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Toward an Electrically-PumpedToward an Electrically-Pumped
Silicon Laser: Optimization andSilicon Laser: Optimization and
ModelingModeling
Daniel B. Riley
M.S. Defense
Department of Electrical and Computer Engineering
University of Rochester
2
Acknowledgements
 Dr. Philippe Fauchet
 Fauchet Research Group
 Yijing Fu & Jidong Zhang
 Vicki Heberling
 MURI Silicon Laser
 Participating Institutions
 Funding Sources
 M.S. Thesis Examination Committee
 Dr. Thomas Hsiang – Electrical and Computer Engineering
 Dr. Miguel Alonso – Institute of Optics
3
Outline
 Motivation
 MURI Silicon Laser Project
 Theoretical Background
 Simulation and Results
 Summary and Conclusions
4
Limit of Microelectronics
 Dimensional shrink of microprocessors  Moore’s Law
 Barriers  materials, power dissipation, parasitic capacitance,
bandwidth bottleneck, lag of front side bus
 Performance limited as 10Mb/s/km threshold is approached
Available: http://www.intel.com/technology/mooreslaw
5
Communication Links
 Transition from electrical links to optical links within the next
10 years – more solutions at all levels
 Chip to chip and intra chip stand to benefit most as strain on
processors increases – also most challenging
L. Pavesi and D.J. Lockwood. “Silicon Photonics” in Topics in Applied Physics”. 94. 1 – 90.
6
Benefit of Photonic Systems
L. Pavesi and D.J. Lockwood. “Silicon Photonics” in Topics in Applied Physics”. 94. 1 – 90.
7
Required Functionality
 Light generation, guiding, detection  no, yes, yes
 High speed (>1GHz) modulation  yes
 Low cost – high volume capability  yes
 CMOS compatibility  yes
Available: http://www.intel.com/research/platform/sp/
8
Silicon: Good and Bad
 Silicon is cheap
 Easily integrated with existing
CMOS processes
 Poor light emitter
 Free carrier absorption at infrared
wavelengths (1.55μm)
L. Pavesi and D.J. Lockwood. “Silicon Photonics” in Topics in Applied Physics”. 94. 1 – 90.
9
Outline
 Motivation
 MURI Silicon Laser Project
 Theoretical Background
 Simulation and Results
 Summary and Conclusions
10
Project Task
 Extrinsic gain laser
 Horizontal slot waveguide structure w/ alternating nanolayers of Er-
doped oxide and nc-Si for optical cavity of Si laser system
Si nc
Er 3+
SiO2:Er (low index)
nc-Si (high index)
11
Electrical Injection – Dipole Energy Coupling
1 Walters, R., Bourianoff, G., Atwater, H., Nature 04. 143, Feb. 2005.
Energy Transfer
Si-nc
Er3+
Exciton
Recombination
Resonant
Absorption
12
MURI
 Optical gain engineering – minimize losses, maximize gain
in cavity by increasing optical mode confinement factor (CF)
Confinement factor
Net gain
Threshold current density for injection
Power consumption and dissipation
Device efficiency
13
Outline
 Motivation
 MURI Silicon Laser Project
 Theoretical Background
 Simulation and Results
 Conclusions and Future Outlook
14
Theory – Important Concepts
t∂
∂−
=×∇
B
E
J
D
H +
∂
∂
=×∇
t
0=⋅∇ B
0=⋅∇ D
02
=
∂
∂
−∇
t
E
E
2
µε
Maxwell’s Equations
Wave Equation
Vector Algebra
µε
1
=v
000 ε
ε
εµ
µε
==n
HB µ=
ED ε=
Stokes’ Theorem
Divergence Theorem
0)(ˆ
0)(ˆ
0)(ˆ
0)(ˆ
12
12
12
12
=−⋅
=−⋅
=−×
=−×
DD
BB
HH
EE
s
s
s
s
Boundary conditions
at a dielectric interface
Continuous components 
“D-B normal, E-H tangential”
D1 D2
B1 B2
E1
E2
H1 H2
15
Planar Waveguide
 Maxwell’s Equations
 Wave Equation
 Boundary conditions for EM
fields
 Snell’s Law  TIR
 Waveguides
– n2 > n1 and n2 > n3
– Evanescent decay
n1
n2
n3
16
Slot Confined Waveguide
 Recall boundary conditions at
a dielectric interface
 D1,normal = D2,normal
 D1 = n1
2
E1
 D2 = n2
2
E2
 n2 > n1
 E1 > E2 by factor of n2
2
/ n1
2
n1
n2
n1
n2
n1
Libson, M, et.al. “Guiding Light in Void nanostructure”. Optics Letters. 29. 1209, Jun 2004.
