Dedi prog in_circuit_programming_presentation_(nwe_add_update)
- 1. Dec 08
- 2. In Circuit Programming method (ICP) Introduction g g ( ) Benefit of the highest update flexibility for development, debugging, production and repairing by using our In Circuit Programming method allowing to reduce your time to market. Features: update your SPI Flash soldered on your application board by using our dedicated programmers: SF100 and SF300. When connected to the application board, the programmer can control the th SPI b t read or update the Serial Flash content. bus to d d t th S i l Fl h t t
- 3. In Circuit Programming method (ICP) benefits In Circuit Programming method (ICP) benefits Benefits: The highest performances (SPI Flash dedicated Programmer) - 8Mb = 10sec for update - 16Mb = 20sec for update The highest code update flexibility for code development, debugging warehouse update or repairing (any where at any time) The easiest update method for final users Reliable (no contact problem due to socket or soldering) Ensure th b t SPI signals quality versus th socket solution (l E the best i l lit the k t l ti (less bus capacitance) Time saving (no need to manipulate the memory or unsold for update) for the best time to market
- 4. Benefits of the highest update flexibility Benefits of the highest update flexibility Update flexibility is a must: For Reference Board: convenient for your customers trials For software development: ensure new code trials in the shortest time For Code debugging: easy access and editing of the memory content at any time For P d ti F Production: Program the code after soldering or at th l t ti P th d ft ld i t the last time f for customization before shipment For update: in warehouse before shipping in case of new code version For repairing: easy field repairing in case of code bug or corruption ..
- 5. ICP versus IAP and ISP IAP = In Application Programming (use the application software to update the Flash) ISP = In System Programming (Use an external tool to update the Flash through the application controller) ICP = In circuit Programming (Use external tool to update directly the Flash on board) IAP or ISP ICP is optimized and faster than IAP and ISP Application communication (IAP) Or External tool (ISP) IAP and ISP are often limited by: External low bus interface ICP Transfer through chipset Chipset SPI interface Bus ( (For Die cost reduction, the chipset , p SPI buffer is often reduced to few (Jtag..) bytes 8, 16 and optimized for fast read but Chipset not for fast Serial Flash Programming) Chipset SPI interface SPI interface SF100 Or SF300 SPI SPI In Circuit Programming is Serial optimized for Serial Flash: Serial Optimum frequency Flash Optimum SPI buffer (256Bytes) O ti b ff (256B t ) Flash No limitation due to cost reduction Application Application
- 6. The SF100 and SF300 ICP programmer The In Circuit Programmers take advantage of the Low lines count of the SPI bus (4 lines only) to take the control of the memory. These programmers have been designed to fit the different applications needs and optimized for the Serial flash offering powerful features, high performance for the lowest cost. cost USB For computer ICP connector communication For application LCD screen SF300 to monitor the USB & SA mode SF100 Stand Alone mode USB mode LED for operation status Power for ICP connector Stand Alone For application mode Start button LED for For Stand Alone operation status USB For computer communication Buzzer Socket adaptor
- 7. ICP connector description ICP connector description Application Board Application ICP Red wire: SPI Programmer Header Pin Header Vcc (Top view) 1 Vcc GND 2 3 CS CLK 4 SF100 ICP Cable 5 MISO MOSI 6 7 Empty I/O3 8 Programmer Mistake Proof pin p Pin Name of signal Description 1, 2 Vcc, Gnd Vcc supplied from the programmer to the Serial Flash 3, 4, 5, 6 CS1, CLK, MISO, MOSI SPI signals 8 IO3 Used to reset the Chipset or switch off the Mosfet 7 Mistake proof pin Prevent from wrong connection
- 8. Solutions to implement the ICP method to implement the ICP method
