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Need of Quality Engineering and Failure analysis 
Techniques 
9th Module Presentation 
M. Sc. (Engg.) in Electronics System Design 
Engineering 
GREESHMA S 
CWB0913004 , FT-2013 
Module code : ESE2515 
Module name : Mechanical Aspects of Electronic 
System Design 
Module leader : Mr. Ugra Mohan 
Presentation on : 25/08/2014 
M. S. Ramaiah School of Advanced Studies 1
Overview 
FAT 
1.INTRODUCTION 
2. Importance of Failure Analysis 
3.Classification of tests to capture failures 
4. Failure Analysis for Electrical Overstress [EoS] 
5. Failure Rate Curve 
6. Role of FA in Electronic Component 
7. FA Techniques 
M. S. Ramaiah School of Advanced Studies 2 
QE 
1.INTRODUCTION 
2.Authors View 
3.Taguchi Loss Functions 
4.Taguchi Robust Design 
5. Examples 
• CONCLUSION • REFERENCES
Introduction 
THE overall objective of quality assurance is customer satisfaction. Conformance to customer 
requirements is a basic requisite for this. Quality of delivery and dependability are the major 
properties used in the quality evaluations 
Quality engineering results in reliable products that meet the needs of the user, performs its 
mission without variation, increases combat capability and has low monetary losses 
The quality engineering concepts developed by Genichi Taguchi are the key to making the 
seemingly incompatible goals of achieving high reliability and maintainability for future weapon 
systems at reduced development, production, and operation costs 
Taguchi’s quality engineering process was used in the conceptual design of a unique flight 
vehicle 
 From the viewpoint of quality engineering, the downstream quality problems of a product are 
symptoms of its functional instability (lack of robustness) 
M. S. Ramaiah School of Advanced Studies 3
Authors View 
► Different authors have given various definitions of QE. Krishnamurthy [1] defined the term QE 
as: the discipline that includes the technical methods, management and costing approaches, 
statistical problem-solving tools, training and motivational methods, computer information 
systems, and all the sciences behind them that are needed for designing, producing and delivering 
products and services to satisfy customer needs 
► Taguchi [1] described quality engineering as the technique used to improve performance and 
reduce functional variations caused by three types of noises, namely, environnemental conditions 
(outer noise), deterioration (inner noise) and manufacturing imperfection. He noted that the overall 
aim of quality engineering is to produce products that are robust to all noise factors. Taguchi 
separates quality control activities into two parts, which are off-line quality control and online 
quality control 
M. S. Ramaiah School of Advanced Studies 4
► Gaspersz [1] defines quality engineering (QE) as the analysis of a manufacturing system at 
all stages to maximize the quality of the process and the product it produces. QE have become 
very important in every organization including whether manufacturing industry, ceramic and 
paint industry, chemical manufacturer, hospital, education, business and others, and there are 
many tools and techniques created to be implemented in order to be leader among their 
challenge 
► Quality engineering may be defined as follows: 'Engineering work related to the 
conformance of the output of a production line with specification. It involves the design of 
quality systems and the investigation of nonconformance with feedback for corrective action. 
This can only be achieved by creative interaction with the other functions in a manufacturing 
unit 
M. S. Ramaiah School of Advanced Studies 5
Loss Functions by Taguchi 
that excessive variation lay at the root of poor manufactured quality and that reacting to 
individual items inside and outside specification was counterproductive. understanding 
of quality costs in various situations 
Figure 1: A Comparison of Methodologies [2] Figure 2: Taguchi Loss Function[2] 
M. S. Ramaiah School of Advanced Studies 6
Taguchi Robust Design 
Figure 3: Taguchi Robust Design[2] 
M. S. Ramaiah School of Advanced Studies 7
Examples 
Improves overall quality, improves programs, initiatives root cause and Manufactured practices, 
Improved Productivity, 
Table 1: Examples of Taguchi QE and Robust Design [1] 
M. S. Ramaiah School of Advanced Studies 8
Introduction 
Failure Analysis (FA) is a process of collecting and analyzing data to determine the cause 
of failure. E.g. Failed components are taken for analysis and determine cause of the failure 
using a wide array of methods and techniques 
 Failure analysis engineers often play the lead role in this department 
Types of failures can be due to component, manufacturing or during production processing 
Failure analysis (FA) capability supports the development of semiconductor technology 
and packaging. Failure analysts need new techniques and advanced equipment to match the 
rate of Moore's Law so that problem solving can remain efficient and accurate 
Moore's Law is the observation made in 1965 by Gordon Moore, co-founder of Intel, that 
the number of transistors per square inch on integrated circuits has doubled every year since 
the integrated circuit was invented 
M. S. Ramaiah School of Advanced Studies 9
Importance of Failure Analysis 
• Electronic parts, why they fail? 