x
z
17
Transverse E-field of fundamental TM mode
Libson, M. “Guiding Light in Void nanostructure”. Optics Express. 12. 2004.
18
Outline
 Motivation – Photonics Overview
 MURI Silicon Laser Project
 Theoretical Background
 Simulation and Results
 Summary, Conclusions and Future Outlook
19
Device Structure
 Single layer gain medium
 Si nc and Er grouped
together in one layer
 Alternating layers of nc-Si and Er
 Higher mode confinement
 Easier electrical injection into Si nc
 Controls dipole interaction length
between Si nc and Er during energy
transfer
n type device layer
p type device layer
SiO2 BOX
~3nm
~2nm
Si nc
Er 3+
SiO2 (low index)
nc-Si (high index)
20
Device Geometry
Cap Layer (SiO2)
Substrate
(SiO2)
T_SiO2
T_Si
T_C
Multilayer Region
50nm
1μm
y
x
z
nc-Si
SiO2:Er
SiO2:Er
nc-Si
Slab Height
~370 – 400nm
21
Tools and Methods
 3D device analysis is difficult
 RSoft Photonics CAD – numerical simulation
 FullWave – based on FDTD
 Matlab – data analysis
 Clarification of RSoft axis conventions - see previous page
 Transverse field oriented along x axis
 TM modes are of primary interest
 Transfer Matrix Method (TMM)
 Algorithm by Yijing Fu
 Comparison to FDTD
22
Effective Index Method
 Think of multilayer region as single layer with effective index neff
 Effective index depends on both the thickness and index of each layer
 Effective index  like a weighted average
 Effective index method determines index of refraction “seen” by
propagating mode
neff
23
CF vs. Ratio for 2D Slot Waveguide
 Based on equations for 2D slot structure
 Ratio of thickness between SiO2:Er layers and nc-Si layers is critical
 Saturation behavior of CF
Confinement Factor vs Ratio of Slot Width to
Waveguide Width
55
56
57
58
59
60
61
0 0.2 0.4 0.6 0.8 1 1.2 1.4
Ratio of Slot Width to Waveguide Width
ConfinementFactor(%)
24
Setup & Limitations
 Computing power
 Virtual memory limitation – much longer times, crashes
 Resolutions (x,y,z) >5nm per grid point
 Limitation on values of thickness, height, width, length
 Whole number values only
 Evenly divisible by resolution value for that dimension
 Restriction on possible devices for simulation
 Only a few structures chosen
 Scripting not possible
 Structures chosen based on above limitations, cutoff values
for single mode operation, and 2D model for optimum
thickness ratios
25
Power Distribution of Mode in z Direction
26
Power Distribution of Mode
27
Power Distribution Cross Section (x=0)
28
Table of Structures & Results
 Effective ratio accounts for extra layer of Si
 Range of optimum ratios covered
 Total height < 400nm for single mode operation
N Ratio
(SiO2:Si)
Effective
Ratio
T_Si
(nm)
T_SiO2
(nm)
Total Height
(nm)
CF (%)
6 2.00 1.71 20 40 380 42.57
7 1.50 1.31 20 30 370 48.56
7 1.75 1.53 20 35 405 52.03
