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Lecture 1:
Circuits &
Layout
1: Circuits & Layout 2
CMOS VLSI Design 4th Ed.
Outline
‰ A Brief History
‰ CMOS Gate Design
‰ Pass Transistors
‰ CMOS Latches & Flip-Flops
‰ Standard Cell Layouts
‰ Stick Diagrams
1: Circuits & Layout 3
CMOS VLSI Design 4th Ed.
A Brief History
‰ 1958: First integrated circuit
– Flip-flop using two transistors
– Built by Jack Kilby at Texas
Instruments
‰ 2010
– Intel Core i7 μprocessor
• 2.3 billion transistors
– 64 Gb Flash memory
• > 16 billion transistors
Courtesy Texas Instruments
[Trinh09]
© 2009 IEEE.
1: Circuits & Layout 4
CMOS VLSI Design 4th Ed.
Growth Rate
‰ 53% compound annual growth rate over 50 years
– No other technology has grown so fast so long
‰ Driven by miniaturization of transistors
– Smaller is cheaper, faster, lower in power!
– Revolutionary effects on society
[Moore65]
Electronics Magazine
1: Circuits & Layout 5
CMOS VLSI Design 4th Ed.
Annual Sales
‰ >1019 transistors manufactured in 2008
– 1 billion for every human on the planet
1: Circuits & Layout 6
CMOS VLSI Design 4th Ed.
Invention of the Transistor
‰ Vacuum tubes ruled in first half of 20th century
Large, expensive, power-hungry, unreliable
‰ 1947: first point contact transistor
– John Bardeen and Walter Brattain at Bell Labs
– See Crystal Fire
by Riordan, Hoddeson
AT&T Archives.
Reprinted with
permission.
1: Circuits & Layout 7
CMOS VLSI Design 4th Ed.
Transistor Types
‰ Bipolar transistors
– npn or pnp silicon structure
– Small current into very thin base layer controls
large currents between emitter and collector
– Base currents limit integration density
‰ Metal Oxide Semiconductor Field Effect Transistors
– nMOS and pMOS MOSFETS
– Voltage applied to insulated gate controls current
between source and drain
– Low power allows very high integration
1: Circuits & Layout 8
CMOS VLSI Design 4th Ed.
‰ 1970’s processes usually had only nMOS transistors
– Inexpensive, but consume power while idle
‰ 1980s-present: CMOS processes for low idle power
MOS Integrated Circuits
Intel 1101 256-bit SRAM Intel 4004 4-bit μProc
[Vadasz69]
© 1969 IEEE.
Intel
Museum.
Reprinted
with
permission.
1: Circuits & Layout 9
CMOS VLSI Design 4th Ed.
Moore’s Law: Then
‰ 1965: Gordon Moore plotted transistor on each chip
– Fit straight line on semilog scale
– Transistor counts have doubled every 26 months
Integration Levels
SSI: 10 gates
MSI: 1000 gates
LSI: 10,000 gates
VLSI: > 10k gates
[Moore65]
Electronics Magazine
1: Circuits & Layout 10
CMOS VLSI Design 4th Ed.
And Now…
1: Circuits & Layout 11
CMOS VLSI Design 4th Ed.
Feature Size
‰ Minimum feature size shrinking 30% every 2-3 years
1: Circuits & Layout 12
CMOS VLSI Design 4th Ed.
Corollaries
‰ Many other factors grow exponentially
– Ex: clock frequency, processor performance
1: Circuits & Layout 13
CMOS VLSI Design 4th Ed.
CMOS Gate Design
‰ Activity:
– Sketch a 4-input CMOS NOR gate
A
B
C
D
Y
1: Circuits & Layout 14
CMOS VLSI Design 4th Ed.
Complementary CMOS
‰ Complementary CMOS logic gates
– nMOS pull-down network
– pMOS pull-up network
– a.k.a. static CMOS
pMOS
pull-up
network
output
inputs
nMOS
pull-down
network
X (crowbar)
0
Pull-down ON
1
Z (float)
Pull-down OFF
Pull-up ON
Pull-up OFF
1: Circuits & Layout 15
CMOS VLSI Design 4th Ed.
