Developing a New Auto-Loading Analytical Prober
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The document outlines the development of a new auto-loading analytical prober by Phillip Corson in September 2013, detailing goals, evaluation processes, and requirements for the prober to meet high-performance specifications. Key features include the ability to handle multiple wafer designs, thermal and noise performance superior to existing models, as well as a comprehensive evaluation and vendor selection process. The outcome was the successful development and acceptance of the CM300 family of automatic analytical probers.
Developing a New Auto-Loading Analytical Prober
- 1. Developing a New Auto- Loading Analytical Prober Phillip Corson September 2013 August 20131
- 2. ∗ Goal ∗ Background ∗ Evaluation Process ∗ Requirements ∗ Evaluation ∗ Acceptance ∗ Summary August 20132 Agenda
- 3. ∗ Create a set of requirements for an auto-loading analytical prober used in design kit verification ∗ Must be able to meet or exceed the leakage, noise, and thermal performance of the best-of- breed analytical probers ∗ Support loading of multiple designs within a wafer carrier ∗ Provide loading from multiple wafer carriers and allow each carrier to have a different wafer size ∗ Capable of supporting all measurements required for design kit verification August 20133 Goal
- 4. ∗ The majority of auto-loading prober are intended to manufacturing production use ∗ Most have minimal noise shielding ∗ Often have a limited thermal range ∗ Many have high internal noise generation ∗ Designed for speed so vibration sensitive measurement can be compromised ∗ Analytical probers are designed for difficult, high precision measurements ∗ Capable of operating below the test instruments noise floor ∗ Ultra-stable for long duration measurements ∗ Net: Probers for analytical use require a very different design point than production probers August 20134 Background
- 5. ∗ Assemble group of key stakeholders ∗ Lab engineers and technicians ∗ Buyer responsible for vendor interface ∗ Management support ∗ Create a list of requirements and evaluation criteria ∗ Send list of requirements and request a response from all approved suppliers ∗ Evaluate vendor responses against evaluation criteria ∗ Select vendor for collaboration August 20135 Evaluation Process
- 6. ∗ Measurement of DC I/V and C/V, flicker noise, high speed pulse, S-Parameters, and noise parameters ∗ Controllable through test executive ∗ Built-in anti-vibration ∗ Full temperature range testing from -60C to 200C ∗ Chamber shielding for light, electrical and magnetic noise, and ambient environment ∗ Prober card and multiple positioner mounted DC/RF probes ∗ Multiple auxiliary chucks for probe cleaning and ISS ∗ Automatic wafer loading, alignment, and set to initial location August 20136 Requirements
- 7. ∗ Microscope for inspection of final probe to pad alignment ∗ Manual override and retention of automatic alignment ∗ Console operation from remote computer ∗ Wafer serial number reader and map to carrier slot ∗ Different size wafers in each carrier ∗ Arbitrary wafer loading by carrier/slot or wafer serial number ∗ Chamber purge with CDA or nitrogen ∗ Triaxial chuck connection with a minimum bias range of -500 to 500 volts ∗ Automated temperature transitioning and realignment August 20137 Requirements (cont.)