8 0.80 0.71 25 20 385 61.56
8 1.25 1.11 20 25 380 58.46
9 1.00 0.90 20 20 380 60.41
29
FDTD and TMM Results
 Graphs of CF versus effective thickness ratio betw. SiO2:Er and nc-Si
 Left: FDTD and TMM simulation results for both TM and TE modes
 Right: TMM results for both TM and TE modes
0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4
0.25
0.3
0.35
0.4
0.45
0.5
0.55
0.6
0.65
Thickness ratio between SiO
2
and Si layer
Confinementfactor
TMM and FDTD result for multilayer thickness of 0.38 µm
TE mode confinement
TM mode confinement
FDTD data points for TM
FDTD data points for TE
0.5 1 1.5 2 2.5
0.35
0.4
0.45
0.5
0.55
0.6
0.65
0.7
0.75
Thickness ratio between Si and SiO
2
layer
Confinementfactor
TMM result for multilayer thickness of 0.52 µm
TE mode confinement
TM mode confinement
30
Gain/Loss Analysis to Model Actual Device
 TM modes  lower loss than TE
 More of mode w/in gain layers
 Less in lossy Si
 Gain/loss coefficient ratio
 Lower limit such that net gain is achieved
 Choose 3 optimum structures from previous graphs
 Redo simulations with loss and gain mechanisms
 Vary gain/loss coefficient ratio
 Loss coefficient set – gain coefficient increased until net gain = 0
 Value of gain/loss coefficient when net gain = 0 is sought
 Determine value for net gain from maximum power at time
monitor with no loss or gain
31
S&R – Gain/Loss Analysis: FDTD vs TMM
 Net gain vs. gain/loss coefficient ratio for both TM and TE modes
 Left: modal gain using TMM
 Right: propagation gain using FDTD
 Note agreement between the two methods
 TM net gain intercept ~ 0.25 for both as expected
 TE net gain intercept ~ 2.50 for both – not expected (should be ~1.00)
0 0.5 1 1.5 2 2.5 3
-0.4
-0.2
0
0.2
0.4
0.6
0.8
1
1.2
1.4
Modal gain for TE and TM polarization by TMM
gain/loss coefficient ratio
modeloss/gain(1/cm)
TE mode gain
TM mode gain
0 0.5 1 1.5 2 2.5 3
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
Gain/Loss coefficient ratio
ModalGaincoefficientA.U.
Propagation Gain from FDTD simulation
TM propagation gain
Reference
TE propagation gain
Reference
32
Outline
 Motivation - Photonics Overview
 MURI Silicon Laser Project
 Theoretical Background
 Simulation and Results
 Summary and Conclusions
33
Summary & Conclusions
 Silicon photonics
 2D slot waveguide as a model
 3D waveguide for cavity of Si based laser
 Gain/loss analysis
 Lower threshold current densities realized for less power
consumption and more efficient devices
34
Future Considerations
 Further simulation in more powerful computational
environment for improved accuracy
 Propagation lengths > 10 μm – closer to actual device lengths
 Higher resolution values
 More diverse structures with varying geometrical dimensions
 Better understanding of TE mode behavior
 Explanation beside coupling effects?
