Qpi Technology Development
- 1. Technology development By Boy van Veghel WWW.QPIGROUP.COM © Q.P.I. GROUP
- 2. Questionnaire result 1. Copper filled through vias 2. Different finish 3. Use of high temperature materials 4. High thermal conductivity PCB 5. Use of thinner, more flexible materials 6. Reduced track/gap 7. Smaller via holes WWW.QPIGROUP.COM © Q.P.I. GROUP
- 3. Technology development Choice of technology when using fine pitch Options for thermal management in PCB High vacuum PCB design WWW.QPIGROUP.COM © Q.P.I. GROUP
- 4. Choice of technology when using fine pitch Designers often make the wrong choice of design rules with fine pitch BGA Low yield/cost effective long lead-time WWW.QPIGROUP.COM © Q.P.I. GROUP
- 5. BGA pitch 0,64 mm Standard blind/buried PCB Blind 0,1mm hole> 0,3mm pad> 0,27mm land pad Buried 0,15mm hole> 0,35mm pad Track/gap 100µ on inner layer » Blind via Buried via WWW.QPIGROUP.COM © Q.P.I. GROUP
- 6. BGA pitch 0,5 mm(via in pad) Copper filled blind/buried PCB Blind 0,1mm hole> 0,3mm pad> 0,25mm land pad Buried 0,15mm hole> 0,30mm pad Track/gap 75µ on inner layer » Blind via Buried via WWW.QPIGROUP.COM © Q.P.I. GROUP
- 7. BGA pitch 0,4 mm(Stacked via) Copper/resin filled stacked via PCB Blind 0,1mm hole> 0,3mm pad Track/gap 300µ on inner/outer layer Connect every level of balls on separate layer Layer 1 Layer 2 Layer 3 WWW.QPIGROUP.COM © Q.P.I. GROUP
- 8. Stacked via Cost effective Low yield Long lead-time WWW.QPIGROUP.COM © Q.P.I. GROUP
- 9. Latest technology development Replace “stacked via” by 1 layer 30µ VHDI Shorter lead-time Less layers Better yield More cost effective WWW.QPIGROUP.COM © Q.P.I. GROUP
- 10. Latest technology development Layer 1 blind via copper filled Layer 2(VHDI) fan out layer WWW.QPIGROUP.COM © Q.P.I. GROUP
- 11. Latest technology development Special additive process QPI own development Using standard PCB process Process not mature yet WWW.QPIGROUP.COM © Q.P.I. GROUP
- 12. Latest technology development Controlled impedance Fan out to correct width within 10mm Signal quality remains acceptable WWW.QPIGROUP.COM © Q.P.I. GROUP
- 13. Thermal managment in PCB IMS PCB Aluminium back MC PCB Copper, aluminium, CIC core Ceramic As fired Thick copper PCB 400µ Cu edged pattern Copper bar PCB Wire, strip, coin, rectangular WWW.QPIGROUP.COM © Q.P.I. GROUP
- 14. Thermal managment in PCB IMS PCB (insulated metal substrate) LED industry Cu 18/35/70/105/210µ Prepreg 117µ Aluminium 0,8/1/1,5/2/3mm Material Standard Improved Special Copper Aluminium Fr-4 Fr-4 Fr-4 W/m*K 0,2 1,8 3 385 240 WWW.QPIGROUP.COM © Q.P.I. GROUP
- 15. Thermal managment in PCB MC PCB (metal core PCB/metal backed) COB, Heat components, RF Standard Fr-4/CF3350 Copper/Aluminium/ CIC Material Standard Copper Aluminium CIC Hysol Fr-4 CF3350 W/m*K 0,2 385 240 108 7 WWW.QPIGROUP.COM © Q.P.I. GROUP
- 16. Thermal managment in PCB Ceramic As-fired LED, COB Single or double sided Ag/Pd printed tracks 12-24µ thick ENIG optional Ag/Pd tracks printed Ceramic Composition 96% 99,5% 99,6% 91% 99,5 AlN Al2O3 Al2O3 Al2O3 Al2O3 BeO W/m*K 25 33 35 13 255 170 Dk 9,5 9,8 9,9 10,3 8,6 8,9 Color White White White Brown White Ivory WWW.QPIGROUP.COM © Q.P.I. GROUP
- 17. Thermal managment in PCB Thick copper PCB Power distribution, heat components Blind via’s copper filled 400µ Cu etched pattern (design depended) WWW.QPIGROUP.COM © Q.P.I. GROUP
- 18. Thermal managment in PCB Copper bar PCB Local heat distribution, power lines Strip, coin, rectangular, wire etc. WWW.QPIGROUP.COM © Q.P.I. GROUP
- 19. High vacuüm PCB design More and more vacuüm applications Typical vacuüm10-6/10-10 mbar Outgassing PCB materials Hydrocarbons Low moisture absorbtion materials WWW.QPIGROUP.COM © Q.P.I. GROUP
- 20. High vacuüm PCB design for rigid No solder mask or only solder dams Via in pad(filled), no tracks on outer layer Material Fr-4 Fr-4 Polyimid Teflon Rogers improved 4350 Moisture absorbtion 0,25% 0,15% 0,4% 0,02% 0,06% WWW.QPIGROUP.COM © Q.P.I. GROUP
- 21. High vacuüm PCB design for flex Adhesiveless PY flex No acrylic between PY and copper No acrylic in bondply and cover film Only modified PY(Espanex) LCP is the best option Design depended, no cover layer No multiple bonding Material LCP Polyimid Acrylic flex Moisture 0,04% 0,8% 2,8% absorbtion WWW.QPIGROUP.COM © Q.P.I. GROUP
- 22. High vacuüm PCB design for flex-rigid Latest development Material LCP Rogers Arlon 4350 6700 Moisture 0,04% 0,06% 0,005 absorbtion WWW.QPIGROUP.COM © Q.P.I. GROUP
- 23. Thank you WWW.QPIGROUP.COM © Q.P.I. GROUP