Series and Parallel
‰ nMOS: 1 = ON
‰ pMOS: 0 = ON
‰ Series: both must be ON
‰ Parallel: either can be ON
(a)
a
b
a
b
g1
g2
0
0
a
b
0
1
a
b
1
0
a
b
1
1
OFF OFF OFF ON
(b)
a
b
a
b
g1
g2
0
0
a
b
0
1
a
b
1
0
a
b
1
1
ON OFF OFF OFF
(c)
a
b
a
b
g1 g2 0 0
OFF ON ON ON
(d) ON ON ON OFF
a
b
0
a
b
1
a
b
1
1 0 1
a
b
0 0
a
b
0
a
b
1
a
b
1
1 0 1
a
b
g1 g2
1: Circuits & Layout 16
CMOS VLSI Design 4th Ed.
Conduction Complement
‰ Complementary CMOS gates always produce 0 or 1
‰ Ex: NAND gate
– Series nMOS: Y=0 when both inputs are 1
– Thus Y=1 when either input is 0
– Requires parallel pMOS
‰ Rule of Conduction Complements
– Pull-up network is complement of pull-down
– Parallel -> series, series -> parallel
A
B
Y
1: Circuits & Layout 17
CMOS VLSI Design 4th Ed.
Compound Gates
‰ Compound gates can do any inverting function
‰ Ex: (AND-AND-OR-INVERT, AOI22)
Y A B C D
= +
i i
A
B
C
D
A
B
C
D
A B C D
A B
C D
B
D
Y
A
C
A
C
A
B
C
D
B
D
Y
(a)
(c)
(e)
(b)
(d)
(f)
1: Circuits & Layout 18
CMOS VLSI Design 4th Ed.
Example: O3AI
‰ ( )
Y A B C D
= + + i
A B
Y
C
D
D
C
B
A
1: Circuits & Layout 19
CMOS VLSI Design 4th Ed.
Signal Strength
‰ Strength of signal
– How close it approximates ideal voltage source
‰ VDD and GND rails are strongest 1 and 0
‰ nMOS pass strong 0
– But degraded or weak 1
‰ pMOS pass strong 1
– But degraded or weak 0
‰ Thus nMOS are best for pull-down network
1: Circuits & Layout 20
CMOS VLSI Design 4th Ed.
Pass Transistors
‰ Transistors can be used as switches
1: Circuits & Layout 21
CMOS VLSI Design 4th Ed.
Transmission Gates
‰ Pass transistors produce degraded outputs
‰ Transmission gates pass both 0 and 1 well
g = 0, gb = 1
a b
g = 1, gb = 0
a b
0 strong 0
Input Output
1 strong 1
g
gb
a b
a b
g
gb
a b
g
gb
a b
g
gb
g = 1, gb = 0
g = 1, gb = 0
1: Circuits & Layout 22
CMOS VLSI Design 4th Ed.
Tristates
‰ Tristate buffer produces Z when not enabled
1
1
1
0
0
1
Z
1
0
Z
0
0
Y
A
EN
A Y
EN
A Y
EN
EN
1: Circuits & Layout 23
CMOS VLSI Design 4th Ed.
Nonrestoring Tristate
‰ Transmission gate acts as tristate buffer
– Only two transistors
– But nonrestoring
• Noise on A is passed on to Y
A Y
EN
EN
1: Circuits & Layout 24
CMOS VLSI Design 4th Ed.
Tristate Inverter
‰ Tristate inverter produces restored output
– Violates conduction complement rule
– Because we want a Z output
A
Y
EN
A
Y
EN = 0
Y = 'Z'
Y
EN = 1
Y = A
A
EN
1: Circuits & Layout 25
CMOS VLSI Design 4th Ed.