 With respect to device – better understanding of Si nc  Er3+
energy transfer process
35
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Toward an Electrically-Pumped Silicon Laser Modeling and Optimization_Thesis_Presentation

  • 1. Toward an Electrically-PumpedToward an Electrically-Pumped Silicon Laser: Optimization andSilicon Laser: Optimization and ModelingModeling Daniel B. Riley M.S. Defense Department of Electrical and Computer Engineering University of Rochester
  • 2. 2 Acknowledgements  Dr. Philippe Fauchet  Fauchet Research Group  Yijing Fu & Jidong Zhang  Vicki Heberling  MURI Silicon Laser  Participating Institutions  Funding Sources  M.S. Thesis Examination Committee  Dr. Thomas Hsiang – Electrical and Computer Engineering  Dr. Miguel Alonso – Institute of Optics
  • 3. 3 Outline  Motivation  MURI Silicon Laser Project  Theoretical Background  Simulation and Results  Summary and Conclusions
  • 4. 4 Limit of Microelectronics  Dimensional shrink of microprocessors  Moore’s Law  Barriers  materials, power dissipation, parasitic capacitance, bandwidth bottleneck, lag of front side bus  Performance limited as 10Mb/s/km threshold is approached Available: http://www.intel.com/technology/mooreslaw
  • 5. 5 Communication Links  Transition from electrical links to optical links within the next 10 years – more solutions at all levels  Chip to chip and intra chip stand to benefit most as strain on processors increases – also most challenging L. Pavesi and D.J. Lockwood. “Silicon Photonics” in Topics in Applied Physics”. 94. 1 – 90.
  • 6. 6 Benefit of Photonic Systems L. Pavesi and D.J. Lockwood. “Silicon Photonics” in Topics in Applied Physics”. 94. 1 – 90.
  • 7. 7 Required Functionality  Light generation, guiding, detection  no, yes, yes  High speed (>1GHz) modulation  yes  Low cost – high volume capability  yes  CMOS compatibility  yes Available: http://www.intel.com/research/platform/sp/
  • 8. 8 Silicon: Good and Bad  Silicon is cheap  Easily integrated with existing CMOS processes  Poor light emitter  Free carrier absorption at infrared wavelengths (1.55μm) L. Pavesi and D.J. Lockwood. “Silicon Photonics” in Topics in Applied Physics”. 94. 1 – 90.
  • 9. 9 Outline  Motivation  MURI Silicon Laser Project  Theoretical Background  Simulation and Results  Summary and Conclusions
  • 10. 10 Project Task  Extrinsic gain laser  Horizontal slot waveguide structure w/ alternating nanolayers of Er- doped oxide and nc-Si for optical cavity of Si laser system Si nc Er 3+ SiO2:Er (low index) nc-Si (high index)
  • 11. 11 Electrical Injection – Dipole Energy Coupling 1 Walters, R., Bourianoff, G., Atwater, H., Nature 04. 143, Feb. 2005. Energy Transfer Si-nc Er3+ Exciton Recombination Resonant Absorption
  • 12. 12 MURI  Optical gain engineering – minimize losses, maximize gain in cavity by increasing optical mode confinement factor (CF) Confinement factor Net gain Threshold current density for injection Power consumption and dissipation Device efficiency
  • 13. 13 Outline  Motivation  MURI Silicon Laser Project  Theoretical Background  Simulation and Results  Conclusions and Future Outlook
  • 14. 14 Theory – Important Concepts t∂ ∂− =×∇ B E J D H + ∂ ∂ =×∇ t 0=⋅∇ B 0=⋅∇ D 02 = ∂ ∂ −∇ t E E 2 µε Maxwell’s Equations Wave Equation Vector Algebra µε 1 =v 000 ε ε εµ µε ==n HB µ= ED ε= Stokes’ Theorem Divergence Theorem 0)(ˆ 0)(ˆ 0)(ˆ 0)(ˆ 12 12 12 12 =−⋅ =−⋅ =−× =−× DD BB HH EE s s s s Boundary conditions at a dielectric interface Continuous components  “D-B normal, E-H tangential” D1 D2 B1 B2 E1 E2 H1 H2
  • 15. 15 Planar Waveguide  Maxwell’s Equations  Wave Equation  Boundary conditions for EM fields  Snell’s Law  TIR  Waveguides – n2 > n1 and n2 > n3 – Evanescent decay n1 n2 n3
  • 16. 16 Slot Confined Waveguide  Recall boundary conditions at a dielectric interface  D1,normal = D2,normal  D1 = n1 2 E1  D2 = n2 2 E2  n2 > n1  E1 > E2 by factor of n2 2 / n1 2 n1 n2 n1 n2 n1 Libson, M, et.al. “Guiding Light in Void nanostructure”. Optics Letters. 29. 1209, Jun 2004. x z
  • 17. 17 Transverse E-field of fundamental TM mode Libson, M. “Guiding Light in Void nanostructure”. Optics Express. 12. 2004.