• Preserve failure mechanism, don’t loose 
(Carelessness) 
• Failure of Critical applications e.g. Space 
satellite systems 
• Big loss due to chain reaction 
Figure 4: Failure Mechanism [FRACAS] [3] Figure 5: Chain reaction [3] 
M. S. Ramaiah School of Advanced Studies 10
Classification of tests to capture failures [5] 
• Environmental Tests 
Temperature operating conditions, corrosion etc 
• Mechanical Tests 
Packaging, Materials, insulation resistance etc 
• Electrical Tests 
Electrical overstress, ground bounce etc 
• Test Procedure, analysis and results 
Documentation of the overall results, analysis and the desired modifications 
M. S. Ramaiah School of Advanced Studies 11
Failure Analysis for Electrical Overstress [EoS] 
• EOS- Thermal damage due to V or I beyond 
limit specification 
• Trace VI curve for i/p’s of each part “ part 
characterization” 
•Causes: [4] 
a. Poor grounding 
b.EMI 
c. Uncontrolled supply 
d. latchup 
M. S. Ramaiah School of Advanced Studies 12
Failure Rate Curve 
Figure 6: Failure Rate Curve [4] 
M. S. Ramaiah School of Advanced Studies 13
Role of FA in Electronic Component [4] 
M. S. Ramaiah School of Advanced Studies 14
FA Techniques [5] 
M. S. Ramaiah School of Advanced Studies 15
Conclusion 
To prevent thermally- induced failures in electronic systems and to achieve a high reliability 
of operation quality engineering is needed. Loss function, robust design clearly signifies the 
QE role. FRACAS failure mechanism , EoS , Failure rate curve focused on need for failure 
analysis. 
M. S. Ramaiah School of Advanced Studies 16
Reference 
1. Jinyu Wang (2008). Robust Design Method in Quality Engineering and Its Application. China: 
School of Economy and Management,. 2570-2576. 
2. Ed Pohl (2009). SYSTEM DESIGN WITH QUALITY ENGINEERING. Usa: Wright-Patterson 
M. S. Ramaiah School of Advanced Studies 17 
AFB. 26-38. 
3. Walter Willing, Jonathan Fleisher & Michael Cascio (2012) ,“Electronic Part Failure 
Analysis Tools and Techniques” Northrop Grumman Corporation, USA. 
4. ITEM Software, Inc (2007) ,“Reliability Prediction Basics” USA. 
5. Jim Glancey (2006), “Failure Analysis Methods What, Why and How” USA.
Thank You 
M. S. Ramaiah School of Advanced Studies 18

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Need of Quality Engineering and Failure analysis Techniques

  • 1. Need of Quality Engineering and Failure analysis Techniques 9th Module Presentation M. Sc. (Engg.) in Electronics System Design Engineering GREESHMA S CWB0913004 , FT-2013 Module code : ESE2515 Module name : Mechanical Aspects of Electronic System Design Module leader : Mr. Ugra Mohan Presentation on : 25/08/2014 M. S. Ramaiah School of Advanced Studies 1
  • 2. Overview FAT 1.INTRODUCTION 2. Importance of Failure Analysis 3.Classification of tests to capture failures 4. Failure Analysis for Electrical Overstress [EoS] 5. Failure Rate Curve 6. Role of FA in Electronic Component 7. FA Techniques M. S. Ramaiah School of Advanced Studies 2 QE 1.INTRODUCTION 2.Authors View 3.Taguchi Loss Functions 4.Taguchi Robust Design 5. Examples • CONCLUSION • REFERENCES
  • 3. Introduction THE overall objective of quality assurance is customer satisfaction. Conformance to customer requirements is a basic requisite for this. Quality of delivery and dependability are the major properties used in the quality evaluations Quality engineering results in reliable products that meet the needs of the user, performs its mission without variation, increases combat capability and has low monetary losses The quality engineering concepts developed by Genichi Taguchi are the key to making the seemingly incompatible goals of achieving high reliability and maintainability for future weapon systems at reduced development, production, and operation costs Taguchi’s quality engineering process was used in the conceptual design of a unique flight vehicle  From the viewpoint of quality engineering, the downstream quality problems of a product are symptoms of its functional instability (lack of robustness) M. S. Ramaiah School of Advanced Studies 3
  • 4. Authors View ► Different authors have given various definitions of QE. Krishnamurthy [1] defined the term QE as: the discipline that includes the technical methods, management and costing approaches, statistical problem-solving tools, training and motivational methods, computer information systems, and all the sciences behind them that are needed for designing, producing and delivering products and services to satisfy customer needs ► Taguchi [1] described quality engineering as the technique used to improve performance and reduce functional variations caused by three types of noises, namely, environnemental conditions (outer noise), deterioration (inner noise) and manufacturing imperfection. He noted that the overall aim of quality engineering is to produce products that are robust to all noise factors. Taguchi separates quality control activities into two parts, which are off-line quality control and online quality control M. S. Ramaiah School of Advanced Studies 4
