process flow for simple cantilever structure with mask 1 and mask 2 Design_1.pdf
- 1. 1 Process flow for su-8 Cantilever
- 2. 2 2400 µm 2µm 1µm 800µm 200µm 2400µm silicon Su-8 Structure of Cantilever 600µm Theoretical Pull in Voltage Vp = 2.72 Volt PPR Aluminium
- 3. 3 Process flow silicon Front view Top view step 1 : Clean Silicon wafer
- 4. 4 silicon Front view Top view step 2 : Spin coat PPR 1µm PPR Process flow Spin speed : 6000 R.P.M Soft Bake : 110 degree for 2 minutes
- 5. 5 Silicon Front view Top view step 3 : Pattern PPR using MASK 1 PPR 800µm 200µm Process flow
- 6. 6 Silicon Front view Top view step 4 : Deposit Aluminium 100 nm PPR 800µm Process flow Aluminium
- 7. 7 Silicon Front view Top view step 5 : Strip Resistance - Lift-off 800µm 200µm Process flow Aluminium
- 8. 8 Silicon Front view Top view step 6 : Spin Sacrificial layer PPR 1µ m PPR 200µm Process flow Aluminium Spin speed : 6000 R.P.M Soft Bake : 110 degree for 2 minutes
- 9. 9 Silicon Su-8 Front view Top view step 7 : Su -8 Layer Fabrication 1µ m PPR 200µm Process flow Aluminium Spin speed : 4000 R.P.M Pre Bake : 65 degree for 7 minutes followed by 95 degree for 30 minutes
- 10. 10 Silicon Su-8 Front view Top view step 8 : Su -8 patterning MASK - 2 PPR 200µm 600µm Post Bake : 65 degree for 1 minutes followed by 95 degree for 5 minutes Process flow
- 11. 11 Silicon Su-8 Front view Top view step 9 :Developing and critical point drying PPR Develop SU-8 structure using the developer from MicroChem Corp. The samples has to be hard baked at 120 degree for 15 min Process flow
- 12. 12 MASK LAYER 1 AND LAYER 2
- 13. 13 MASK LAYER 1
- 14. 14 MASK LAYER 2