Multiplexers
‰ 2:1 multiplexer chooses between two inputs
1
X
1
1
0
X
0
1
1
1
X
0
0
0
X
0
Y
D0
D1
S
0
1
S
D0
D1
Y
1: Circuits & Layout 26
CMOS VLSI Design 4th Ed.
Gate-Level Mux Design
‰
‰ How many transistors are needed? 20
1 0 (too many transistors)
Y SD SD
= +
4
4
D1
D0
S Y
4
2
2
2 Y
2
D1
D0
S
1: Circuits & Layout 27
CMOS VLSI Design 4th Ed.
Transmission Gate Mux
‰ Nonrestoring mux uses two transmission gates
– Only 4 transistors
S
S
D0
D1
Y
S
1: Circuits & Layout 28
CMOS VLSI Design 4th Ed.
Inverting Mux
‰ Inverting multiplexer
– Use compound AOI22
– Or pair of tristate inverters
– Essentially the same thing
‰ Noninverting multiplexer adds an inverter
S
D0 D1
Y
S
D0
D1
Y
0
1
S
Y
D0
D1
S
S
S
S
S
S
1: Circuits & Layout 29
CMOS VLSI Design 4th Ed.
4:1 Multiplexer
‰ 4:1 mux chooses one of 4 inputs using two selects
– Two levels of 2:1 muxes
– Or four tristates
S0
D0
D1
0
1
0
1
0
1
Y
S1
D2
D3
D0
D1
D2
D3
Y
S1S0 S1S0 S1S0 S1S0
1: Circuits & Layout 30
CMOS VLSI Design 4th Ed.
D Latch
‰ When CLK = 1, latch is transparent
– D flows through to Q like a buffer
‰ When CLK = 0, the latch is opaque
– Q holds its old value independent of D
‰ a.k.a. transparent latch or level-sensitive latch
CLK
D Q
Latch
D
CLK
Q
1: Circuits & Layout 31
CMOS VLSI Design 4th Ed.
D Latch Design
‰ Multiplexer chooses D or old Q
1
0
D
CLK
Q
CLK
CLK
CLK
CLK
D
Q Q
Q
1: Circuits & Layout 32
CMOS VLSI Design 4th Ed.
D Latch Operation
CLK = 1
D Q
Q
CLK = 0
D Q
Q
D
CLK
Q
1: Circuits & Layout 33
CMOS VLSI Design 4th Ed.
D Flip-flop
‰ When CLK rises, D is copied to Q
‰ At all other times, Q holds its value
‰ a.k.a. positive edge-triggered flip-flop, master-slave
flip-flop
Flop
CLK
D Q
D
CLK
Q
1: Circuits & Layout 34
CMOS VLSI Design 4th Ed.
D Flip-flop Design
‰ Built from master and slave D latches
QM
CLK
CLK
CLK
CLK
Q
CLK
CLK
CLK
CLK
D
Latch
Latch
D Q
QM
CLK
CLK
1: Circuits & Layout 35
CMOS VLSI Design 4th Ed.
D Flip-flop Operation
CLK = 1
D
CLK = 0
Q
D
QM
QM
Q
D
CLK
Q
1: Circuits & Layout 36
CMOS VLSI Design 4th Ed.
Race Condition
‰ Back-to-back flops can malfunction from clock skew
– Second flip-flop fires late
– Sees first flip-flop change and captures its result
– Called hold-time failure or race condition
CLK1
D
Q1
Flop
Flop
CLK2
Q2
CLK1
CLK2
Q1
Q2
1: Circuits & Layout 37
CMOS VLSI Design 4th Ed.
Nonoverlapping Clocks
‰ Nonoverlapping clocks can prevent races
– As long as nonoverlap exceeds clock skew
‰ We will use them in this class for safe design
– Industry manages skew more carefully instead
φ1
φ1
φ1
φ1
φ2
φ2
φ2
φ2
φ2
φ1
QM
Q
D
1: Circuits & Layout 38
CMOS VLSI Design 4th Ed.
