This document summarizes research on the effects of strain on the lattice thermal conductivity in silicon thin films using first-principles calculations and solving the phonon Boltzmann transport equation. The key findings are:
1) Thermal conductivity in the in-plane [100] direction has a weaker dependence on strain than the cross-plane [001] direction.
2) Thermal conductivity increases with compressive strain and decreases with tensile strain in the [001] direction due to changes in phonon velocities.
3) For a 20nm thin film, boundary scattering does not dominate thermal transport in the in-plane [100] direction, and strain has a small effect on thermal conductivity in this direction.