RFCONNEXT\’s HIGH SPEED INTERCONNECT TECHNOLOGIES AND APPLICATIONS

RFCONNEXT, Inc.

A Technology Overview

Advancing the High Speed Interconnect Ecosystem…™

Jamal S. Izadian, Ph.D.
jsi@rfconnext.com
408-981-3700
March 1, 2010
www.rfconnext.com

Mission
• Squeeze More Performance Out of Copper
Interconnects
• Diminish the Cost of Copper Bandwidth
• Advance the High Speed Interconnect
Ecosystem™…
Improve Signal and Power Integrity with
Higher Speed Connectivity, Across the
Spectrum
Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 2
Contains Patents Pending Materials

Business Model
• Innovate, Validate, Critical Elements of
– High Speed Interconnect Ecosystem
• Provide
– Interconnect products with Improved
Bandwidth
– Engineering Support, Services and Solutions
– Embedded IP Development Kits/Licensing
• Make it Greener

Evolution of Advanced
Transmission Lines

Microstrip Stripline

PMTL™/VMTL™/SMTL™

Transmission lines currently used in Advanced Transmission
CMOS, Packaging, and PCB industry Lines


3D High Speed Interconnect
Solutions

• Disruptive Patent Pending technologies
– PMTL™ , Periodic Micro Transmission Lines
– VMTL™ , Via Micro Transmission Lines
– SMTL™ , Shaped Membrane Transmission Lines
• Enabling the High Speed Interconnect Ecosystem

What are PMTL™, VMTL™, and
SMTL™?
• A family of fundamental printable coaxial-like
transmission lines technologies that
– Significantly improve
• Speed, Bandwidth, Edge Rate
– Significantly Reduces
• EMI, Crosstalk, Noise, Delay, Dispersion
– Provides Excellent
• SE and Diff Impedance
– Supports existing Materials and Fab. Processes

PMTL™ - Periodic Micro
Transmission Lines™

• Connects any points on the same layers with
full bandwidth
• Uses existing design, layout, and fabrication
methods
• Provides at least 30% improved electrical
performance, on FR4, more on Premium
Materials

VMTL™ - Vertical Micro
• Connects any two or multiple stacked layers
with full bandwidth
• Replaces problematic via stacks to connect
vertical Layers
– At high speed
– No parasitic
• Is compatible with PMTL™ and MS,SL,CPW


SMTL™ - Shaped Membrane
• Stackable membrane interconnects
– Embedded Transmission Lines
• Full bandwidth PMTL/VMT
• Traditional MS, SL, CPW etc…
• Full 3D Interconnect, Over The Top
– Replaces Wire bonds in packaging
– Allows die stacking
– Allows Package Stacking
– Allows PCB stacking
• Provides “More than Moore”….Gate/Function Density

3D Interconnect Attributes

• Wide band TEM DC-220GHz and beyond, no dispersion
• Can be Printed on, Rigid, Flex, PCB, even on Wafer
• Flexes, twists, turns, bends, maintains excellent phase,
amplitude, delay, skew, and impedance
• Lower Power Loss, Lowest Cross Talk, Low ISI
• Provide Thermal management and Power Integrity
• It is stackable, array able, in 2D and 3D
• Material/Process Independent


Advanced Interconnects
Embedded in Products/Markets
• Cables and Connectors
• PCB’s Backplanes Motherboard and
Daughterboard
• Electronic Packaging, Wafer Level
Interconnects
• Test and Measurement /Instrumentation
• Mobile Handsets, Wireless,
Microwave/RF/MMW


Cables and Connectors
• Coaxial Cabling and Flex
– High Performance, Assemblies
– Generic Cabling, Cable Bundles
• Connectors
– Coaxial, Single, and Ganges, SMA, SSMB, K, V
– PCB Connectors, Sockets, Interfaces, PCIe,
• High Speed Twisted Pairs Cabling
– HDMI, Ethernet/Cat 5,6,7
– USB/DVI/FireWire etc…

PCB Multilayer Boards
• Servers
– Mother Board
– Daughter Board
• Connectors/Sockets
• Routers
– Backplanes, Plug-in
• Memory Boards/ DDR3/4 DIMM
• Communication Networks/Switches

Packaging ,Wafer and Chip Level
• SMTL, mm Wave Packaging
– PMTL/VMTL coaxial –like interconnect
– Replace Wire Bonding
• Chip Level Packaging (CLP) Wafer Level
Packaging(WLP)
– SxS (Side by Side) flip chips
– Die Stacking ,uSD, SD, USB, DDR
– SiP (System in Package), PoP, Pup, MCM
– PCB Stacks, OTT High Speed Lanes

Test and Measurements (TAM)
• ATE Interfaces
– ATE internal Fan-out
– Spatial Transformers
– Load Boards/Load Cards
– Standardization of Device Interface
• Universal Test Sockets
– BGA, LGA, QFN, TOP etc…
• Personal Desktop Probe Stations
– Probes/Fixtures/Handy probes/ RF Clips

RF/Microwaves mm Waves
• Mobile Handset Boards/Packages
Miniaturization
• Antennas and Antenna Interconnects
• Wide band low loss Optical Power
Combiners
• Low Loss Beam Forming Networks(BFN)
• Low Cost Transmitter - receivers Modules
Integration on FR4

Some High Speed Digital
Applications
• Wide Band Lanes (XAUI, DVI, USB, SGBe,
FC, 10GBase-T, SATA, InfiniBand, PCIe, …)
• SerDes’(ization) Printed active Cabling,
– With embedded Active, Chips, Serdes, E-Passives
• Higher Speed Routers/ Servers/PC’s but less
crowded routing, shrinking in size
• Could Replace Some Fiber links with Copper
on PCB’s


TECHNOLOGY VALIDATION

Measured Performance of PMTL™ on Flex
compared to Similar Coaxial transmission lines

Following Insertion Loss Measurements Courtesy Of Samtec, Inc. Signal Integrity Group

Following Measured TDR and Eye Diagrams Courtesy Of Spectrum Integrity, Inc.