- 9. Case 1: Update the Serial Flash with Application OFF and serial resistors A li ti OFF d i l i t Memory supplied Diode to not supply the By SF100 or SF300 application with the programmer Chipset not supplied potential Leakage Currents to be measured (threshold on ICP connector resistors I=U/R) Serial Flash Conditions: - Chipset must be tolerant to 3.3V SPI Serial resistors (33 or 47 Ohm) to: signals on its SPI IO even if Filter the SPI signals overshoots and undershoots not supplied (small leakage Limit th l k Li it the leakage current in the chipset d i ICP t i th hi t during current in the chipset) update
- 10. Case 2: Update the Serial Flash with Application OFF and Mosfet A li ti OFF d M f t Mosfet to not supply the application with the programmer Vcc - Application ON MOSFET ON - Application OFF MOSFET OFF Memory supplied By programmer Chipset not supplied No Leakage currents ICP connector Serial Flash Mosfet to isolate the chipset during the ICP update Conditions: with application OFF: - Work with all the chipsets - Application ON MOSFET ON - Application OFF MOSFET OFF
- 11. Case 3: Update the Serial Flash with Application Case 3: Update the Serial Flash with Application ON and SPI Output in High impedance Chipset reset by programmer IO3 Memory supplied li d before starting the SF update By application only Chipset supplied SPI Outputs in High Impedance during reset or any other modes.. modes ICP connector Conditions: - Chipset SPI outputs must be in SPI Serial resistors (33 or 47 Ohm) to: - High Impedance during the ICP Filter the SPI signals overshoots and undershoots on edges - update (reset or any other modes..)
- 12. Case 4: Update the Serial Flash with Application ON and Mosfet A li ti ON d M f t Memory supplied By application only Chipset supplied SPI outputs isolated by Mosfet (CS. CLK, MOSI) ICP connector Serial SPI Input doesn’t need to be isolated (MISO) Flash SF100 and SF300 IO3 connected to the Mosfet gates. Mosfet are supplied by the application but switched off by the IO3 during the ICP update - No update MOSFET ON (chipset connected) - Update MOSFET OFF (chipset isolated) Conditions: - Work with all the chipsets
- 13. How can I validate the ICP method with my chipset and application? The direct ICP method will require a minimum of validation. Actually, the Th di t ICP th d ill i i i f lid ti A t ll th programmer is taking control of the SPI bus and Memory power supply so it is mandatory to check if there is no possible conflict with the application controller (SPI master) or with the application Hardware. application controller (SPI master) or with the application Hardware For this purpose, DediProg has designed “ICP Evaluation tool” to test and validate the different In Circuit Programming methods on your current lid t th diff t I Ci it P i th d t application board without any hardware change required.
- 14. ICP Evaluation Board connection ICP Evaluation Board connection The ICP evaluation board can be soldered in your current application y pp board in place of your Serial Flash. The ICP evaluation board is designed to support all the different hardware circuits needed to validate the ICP.
- 15. ICP Evaluation Board schematic ICP Evaluation Board schematic User can test all the combinations: Connect IO3 to the Mosfet SPI S MOSFET or S i l resistors OS Serial i gate or application reset Vcc Mosfet or Diode or shortcut Serial Flash Connected to the application (Serial Flash Footprint) Test points are used to check Connect SF100 The signals with oscilloscope Or SF300
- 16. Programmer extra features Programmer extra features The SF100 and SF300 has been designed to support the update of two different Serial Flash soldered on the application board with two extra pins on the ICP connector. User has just to select the target memory on the DediProg Software: Chip1 or Chip2 The application ICP connector can be saved by using our SO test clip to connect the programmer directly on the serial Flash package: SO8N, SO8W or SO16 More information on the SF100, SF300 programmers and ICP evaluation kit on: www.DediProg.com
- 17. Contact DediProg Inc 4F., No.7, Ln. 143, Xinming Rd., Neihu Dist., Taipei City 114, Taiwan Email for technical support: support@dediprog.com Email for Sale information: sales@dediprog.com www.DediProg.com