 28. 28
- 29. Core i7 (Business and HighEnd) Core i5 (Mainstream Consumers) Core i3 (Entry- Level) Celeron Pentium DMI and Integrated GPU 29
- 30. Threads : 4, 2-4, 8 Simultaneous Threads resp. Cache : 3-4 MB, 3-8 MB, 4-8 MB resp. Hyper-Threading Technology TurboBoost Technology Heat and Energy Efficient MicroAcrcitecture 30
- 31. In a test performed on a leaked hardware, the core i7 outperformed the currently fastest core2 extreme processor. It has got the advantages of High Performance, Big Cache Size, Very Fast, Highly Overclockable, Quite Cooling and Power Efficient. Some of the disadvantages include the requirement of newer motherboards, sensitive to higher voltage and cost. The technology keeps on improving as the need for faster and high end applications increases. The 8 core version is about to be released soon. 31
- 32. 32
- 33. 33