Gate Layout
‰ Layout can be very time consuming
– Design gates to fit together nicely
– Build a library of standard cells
‰ Standard cell design methodology
– VDD and GND should abut (standard height)
– Adjacent gates should satisfy design rules
– nMOS at bottom and pMOS at top
– All gates include well and substrate contacts
1: Circuits & Layout 39
CMOS VLSI Design 4th Ed.
Example: Inverter
1: Circuits & Layout 40
CMOS VLSI Design 4th Ed.
Example: NAND3
‰ Horizontal N-diffusion and p-diffusion strips
‰ Vertical polysilicon gates
‰ Metal1 VDD rail at top
‰ Metal1 GND rail at bottom
‰ 32 λ by 40 λ
1: Circuits & Layout 41
CMOS VLSI Design 4th Ed.
Stick Diagrams
‰ Stick diagrams help plan layout quickly
– Need not be to scale
– Draw with color pencils or dry-erase markers
c
A
VDD
GND
Y
A
VDD
GND
B C
Y
INV
metal1
poly
ndiff
pdiff
contact
NAND3
1: Circuits & Layout 42
CMOS VLSI Design 4th Ed.
Wiring Tracks
‰ A wiring track is the space required for a wire
– 4 λ width, 4 λ spacing from neighbor = 8 λ pitch
‰ Transistors also consume one wiring track
1: Circuits & Layout 43
CMOS VLSI Design 4th Ed.
Well spacing
‰ Wells must surround transistors by 6 λ
– Implies 12 λ between opposite transistor flavors
– Leaves room for one wire track
1: Circuits & Layout 44
CMOS VLSI Design 4th Ed.
32
40
Area Estimation
‰ Estimate area by counting wiring tracks
– Multiply by 8 to express in λ
1: Circuits & Layout 45
CMOS VLSI Design 4th Ed.
Example: O3AI
‰ Sketch a stick diagram for O3AI and estimate area
– ( )
Y A B C D
= + + i
A
VDD
GND
B C
Y
D
6 tracks =
48 λ
5 tracks =
40 λ

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Lecture on Introduction to VLSI circuits and layouts

  • 2. 1: Circuits & Layout 2 CMOS VLSI Design 4th Ed. Outline ‰ A Brief History ‰ CMOS Gate Design ‰ Pass Transistors ‰ CMOS Latches & Flip-Flops ‰ Standard Cell Layouts ‰ Stick Diagrams
  • 3. 1: Circuits & Layout 3 CMOS VLSI Design 4th Ed. A Brief History ‰ 1958: First integrated circuit – Flip-flop using two transistors – Built by Jack Kilby at Texas Instruments ‰ 2010 – Intel Core i7 μprocessor • 2.3 billion transistors – 64 Gb Flash memory • > 16 billion transistors Courtesy Texas Instruments [Trinh09] © 2009 IEEE.
  • 4. 1: Circuits & Layout 4 CMOS VLSI Design 4th Ed. Growth Rate ‰ 53% compound annual growth rate over 50 years – No other technology has grown so fast so long ‰ Driven by miniaturization of transistors – Smaller is cheaper, faster, lower in power! – Revolutionary effects on society [Moore65] Electronics Magazine
  • 5. 1: Circuits & Layout 5 CMOS VLSI Design 4th Ed. Annual Sales ‰ >1019 transistors manufactured in 2008 – 1 billion for every human on the planet
  • 6. 1: Circuits & Layout 6 CMOS VLSI Design 4th Ed. Invention of the Transistor ‰ Vacuum tubes ruled in first half of 20th century Large, expensive, power-hungry, unreliable ‰ 1947: first point contact transistor – John Bardeen and Walter Brattain at Bell Labs – See Crystal Fire by Riordan, Hoddeson AT&T Archives. Reprinted with permission.
