Electromagnetic Interference and Electromagnetic Compatabiity
- 1. WEEK-4 ELECTROMAGNETIC AND INTERFERENCE (EMI) AND ELECTROMAGNETIC COMPATIBILITY (EMC) Electromagnetic Interference (EMI) “ It is phenomenon that is emites from any electronic or electrical device or other device in the from of electromagnetic devices.” Packaging engineers, and especially PWB designers, must be fimilier with the method of reducing or cancelling this EMI radiation to ensure that equipment will not exceed the limits of this interference.
- 2. Electromagnetic Compatibility (EMC) “ It is the ability of electrical and electronic device. It will not effected by any electromagnetic interference from any device or in electromagnetic interferenc environment .“ EMC involves major design considerations that ensure proper function within th electronic component, assembly or system • Limit the emission from one electronic component assembly or system, to another. • Reduce the susceptibility of an electronic component, assembly or system to external sources of EMF, EMI, or RFI.
- 3. There are three keys to EMC: • Design the product so that it produces less stray electromagnetic energy. • Design the product so that it is less susceptible to stay electromagnetic energy. • Design the product to prevent stray electromagnetic energy or leaving the product.
- 4. Thermal Issues in PCB 1. What is Thermal issues? 2. What are the thermal issues in PCB? Thermal issues are one of the most common and critical challenges in PCB design, especially for high-power,High-density or high-speed applications. 1. How does temperature affect PCB? • Loss of structural integrity. • Excessive heat can damage the integrity of PCB. • The layers of PCB are highly sensitive to fluctuations in temperature.
- 6. How to reduce thermal issues? • Placing of high-power component in PCB. • Placing of heat sink. • We can add cooling fance in device.