Quality Assurance Procedures for LPU and all related components
- 1. LPU and subassembly Quality Assurance checklist LPU Serial Number____________________ QA performed By _____________________ Date of Installation____________________
- 2. Quality Assurance Procedures for LPU and all related components. Prior to any assemblyof all LPU systems and subsystems the following procedures will be used to perform a Quality Assurance Inspection so that the integrity of all systems will be maintained. Inspection is required of all components listed below prior to beginning the manufacturing of the LPU and subsystems. This procedure is to be used in conjunction with the LPU Assembly manual. This will allow the assemblers to familiarize themselves with the components described in this procedure. Electronic Components: Carrier Board DIO Board WIM Card WIM Interface Board LPU PowerSupply L-Com Boards and WIM Filter Board Cables: LC-1 LC-2 Interface Board to Carrier BoardCable Connectors and switch: WIM card to Carrier Board Ribbon Cable connectors MechanicalComponents: LPU Chassis VGA Bracket PowerswitchBracket WIM Card Window Panel Vent screens LPU I/O Port Panels Powerswitchbracket
- 3. Carrier Board Passed Failed Physical distribution of pins are correctfor all connectors Connector shells are undamaged Missedsolder connections Board is free of all flux and solder residue. Circuit Boardis free from Physical defects Jack nut brackets are properly Installed Processoris installed on carrier board and Screwedin place with correctmounting screws Inspect for proper seating of processorto the carrierboard DIO Board Passed Failed Physical distribution of pins are correctfor all connectors All Connector shells are undamaged Missedsolder connections onback of board Circuit boardis free of all flux and solder residue. Circuit Boardis free from Physical defects
- 4. WIM Interface cards Passed Failed No Physical damage to the board Continuity testacross solderpoints on PWR1 5v_Retand +5v. It must read open No unsoldered connections WIM Card Passed Failed Connector shells are free of damage Power and USB B connector free of any physical damage LED display is free of damage Missedsolder connections onback of board Circuit Boardis free from Physical defects Remove groundwire from Load Cell side of board replace jack nut
- 5. L-Com Boards and WIM Filter Pass Failed No Physical damage to L-COM and WIM Filter boards No unsoldered points on back of L-Com Ferrule connectionfrom L-Com board to WIM filter are secure No unsoldered connections or overlapping solderon WIM Filter Board WIM Filter is wired correctlyper installation manual and is connectedto the Line side of L-COM board No physical damage to Load cell connector LPU PowerSupply and components Passed Failed Inspect powersupply for any defects Powersupply is wired correctly All Spade terminals are crimpedproperly No excessive bare wire is exposedfrom Spade terminals Spade terminals are oriented downward No loose wires on20 pin Molex connector Molexconnector is wiredcorrectly All voltages have beentestedandare correct Inspect PowerSupply Filter for any damage
- 6. WIM Cables and Connectors Passed Failed LC1 and LC2 cables insure wires are connectedcorrectlyand ferrules are properly crimped and are not loose. LC1 and LC2 cables are labeledaccordingly WIM Ribbon Connectors insure that ribbons are securelycrimped to the connectorand there is no damage to shell Inspect all wires associated with LPU power switch Insure proper operation of switch using OHM meter
- 7. Mechanical Quality Assurance Checklist LPU Chassis and chassis components Passed Failed Inspect chassis for any physical damage or defects Inspect screw studs for any damage Insure cover closes properly Inspect side screens for any damage or defects Inspect I/O Port Panel for any damage Inspect VGA bracket for any damage Inspect the power switch bracket For any damage Inspect WIM Card Window Panels for any damage Inspect Vent screens for any damage