  • 18. 18 Outline  Motivation – Photonics Overview  MURI Silicon Laser Project  Theoretical Background  Simulation and Results  Summary, Conclusions and Future Outlook
  • 19. 19 Device Structure  Single layer gain medium  Si nc and Er grouped together in one layer  Alternating layers of nc-Si and Er  Higher mode confinement  Easier electrical injection into Si nc  Controls dipole interaction length between Si nc and Er during energy transfer n type device layer p type device layer SiO2 BOX ~3nm ~2nm Si nc Er 3+ SiO2 (low index) nc-Si (high index)
  • 20. 20 Device Geometry Cap Layer (SiO2) Substrate (SiO2) T_SiO2 T_Si T_C Multilayer Region 50nm 1μm y x z nc-Si SiO2:Er SiO2:Er nc-Si Slab Height ~370 – 400nm
  • 21. 21 Tools and Methods  3D device analysis is difficult  RSoft Photonics CAD – numerical simulation  FullWave – based on FDTD  Matlab – data analysis  Clarification of RSoft axis conventions - see previous page  Transverse field oriented along x axis  TM modes are of primary interest  Transfer Matrix Method (TMM)  Algorithm by Yijing Fu  Comparison to FDTD
  • 22. 22 Effective Index Method  Think of multilayer region as single layer with effective index neff  Effective index depends on both the thickness and index of each layer  Effective index  like a weighted average  Effective index method determines index of refraction “seen” by propagating mode neff
  • 23. 23 CF vs. Ratio for 2D Slot Waveguide  Based on equations for 2D slot structure  Ratio of thickness between SiO2:Er layers and nc-Si layers is critical  Saturation behavior of CF Confinement Factor vs Ratio of Slot Width to Waveguide Width 55 56 57 58 59 60 61 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Ratio of Slot Width to Waveguide Width ConfinementFactor(%)
  • 24. 24 Setup & Limitations  Computing power  Virtual memory limitation – much longer times, crashes  Resolutions (x,y,z) >5nm per grid point  Limitation on values of thickness, height, width, length  Whole number values only  Evenly divisible by resolution value for that dimension  Restriction on possible devices for simulation  Only a few structures chosen  Scripting not possible  Structures chosen based on above limitations, cutoff values for single mode operation, and 2D model for optimum thickness ratios
  • 25. 25 Power Distribution of Mode in z Direction
  • 28. 28 Table of Structures & Results  Effective ratio accounts for extra layer of Si  Range of optimum ratios covered  Total height < 400nm for single mode operation N Ratio (SiO2:Si) Effective Ratio T_Si (nm) T_SiO2 (nm) Total Height (nm) CF (%) 6 2.00 1.71 20 40 380 42.57 7 1.50 1.31 20 30 370 48.56 7 1.75 1.53 20 35 405 52.03 8 0.80 0.71 25 20 385 61.56 8 1.25 1.11 20 25 380 58.46 9 1.00 0.90 20 20 380 60.41
  • 29. 29 FDTD and TMM Results  Graphs of CF versus effective thickness ratio betw. SiO2:Er and nc-Si  Left: FDTD and TMM simulation results for both TM and TE modes  Right: TMM results for both TM and TE modes 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 Thickness ratio between SiO 2 and Si layer Confinementfactor TMM and FDTD result for multilayer thickness of 0.38 µm TE mode confinement TM mode confinement FDTD data points for TM FDTD data points for TE 0.5 1 1.5 2 2.5 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7 0.75 Thickness ratio between Si and SiO 2 layer Confinementfactor TMM result for multilayer thickness of 0.52 µm TE mode confinement TM mode confinement
  • 30. 30 Gain/Loss Analysis to Model Actual Device  TM modes  lower loss than TE  More of mode w/in gain layers  Less in lossy Si  Gain/loss coefficient ratio  Lower limit such that net gain is achieved  Choose 3 optimum structures from previous graphs  Redo simulations with loss and gain mechanisms  Vary gain/loss coefficient ratio  Loss coefficient set – gain coefficient increased until net gain = 0  Value of gain/loss coefficient when net gain = 0 is sought  Determine value for net gain from maximum power at time monitor with no loss or gain
