Moems.ppt
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The document presents an overview of Micro-Optical-Electro-Mechanical Systems (MOEMS) and their integration with microelectronic components to create microsensors and actuators. It discusses the manufacturing, design parameters, methodologies, and applications of MOEMS in various fields such as biomedical, automotive, and communication technologies. Additionally, it highlights the benefits of MOEMS, including cost-effectiveness, reliability, and miniaturization.
Moems.ppt
- 2. 2 MOEMS microstructures are manufactured in batch methodologies similar to computer microchips. The photolithographic techniques that mass-produce millions of complex microchips can also be used simultaneously to develop and produce mechanical sensors and actuators integrated with electronic circuitry. Most MOEMS devices are built on wafers of silicon, adopting micromachining technologies from integrated circuit (IC) manufacturing and batch fabrication techniques. MOEMS and ICs
- 10. 10 Advantages •To provide general solution •To make cost effective approach •For teaching & Demonstration •Analyze & verify theoretical model •Research tool •Complexity of problems easily understood •Lowers time & cost in designing
- 11. 11 •Light weight, Small size • No induce impulse •No effect in explosive environments •Immunity to adverse temp. and moisture •Low cost •No additional protection •No problem in space radiation •No electromagnetic interference •No crosstalk interference Benefits of Optics
- 12. 12 Need of SimulationDifferent level of Abstraction Alternative solution Practical feedback at time of designing Real life solution Trade offs between accurate modeling Cost Teaching & demonstration Time Large data handling Debugging and tuning in Design Visualize data Virtual prototype
- 13. 13 Earlier work •Data and Materials model •Prediction of MEMS assemblies •Thermo Mechanical behavior •SESES – Electrical, Thermal & Mechanical •NODAS – Nodal design of actuators and Sensors •Mach Zehnder interferometer •Switching Device etc.
- 14. 14 Optical Design Electro Mechanical Design Process Design Choosing Geometry Optical Characteristics Electronics Mechanics Stiffness Material Parameters Electrostatics Thermal Patterning Material Deposition Etching
- 16. 16 Design Parameters of MOEMS under interest Mechanical: Shape and dimension / Stress distribution / Strength / Stiffness /Rigidity and distribution /Weight and distribution /Hardness/Wear resistance/Abrasion resistance/Ductility /Coefficient of friction/lubricity/Damping/Creep/Fatigue/Toughness Electrical: Conductivity /Resistance /Dielectric Strength /Dielectric loss /Magnetic permeability and saturation /Eddy current loss Skin Effect /Electro magnetic forces /Electro static voltages /Corrosion from leakage currents Thermal: Thermal Expansion /Temperature coefficient of resistance /Specific Heat / Thermal Conductivity Ecological: Effect of discharges on the environment /Effect of the product on the environment when scrapped Biological: Toxicity /Carcinogenesis /Fungus resistance /Other Microorganism Resistance Optical: Transparency /Translucence /Opacity /Color /Refractive Index Chemical: Chemical Resistance including Corrosion /Chemical harmfulness including pollution by manufacturing process and by- product /Adhesive bondability /Hygroscopic /Porosity /fading
- 18. 18 Methodology
- 19. 19 Methodology •Modeling of MOEMS as Sensor •Modeling based on different substrates •Modeling of MOEMS as Actuator •Beam Propagation Technique •Computational OptoElectroMechanics ( High Fidelity Modeling ) •High Fidelity Modeling of Electromagnetic Field
- 20. 20 Laguerre Gaussian Equation •Single •Two •Multimode Differential Equation Modeling Vertical Cavity Surface Emitting Surface
- 21. 21 Maxwell’s Equation •Boundary Conditions •Fast Fourier Transformation (1) div D = ρ, (2) div B = 0, (3) curl E = -dB/dt, and (4) curl H = dD/dt + J. rho, ρ, is charge density, J is current density, E is the electric field, and B is the magnetic field; here, D and H are field quantities that are proportional to E and B, respectively.
- 22. 22 Helmholtz Equation •Free Space •Guided wave propagation •FD-BMP •FFT-BMP Helmholtz (time-independent diffusion) equation
- 23. 23 •VHDL Very High Speed Integrated Circuit Descriptor Language •Verilog •ABEL HDL •SPICE Simulator •Electrical •Mechanical •Thermal •Fluid
- 24. 24 Simulation outcome •Modeling and Analysis based on different parameter. •Parameters effect •Variations of refractive index Modeling & Simulation for the optical & electro- mechanical parts is usually done separately, But here it is tried to integrate in one.
- 25. 25 •Accuracy in distance measurements •EMI insensitivity in harsh environments •Security in exploding fields •Selectivity in chemical detection •Miniaturization •Reliability •Mass and size reduction •Mass production capability •Low manufacturing costs Benefits of using MOEMS
- 26. 26 •Sand-sized machines •chip to think, act, and communicate •intelligent Microsystems •systems-on-a-chip •Sensing and acting •potentially quite inexpensive •millimeters to a dozen microns •miniature parts •use little power, occupy a small volume Advantages
- 27. 27 •Limited Options •Packaging •Fabrication Knowledge Required •Expermintal data •Technological barrier • Acceptence • Less Fabrication center Limitation
- 28. 28 smart dust Smart roads sensors in automobile airbags Medical aviation Defense Wireless communication and optical communications systems. automobile-mounted global positioning systems Today & Future
- 29. 29 Outstanding industrial applications of MOEMS are •Peripherals and Telecom •Biomedical •Automotive •Industrial maintenance and control •Demotic •Space and astronomy •Environmental monitoring MOEMS applications
- 30. 30 Applications
- 31. 31 •Inertial Measurements - Accelerometers, gyroscopes, rate sensors, vibration sensors. •Pressure Measurements - TPMS (Tire Pressure Monitoring System) , disposable blood pressure sensors and various industrial applications. •Display Technology - Optical MEMS in projectors, plasma displays. •RF Technology - Tunable filters, RF switches, antennas, phase shifters, passive components (capacitors, inductors). • Chemical Measurements - Microfluidics: Lab-On-Chip devices, DNA test structures, micro-dispensing pumps, hazardous chemical and biological agent detectors Typical Device Applications
- 32. 32 Optical MEMS Communication Link
- 33. 33 MEMS-Based Optical Identification and Communication Systems (MOICS
- 35. 35 Thanks