  • 7. 1: Circuits & Layout 7 CMOS VLSI Design 4th Ed. Transistor Types ‰ Bipolar transistors – npn or pnp silicon structure – Small current into very thin base layer controls large currents between emitter and collector – Base currents limit integration density ‰ Metal Oxide Semiconductor Field Effect Transistors – nMOS and pMOS MOSFETS – Voltage applied to insulated gate controls current between source and drain – Low power allows very high integration
  • 8. 1: Circuits & Layout 8 CMOS VLSI Design 4th Ed. ‰ 1970’s processes usually had only nMOS transistors – Inexpensive, but consume power while idle ‰ 1980s-present: CMOS processes for low idle power MOS Integrated Circuits Intel 1101 256-bit SRAM Intel 4004 4-bit μProc [Vadasz69] © 1969 IEEE. Intel Museum. Reprinted with permission.
  • 9. 1: Circuits & Layout 9 CMOS VLSI Design 4th Ed. Moore’s Law: Then ‰ 1965: Gordon Moore plotted transistor on each chip – Fit straight line on semilog scale – Transistor counts have doubled every 26 months Integration Levels SSI: 10 gates MSI: 1000 gates LSI: 10,000 gates VLSI: > 10k gates [Moore65] Electronics Magazine
  • 10. 1: Circuits & Layout 10 CMOS VLSI Design 4th Ed. And Now…
  • 11. 1: Circuits & Layout 11 CMOS VLSI Design 4th Ed. Feature Size ‰ Minimum feature size shrinking 30% every 2-3 years
  • 12. 1: Circuits & Layout 12 CMOS VLSI Design 4th Ed. Corollaries ‰ Many other factors grow exponentially – Ex: clock frequency, processor performance
  • 13. 1: Circuits & Layout 13 CMOS VLSI Design 4th Ed. CMOS Gate Design ‰ Activity: – Sketch a 4-input CMOS NOR gate A B C D Y
  • 14. 1: Circuits & Layout 14 CMOS VLSI Design 4th Ed. Complementary CMOS ‰ Complementary CMOS logic gates – nMOS pull-down network – pMOS pull-up network – a.k.a. static CMOS pMOS pull-up network output inputs nMOS pull-down network X (crowbar) 0 Pull-down ON 1 Z (float) Pull-down OFF Pull-up ON Pull-up OFF
  • 15. 1: Circuits & Layout 15 CMOS VLSI Design 4th Ed. Series and Parallel ‰ nMOS: 1 = ON ‰ pMOS: 0 = ON ‰ Series: both must be ON ‰ Parallel: either can be ON (a) a b a b g1 g2 0 0 a b 0 1 a b 1 0 a b 1 1 OFF OFF OFF ON (b) a b a b g1 g2 0 0 a b 0 1 a b 1 0 a b 1 1 ON OFF OFF OFF (c) a b a b g1 g2 0 0 OFF ON ON ON (d) ON ON ON OFF a b 0 a b 1 a b 1 1 0 1 a b 0 0 a b 0 a b 1 a b 1 1 0 1 a b g1 g2
  • 16. 1: Circuits & Layout 16 CMOS VLSI Design 4th Ed. Conduction Complement ‰ Complementary CMOS gates always produce 0 or 1 ‰ Ex: NAND gate – Series nMOS: Y=0 when both inputs are 1 – Thus Y=1 when either input is 0 – Requires parallel pMOS ‰ Rule of Conduction Complements – Pull-up network is complement of pull-down – Parallel -> series, series -> parallel A B Y
  • 17. 1: Circuits & Layout 17 CMOS VLSI Design 4th Ed. Compound Gates ‰ Compound gates can do any inverting function ‰ Ex: (AND-AND-OR-INVERT, AOI22) Y A B C D = + i i A B C D A B C D A B C D A B C D B D Y A C A C A B C D B D Y (a) (c) (e) (b) (d) (f)