  • 31. 31 S&R – Gain/Loss Analysis: FDTD vs TMM  Net gain vs. gain/loss coefficient ratio for both TM and TE modes  Left: modal gain using TMM  Right: propagation gain using FDTD  Note agreement between the two methods  TM net gain intercept ~ 0.25 for both as expected  TE net gain intercept ~ 2.50 for both – not expected (should be ~1.00) 0 0.5 1 1.5 2 2.5 3 -0.4 -0.2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Modal gain for TE and TM polarization by TMM gain/loss coefficient ratio modeloss/gain(1/cm) TE mode gain TM mode gain 0 0.5 1 1.5 2 2.5 3 -0.3 -0.2 -0.1 0 0.1 0.2 0.3 0.4 Gain/Loss coefficient ratio ModalGaincoefficientA.U. Propagation Gain from FDTD simulation TM propagation gain Reference TE propagation gain Reference
  • 32. 32 Outline  Motivation - Photonics Overview  MURI Silicon Laser Project  Theoretical Background  Simulation and Results  Summary and Conclusions
  • 33. 33 Summary & Conclusions  Silicon photonics  2D slot waveguide as a model  3D waveguide for cavity of Si based laser  Gain/loss analysis  Lower threshold current densities realized for less power consumption and more efficient devices
  • 34. 34 Future Considerations  Further simulation in more powerful computational environment for improved accuracy  Propagation lengths > 10 μm – closer to actual device lengths  Higher resolution values  More diverse structures with varying geometrical dimensions  Better understanding of TE mode behavior  Explanation beside coupling effects?  With respect to device – better understanding of Si nc  Er3+ energy transfer process
  • 35. 35 Thank you for ListeningThank you for Listening Please ask questions if you have them.

Editor's Notes

  • #4: Motivation  primarily involve a discussion of photonics especially with respect to silicon MURI  larger body of work of which this work was a small part
  • #5: Performance requirements will increase and electronic circuits will not be able to meet them as they cross the 10Mb/s/km threshold More distributed architectures will be needed to meet these demands This indicates optical carrier utilization To better understand it, let’s look at the current situation for all levels of the interconnect hierarchy
  • #6: Increased performance requirements for interconnects Speed, bandwidth, low loss, low latency For speeds &amp;gt;1Gb/s and transmission distances &amp;gt;100m Exclusively optical solutions – benefits outweigh cost Long-haul telecommunications fibers Intermediate distances (1-100m) Available solutions Chip-to-chip level  None Cost/technical issues dictate electrical solutions Largest potential benefits at this level Need low cost-high volume manufacturing capabilities
  • #7: Why bother? Optical solutions, in particular integrated chips offer many benefits (especially when silicon is used) General advantages of photonics over electronics Higher bandwidth  multiplexing and information carrying capacity Lower loss transmission Less electromagnetic noise/interference Smaller size, weight, power consumption Lower cost assuming high volume application Performance scaling through parallelism Photonic Integrated Circuits New Platform  electronic/photonic integration on Si wafer Eliminates need for active alignment of off-chip light sources Si light sources are key Leverage existing infrastructure for low cost-high volume
  • #8: Required Functionality for material to be used
  • #9: Benefits Low cost – Microelectronics industry based on Si Potential for integration using CMOS compatible processes Problems Indirect bandgap  inefficient light emitter Large free carrier absorption at infrared (1.55μm) wavelengths Solutions / Alternatives Raman laser – UCLA, Intel – Raman amplification; nonlinear process Hybrid laser – UCSB, Intel – specialized bonding technique Hybrid laser - III-V direct gap SCs (InP) – lattice mismatch with Si - defects Extrinsic material as light emitter (erbium) – MURI Si laser
  • #10: Deliverables: First CMOS compatible Er doped laser diode at 1.55micron First CMOS compatible Er doped waveguide amplifier optical micro amplifier for 1.55micron