- 8. ∗ Stakeholders review initial responses and select leading candidates for detailed evaluation ∗ Notify candidates of missing or ambiguous items in response ∗ Request formal presentation from each vendor with details of the proposed solution ∗ Complete formal evaluation ∗ Technical team handles specifications ∗ Buyer handles financials August 20138 Evaluation
- 9. ∗ Formal evaluation example August 20139 Evaluation (cont.) Category Weight Sub Category Weight Person A Person B Person C Person D Avg Score Person A Person B Person C Person D Avg Score Performance 20% Thermal Cycling & Control 10% 8.0 9.5 9.0 10.0 9.1 8.0 9.5 6.0 8.0 7.9 Noise levels - leakage and AC 25% 7.0 7.5 10.0 8.0 8.1 7.0 8.0 7.0 9.0 7.8 Stepping Accuarcy 25% 9.0 8.0 10.0 10.0 9.3 8.0 9.0 5.0 8.0 7.5 Robotics 20% 9.0 9.0 10.0 8.0 9.0 6.0 9.0 7.0 7.0 7.3 Temp sweep/cleaning 15% 9.0 7.5 10.0 10.0 9.1 5.0 7.0 3.0 6.0 5.3 High Resolution Imaging 5% 7.0 7.0 10.0 8.0 8.0 8.0 9.0 7.0 10.0 8.5 100% Weighted Score = 1.7 1.6 2.0 1.8 1.8 1.4 1.7 1.2 1.6 1.5 Ease of Use 20% Operating Software 30% 9.0 8.0 9.0 9.0 8.8 6.0 8.5 8.0 6.0 7.1 Programming Ease/GPIB 30% 8.0 7.5 8.0 8.0 7.9 8.0 7.5 7.0 9.0 7.9 Remote operation 20% 7.0 7.0 8.0 8.0 7.5 8.0 9.0 9.0 9.0 8.8 tool setup and wafer maps 20% 8.0 7.0 9.0 8.0 8.0 7.0 8.5 8.0 8.0 7.9 100% Weighted Score = 1.6 1.5 1.7 1.7 1.6 1.4 1.7 1.6 1.6 1.6 Serviceability 10% Response Time 20% 9.0 8.0 10.0 9.0 9.0 7.0 7.5 6.0 7.0 6.9 Problem Resolution 25% 7.0 7.5 9.0 7.0 7.6 8.0 8.0 6.0 8.0 7.5 Test Exec/Programming support 20% 8.0 8.5 9.0 7.0 8.1 8.0 8.8 9.0 7.0 8.2 Hardware/Software Intergration risk 35% 8.0 6.5 9.0 6.0 7.4 8.0 9.0 8.0 7.0 8.0 100% Weighted Score = 0.8 0.7 0.9 0.7 0.8 0.8 0.8 0.7 0.7 0.8 Price 50% Cost of Ownership 100% 8.0 8.5 Weighted Score = 4.00 4.25 Grand Total of Weighted Scores = 8.17 8.04 Vendor 1 Vendor 2 ∗ Vendor with highest score awarded contract
- 10. ∗ All requirements are translated into verifiable actions with pass/fail criteria August 201310 Acceptance Performance Metric Specification Measurement Pass/Fail Mechanical Performance Stage travel X (mm) 305 308 Pass Stage travel Y (mm) 505 510 Pass Stage travel Z (mm) 12 12.5 Pass Stage travel Theta (Deg) 7.5 7.7 Pass Accuracy X (um) 3 2.4 Pass Accuracy Y (um) 3 2.7 Pass Repeatability X (um) 1.5 1.2 Pass Repeatability Y (um) 1.5 1.3 Pass Repeatability Z (um) 1.5 1.1 Pass Thermal Performance Minimum Temp (C) -60 -60 Pass Maximum Temp (C) 200 200 Pass Uniformity (dig C) 0.1 0.1 Pass Ramp time 25C to 150C N/A 15.5 Acceptable Ramp time 150C to 25C N/A 22 Acceptable Performance Metric Specification Measurement Pass/Fail Electrical Performance Chuck Resistance - Force to Guard (ohm) 5.E+12 1.E+13 Pass Chuck Resistance - Force to Shield (ohm) 5.E+12 1.E+13 Pass Chuck Resistance - Guard to Shield (ohm) 5.E+12 9.E+12 Pass Chuck Breakdown - Force to Guard (V) 500 500 Pass Chuck Breakdown - Force to Shield (V) 500 500 Pass Chuck DC Leakage @ -40C (fA) 25 21 Pass Chuck DC Leakage @ -25C (fA) 15 12 Pass Chuck DC Leakage @ -200C (fA) 25 23 Pass Chuck AC Noise (mV p-p) 5 3 Pass
- 11. ∗ Created detailed specification with the lab team and requested proposals from multiple vendors for initial evaluation ∗ Selected top vendors and completed a detailed evaluation ∗ Selected the best-of-breed vendor and developed strong relationship resulting in the Cascade CM300 family of automatic analytical probers ∗ Drove progress throughout the development project and implementation with challenging acceptance criteria August 201311 Summary