  • 18. 1: Circuits & Layout 18 CMOS VLSI Design 4th Ed. Example: O3AI ‰ ( ) Y A B C D = + + i A B Y C D D C B A
  • 19. 1: Circuits & Layout 19 CMOS VLSI Design 4th Ed. Signal Strength ‰ Strength of signal – How close it approximates ideal voltage source ‰ VDD and GND rails are strongest 1 and 0 ‰ nMOS pass strong 0 – But degraded or weak 1 ‰ pMOS pass strong 1 – But degraded or weak 0 ‰ Thus nMOS are best for pull-down network
  • 20. 1: Circuits & Layout 20 CMOS VLSI Design 4th Ed. Pass Transistors ‰ Transistors can be used as switches
  • 21. 1: Circuits & Layout 21 CMOS VLSI Design 4th Ed. Transmission Gates ‰ Pass transistors produce degraded outputs ‰ Transmission gates pass both 0 and 1 well g = 0, gb = 1 a b g = 1, gb = 0 a b 0 strong 0 Input Output 1 strong 1 g gb a b a b g gb a b g gb a b g gb g = 1, gb = 0 g = 1, gb = 0
  • 22. 1: Circuits & Layout 22 CMOS VLSI Design 4th Ed. Tristates ‰ Tristate buffer produces Z when not enabled 1 1 1 0 0 1 Z 1 0 Z 0 0 Y A EN A Y EN A Y EN EN
  • 23. 1: Circuits & Layout 23 CMOS VLSI Design 4th Ed. Nonrestoring Tristate ‰ Transmission gate acts as tristate buffer – Only two transistors – But nonrestoring • Noise on A is passed on to Y A Y EN EN
  • 24. 1: Circuits & Layout 24 CMOS VLSI Design 4th Ed. Tristate Inverter ‰ Tristate inverter produces restored output – Violates conduction complement rule – Because we want a Z output A Y EN A Y EN = 0 Y = 'Z' Y EN = 1 Y = A A EN
  • 25. 1: Circuits & Layout 25 CMOS VLSI Design 4th Ed. Multiplexers ‰ 2:1 multiplexer chooses between two inputs 1 X 1 1 0 X 0 1 1 1 X 0 0 0 X 0 Y D0 D1 S 0 1 S D0 D1 Y
  • 26. 1: Circuits & Layout 26 CMOS VLSI Design 4th Ed. Gate-Level Mux Design ‰ ‰ How many transistors are needed? 20 1 0 (too many transistors) Y SD SD = + 4 4 D1 D0 S Y 4 2 2 2 Y 2 D1 D0 S
  • 27. 1: Circuits & Layout 27 CMOS VLSI Design 4th Ed. Transmission Gate Mux ‰ Nonrestoring mux uses two transmission gates – Only 4 transistors S S D0 D1 Y S
  • 28. 1: Circuits & Layout 28 CMOS VLSI Design 4th Ed. Inverting Mux ‰ Inverting multiplexer – Use compound AOI22 – Or pair of tristate inverters – Essentially the same thing ‰ Noninverting multiplexer adds an inverter S D0 D1 Y S D0 D1 Y 0 1 S Y D0 D1 S S S S S S
  • 29. 1: Circuits & Layout 29 CMOS VLSI Design 4th Ed. 4:1 Multiplexer ‰ 4:1 mux chooses one of 4 inputs using two selects – Two levels of 2:1 muxes – Or four tristates S0 D0 D1 0 1 0 1 0 1 Y S1 D2 D3 D0 D1 D2 D3 Y S1S0 S1S0 S1S0 S1S0
  • 30. 1: Circuits & Layout 30 CMOS VLSI Design 4th Ed. D Latch ‰ When CLK = 1, latch is transparent – D flows through to Q like a buffer ‰ When CLK = 0, the latch is opaque – Q holds its old value independent of D ‰ a.k.a. transparent latch or level-sensitive latch CLK D Q Latch D CLK Q
  • 31. 1: Circuits & Layout 31 CMOS VLSI Design 4th Ed. D Latch Design ‰ Multiplexer chooses D or old Q 1 0 D CLK Q CLK CLK CLK CLK D Q Q Q