  • #11: Slot confinement structure Horizontal slot for easier fabrication (no high precision etching for sidewall) Avoids potential high index contrast sidewall scattering losses Ring resonator – high Q factor required to compensate for low emission cross section in Er Why Er? – Extensive library of knowledge, Forster dipole-dipole energy coupling to Si nc, emission peak at ~1550nm communications wavelength
  • #12: Electroluminescence mechanism in Si nc floating gate transistor Excitons excited in nc-Si by MOS field effect injection exhibiting Fowler-Nordheim tunneling High internal radiative QE for excitons in Si nc (~60%)1 Si nc excitation and energy transfer to Er both faster than radiative emission rate for Er  easy population inversion
  • #13: My role in MURI project Loss mechanisms: Scattering Shown to be negligible for nm-scale nanocrystals Lower limit ~0.4 dB/cm Radiative turning loss due to resonator structure &amp;lt;0.1 dB/cm for diameters &amp;gt; 100 μm Free Carrier Absorption (FCA) inherent problem with Si – density of states in conduction band result of using tunnel/band injection currents – accumulation layer losses ~ 1.1 dB/cm primary optical gain engineering parameter for slot waveguide cavity
  • #15: Maxwell Eqns. – in a source-free medium Wave Eqn. – describes propagation of EM waves in a source-free medium Maxwell’s Equations Wave Equation Boundary conditions for EM fields at dielectric interface Snell’s Law  Total Internal Reflection (TIR)  Waveguides
  • #16: Planar Slab Waveguide Propagating modes
  • #17: Slot Confinement WG 2 waveguides side by side Enhanced E-field Redistribution of photons
  • #18: Shows that high confinement of light can be achieved in nm-thin layers when WGs are close together (slot &amp;lt;&amp;lt; decay length for mode) n1 = 1.44; n2 = 3.46; Enhancement by factor of ~6 at low index – high index interfaces Confinement factor - % of mode in a specific region of WG Power in specific region divided by total power Slot waveguide structure High confinement within nanometer-thin, low index slot regions Due to BC for D and high index contrast
  • #20: Multiple layer waveguide for higher optical confinement alternating SiO2:Er and nc-Si layers – repeating periods of nc-Si and SiO2:Er - Notice there is always one more layer of nc-Si Optical cavity for Si laser Si nanocrystals form from amorphous Si by appropriately tuning thermal budget Er and nc-Si in separate layers to help ensure proper Er – nc-Si interaction length in energy transfer process Also helps improve effective emission cross section of Er Horizontal slot for easier fabrication (no high precision etching for sidewall) Avoids potential high index contrast sidewall scattering losses
  • #21: Cap layer confines mode in region of multi layer region directly underneath it – determines mode width Width and Slab height restricted by single mode cutoff values ~400nm for slab height Slab height determined by thickness of Si, thickness ratio and total number of repeating nc-Si, SiO2:Er periods
  • #22: Hard to apply theoretical analysis to 3D WGs - Need for numerical simulation software RSoft – FullWave, etc Based on Finite-Difference Time Domain numerical methods for electromagnetic waves TM vs TE difference for RSoft – explain using structure
  • #23: Initially a good way to think about structure Index of refraction for nc-Si layers ~ 3.46 Index of refraction for SiO2:Er ~ 1.44 Expect effective indices ~ 2.45 if width of nc-Si layers and SiO2:Er layer thicknesses equal
  • #24: 2D Slot Confinement as a model for 3D Good indication of performance for more realistic 3D model Effective index method Determines index of refraction “seen” by propagating mode Ratio of thickness between nc-Si layers and SiO2:Er layers is critical in determining how well guided and well confined the mode is Graph shows saturation behavior – optimum range of thickness ratios for 2D slot model As ratio increases, more area for enhanced E field but also mode is not as well guided since effective index is decreased – Si claddings steal more of the mode