  • 5. ► Gaspersz [1] defines quality engineering (QE) as the analysis of a manufacturing system at all stages to maximize the quality of the process and the product it produces. QE have become very important in every organization including whether manufacturing industry, ceramic and paint industry, chemical manufacturer, hospital, education, business and others, and there are many tools and techniques created to be implemented in order to be leader among their challenge ► Quality engineering may be defined as follows: 'Engineering work related to the conformance of the output of a production line with specification. It involves the design of quality systems and the investigation of nonconformance with feedback for corrective action. This can only be achieved by creative interaction with the other functions in a manufacturing unit M. S. Ramaiah School of Advanced Studies 5
  • 6. Loss Functions by Taguchi that excessive variation lay at the root of poor manufactured quality and that reacting to individual items inside and outside specification was counterproductive. understanding of quality costs in various situations Figure 1: A Comparison of Methodologies [2] Figure 2: Taguchi Loss Function[2] M. S. Ramaiah School of Advanced Studies 6
  • 7. Taguchi Robust Design Figure 3: Taguchi Robust Design[2] M. S. Ramaiah School of Advanced Studies 7
  • 8. Examples Improves overall quality, improves programs, initiatives root cause and Manufactured practices, Improved Productivity, Table 1: Examples of Taguchi QE and Robust Design [1] M. S. Ramaiah School of Advanced Studies 8
  • 9. Introduction Failure Analysis (FA) is a process of collecting and analyzing data to determine the cause of failure. E.g. Failed components are taken for analysis and determine cause of the failure using a wide array of methods and techniques  Failure analysis engineers often play the lead role in this department Types of failures can be due to component, manufacturing or during production processing Failure analysis (FA) capability supports the development of semiconductor technology and packaging. Failure analysts need new techniques and advanced equipment to match the rate of Moore's Law so that problem solving can remain efficient and accurate Moore's Law is the observation made in 1965 by Gordon Moore, co-founder of Intel, that the number of transistors per square inch on integrated circuits has doubled every year since the integrated circuit was invented M. S. Ramaiah School of Advanced Studies 9
  • 10. Importance of Failure Analysis • Electronic parts, why they fail? • Preserve failure mechanism, don’t loose (Carelessness) • Failure of Critical applications e.g. Space satellite systems • Big loss due to chain reaction Figure 4: Failure Mechanism [FRACAS] [3] Figure 5: Chain reaction [3] M. S. Ramaiah School of Advanced Studies 10
  • 11. Classification of tests to capture failures [5] • Environmental Tests Temperature operating conditions, corrosion etc • Mechanical Tests Packaging, Materials, insulation resistance etc • Electrical Tests Electrical overstress, ground bounce etc • Test Procedure, analysis and results Documentation of the overall results, analysis and the desired modifications M. S. Ramaiah School of Advanced Studies 11
  • 12. Failure Analysis for Electrical Overstress [EoS] • EOS- Thermal damage due to V or I beyond limit specification • Trace VI curve for i/p’s of each part “ part characterization” •Causes: [4] a. Poor grounding b.EMI c. Uncontrolled supply d. latchup M. S. Ramaiah School of Advanced Studies 12
  • 13. Failure Rate Curve Figure 6: Failure Rate Curve [4] M. S. Ramaiah School of Advanced Studies 13
  • 14. Role of FA in Electronic Component [4] M. S. Ramaiah School of Advanced Studies 14
  • 15. FA Techniques [5] M. S. Ramaiah School of Advanced Studies 15
  • 16. Conclusion To prevent thermally- induced failures in electronic systems and to achieve a high reliability of operation quality engineering is needed. Loss function, robust design clearly signifies the QE role. FRACAS failure mechanism , EoS , Failure rate curve focused on need for failure analysis. M. S. Ramaiah School of Advanced Studies 16
  • 17. Reference 1. Jinyu Wang (2008). Robust Design Method in Quality Engineering and Its Application. China: School of Economy and Management,. 2570-2576. 2. Ed Pohl (2009). SYSTEM DESIGN WITH QUALITY ENGINEERING. Usa: Wright-Patterson M. S. Ramaiah School of Advanced Studies 17 AFB. 26-38. 3. Walter Willing, Jonathan Fleisher & Michael Cascio (2012) ,“Electronic Part Failure Analysis Tools and Techniques” Northrop Grumman Corporation, USA. 4. ITEM Software, Inc (2007) ,“Reliability Prediction Basics” USA. 5. Jim Glancey (2006), “Failure Analysis Methods What, Why and How” USA.
  • 18. Thank You M. S. Ramaiah School of Advanced Studies 18