  • 32. 1: Circuits & Layout 32 CMOS VLSI Design 4th Ed. D Latch Operation CLK = 1 D Q Q CLK = 0 D Q Q D CLK Q
  • 33. 1: Circuits & Layout 33 CMOS VLSI Design 4th Ed. D Flip-flop ‰ When CLK rises, D is copied to Q ‰ At all other times, Q holds its value ‰ a.k.a. positive edge-triggered flip-flop, master-slave flip-flop Flop CLK D Q D CLK Q
  • 34. 1: Circuits & Layout 34 CMOS VLSI Design 4th Ed. D Flip-flop Design ‰ Built from master and slave D latches QM CLK CLK CLK CLK Q CLK CLK CLK CLK D Latch Latch D Q QM CLK CLK
  • 35. 1: Circuits & Layout 35 CMOS VLSI Design 4th Ed. D Flip-flop Operation CLK = 1 D CLK = 0 Q D QM QM Q D CLK Q
  • 36. 1: Circuits & Layout 36 CMOS VLSI Design 4th Ed. Race Condition ‰ Back-to-back flops can malfunction from clock skew – Second flip-flop fires late – Sees first flip-flop change and captures its result – Called hold-time failure or race condition CLK1 D Q1 Flop Flop CLK2 Q2 CLK1 CLK2 Q1 Q2
  • 37. 1: Circuits & Layout 37 CMOS VLSI Design 4th Ed. Nonoverlapping Clocks ‰ Nonoverlapping clocks can prevent races – As long as nonoverlap exceeds clock skew ‰ We will use them in this class for safe design – Industry manages skew more carefully instead φ1 φ1 φ1 φ1 φ2 φ2 φ2 φ2 φ2 φ1 QM Q D
  • 38. 1: Circuits & Layout 38 CMOS VLSI Design 4th Ed. Gate Layout ‰ Layout can be very time consuming – Design gates to fit together nicely – Build a library of standard cells ‰ Standard cell design methodology – VDD and GND should abut (standard height) – Adjacent gates should satisfy design rules – nMOS at bottom and pMOS at top – All gates include well and substrate contacts
  • 39. 1: Circuits & Layout 39 CMOS VLSI Design 4th Ed. Example: Inverter
  • 40. 1: Circuits & Layout 40 CMOS VLSI Design 4th Ed. Example: NAND3 ‰ Horizontal N-diffusion and p-diffusion strips ‰ Vertical polysilicon gates ‰ Metal1 VDD rail at top ‰ Metal1 GND rail at bottom ‰ 32 λ by 40 λ
  • 41. 1: Circuits & Layout 41 CMOS VLSI Design 4th Ed. Stick Diagrams ‰ Stick diagrams help plan layout quickly – Need not be to scale – Draw with color pencils or dry-erase markers c A VDD GND Y A VDD GND B C Y INV metal1 poly ndiff pdiff contact NAND3
  • 42. 1: Circuits & Layout 42 CMOS VLSI Design 4th Ed. Wiring Tracks ‰ A wiring track is the space required for a wire – 4 λ width, 4 λ spacing from neighbor = 8 λ pitch ‰ Transistors also consume one wiring track
  • 43. 1: Circuits & Layout 43 CMOS VLSI Design 4th Ed. Well spacing ‰ Wells must surround transistors by 6 λ – Implies 12 λ between opposite transistor flavors – Leaves room for one wire track
  • 44. 1: Circuits & Layout 44 CMOS VLSI Design 4th Ed. 32 40 Area Estimation ‰ Estimate area by counting wiring tracks – Multiply by 8 to express in λ
  • 45. 1: Circuits & Layout 45 CMOS VLSI Design 4th Ed. Example: O3AI ‰ Sketch a stick diagram for O3AI and estimate area – ( ) Y A B C D = + + i A VDD GND B C Y D 6 tracks = 48 λ 5 tracks = 40 λ