  • #25: Minimum layer thickness with reasonable results = 15nm (3 grid points) Layers at least 20nm thick – easiest value to use; not realistic but point is validation of theory Propagation length – 10 micron is sufficient Whole number values only Evenly divisible by resolution value for that dimension Good results: 25nm layer thickness and resolution of 5nm Bad results: 25nm layer thickness and resolution of 4nm Only a few structures chosen Scripting not possible Comparison to TMM
  • #26: Propagation length = 10 micron Time monitor at ~9.4 micron Pictures of contour graph of power in z direction at the time monitor, X-cut cross section of the power across the structure, and 3D picture of the power distribution Note high confinement in low index SiO2:Er layers and evanescent tail Temptation to think that more low index material would increase overall CF indefinitely – NOT TRUE
  • #27: Notice high power confinement in low index layers and large evanescent tail in substrate Mislabeled – x and y labels switched
  • #28: Evanescent tail is more prominent here
  • #29: Effective ratio – total height of SiO2:Er layers divided by total height of nc-Si layers Cannot accurately simulate structures with exactly a height of 380nm and also have usable values for other dimensions 380nm is the best possible height for the TMM simulations for comparison to FDTD CF calculated based on output data file of z component of power at time monitor
  • #30: 380nm is the best possible height for the TMM simulations for comparison to FDTD CF calculated based on output data file of z component of power at time monitor by importing data into Matlab CF vs Ratio graphs for TE/TM modes Discussion of Results – optimum ratios, achievable CF Notice similarity to graph for 2D slot confinement model Left: Slab height = 380nm (ranges slightly for FDTD) CF max &amp;gt; 55% for thickness ratio ~0.80 Optimum range for ratios ~ 0.80 – 1.10 Right: Slab height = 520nm CF max ~ 75% for thickness ratio ~1.00 Optimum range ~ 0.80 – 1.10 Saturation behavior due to increased SiO2 causing mode to be less well confined in multilayer region – some of the mode seeps into the cladding layers Possible sources of error include lower limit on resolution, accuracy of FDTD method, and mainly propagation length since 10 microns is not nearly large enough to allow a true eigenmode to form. Limitations on computational power restricted this parameter however.
  • #31: TM modes  lower loss than TE More of mode w/in gain layers Less in lossy Si Lower gain/loss coeff. ratio necessary for net overall gain in cavity Gain/Loss coeff. ratio is relationship between gain seen in SiO2:Er and loss seen in nc-Si by the optical mode Lower limit such that net gain still achieved within cavity Uneven distribution of light among layers  coefficient ratio not = 1
  • #32: Graphs of Overall Modal gain vs. Gain/Loss coeff. Ratio TM net gain intercept expected to be 0.25 because ~ 4x as much light is in SiO2 layers as is in Si layers TE net gain intercept unexpected – possibly due to mismatch between gain profile and mode profile for TE? TE mode essentially a smooth Gaussian but gain profile is step-like. Photons in outermost low index layers possibly couple out of device into cladding and substrate layers as a result causing net gain intercept value for the gain/loss coefficient to be significantly higher than expected value of 1.
  • #34: Major expansion – cost effective platform for smart partitioning of electronic and photonic functionality Extend processing power of integrated circuits and performance of communication networks Device combines excellent electrical properties of silicon with favorable optical properties of Erbium in order to side step the less than favorable optical properties of silicon and the inability to electrically pump Erbium. It utilizes a novel energy transfer process between nc-Si and Er3+ ions to accomplish a light emitting system in silicon. This energy transfer process is still relatively mysterious and much more work must be done in the way of understanding it.