Prototypes
The following results were taken from the first prototypes developed.
These prototypes were handled extensively and as such these results
lessons learned will improve the future prototypes.

Material: Pyralux- Connectors: Samtec – Length 6”
Designed for 20GHz

Material: Pyralux - Connectors: Southwest Microwave – Length
6”


Measured Insertion Loss of PMTL™ uFlex vs. Other
Transmission Lines over DC-50GHz(All for 6” length)
Insertion Loss Comparison

0

-2

uCoax_Teflon_Calculated
-4

-6
Insertion Loss (dB)

Equivalent
-8 microstrip Line

-10
RF Flex
PMTL 082008
-12 0.141" Reshapable Coax
0.020" Semi-rigid Coax
-14 1AL PMTL 031508
1BL PMTL 031108
2AL PMTL 031508
PMTL can Beat
-16 3AL PMTL 031508 equivalent Coaxial Line
IIIL PMTL 031508
uCoax_Teflon_Calc uCoax_Kapton_Calculated
-18
uCoax_Kapton_Calc

-20
0 5 10 15 20 25 30 35 40 45 50
Frequency (GHz)


Pyralux, 3 Layer Results
Results from Pyralux material and connectors designed for 20 GHz testing

10 GHz 28GHz 32GHz 40GHz
Time in P2P Rise/Fall P2P Rise/Fall P2P Rise/Fall P2P Rise/Fall
ps Jitte Time Jitte Time Jitter Time Jitter Time
r r
Control 2.2 9.3 / 8.4 2 8.8 / 7.7 3 8.7 / 6.7 4.8 9.7 / 8.0
Flex 4.4 20.4 / 5.1 16.6 / 8.3 17.5 / 16.0 20.4 / 19.7
18.2 15.3 15.5


Pyralux 4 Layer Results
Results from Pyralux sample

10 GHz 28GHz 32GHz
Time P2P Rise/Fall P2P Rise/Fall P2P Rise/Fall
in ps Jitte Time Jitte Time Jitter Time
r r
Contro 2.2 9.3 / 8.4 2.0 8.8 / 7.7 3.0 8.7 / 6.7
l
Flex 4.8 26.6 / 23.5 6.6 29.1 / 25.3 4.4 20.4 / 18.2


TDR, Impedance Profile
6”, 3 Layer PMTL,
designed for 20GHz,
Kapton, SMA
Connectors, Sample S1

6”, 4 Layer PMTL,
designed for
50GHz, Kapton,
2.92mm Conn.,
Samples 1A and
3A


Way Forward
• Insert RFC technologies to improve
performance/cost ratio
• Provide Products and Engineering Services
– Test/ Measurement /Evaluation….
– SMTL™ enabled mmWave High Speed
Packaging
– mmWave Interface with Optical Component
• Provide new wideband cabling/connectors
• Flat connectors to replace SMA, SSMP, K, and V


Additional Information Links
• Watch The Stability and No Dispersion of PMTL™ uFlex Under Live TDR
• Comparing Fields inside a typical Package with Gold Wire Bonds vs. SMTL™,
Shaped Membrane Transmission Lines
• Comparing The Hard Disk Drive (HDD) Signal Integrity and EMI Shielding
Using Traditional Flex and the New PMTL™ uFlex
• Advancing Test and Measurement Instrumentation using PMTL™, VMTL™,
and SMTL™ Technologies ATE, Test Sockets, Load Boards, Device
Interface
• RFCONNEXT TEST and Measurement Catalogue 2009 and 2010
• Application of PMTL™/VMTL™ for Improving DDR Signal Integrity, Skew
and Jitter
• Eric Bogatin, of BeTheSignal.com Interviews Jamal Izadian at
DesignCon2010 about PMTL™
• Download More Info at http://www.rfconnext.com/WHITE%20PAPERS.html


APPENDIX

More Measured Eye Diagram
Data

10Gbps,6” PMTL’s Samples 1S,
1A, and 3A Eyes
Ref. TP1
Instrument

Sample 1A

Sample 1S Sample 3A


14Gbps,6” PMTL’s Samples 1S,
1A, and 3A Eyes
Ref. TP1
Instrument

Sample 1A

Sample 1S
Sample 3A


10GBps, and 14GBps ~10”
FR4 MS Trace
Ref. TP1 Ref. TP1
Instrument, Instrument,
10Gbps 14Gbps

10” FR4 10” FR4
Sample , Sample ,
10Gbps 14Gbps


22.5 and 28 GHz Baselines
Ref. TP1 1A Flex 1AL
22.5GHz
28 GHz


32 And 40 GHz Baseline
32 GHz
40 GHz Ref. TP1 1A Flex


Demonstrating More Applications
of PMTL™/VMTL™

A Sample of Prototypes


Wafer Probe With integrated High
Speed uFlex Cable


High Speed Flex uCables,
Alternate Bending


RFCONNEXT\’s HIGH SPEED INTERCONNECT TECHNOLOGIES AND APPLICATIONS

More Related Content

What's hot (20)

Viewers also liked (12)

Similar to RFCONNEXT\’s HIGH SPEED INTERCONNECT TECHNOLOGIES AND APPLICATIONS (20)

RFCONNEXT\’s HIGH SPEED INTERCONNECT TECHNOLOGIES AND APPLICATIONS