Pactron Ate Introduction

About Pactron Founded in 1988 Headquarters in Sunnyvale, CA Support centers in Dallas & Penang Design Centers in India PCBA Engineering, Design, & Manufacturing Semiconductor related services Telecom, industrial & medical Registered to ISO9001 Diversified and long standing customer base Pactron Confidential

The Pactron Team Designers: (Calif. & India) Utilize at least 12hr+ days, enabling customers to get designs done faster. Approximately 50+ designs a month with room to increase capacity! Dedicated Scalable Team for Texas Instruments Which in turn gives you zero wait time, no queue! Engineering: (Calif. & India) Applications plays a key role!! Technical Interface between the customers & Pactron Provide Project Management ~ single point of contact Manufacturing: Handle High Layer count boards: 50layers .325” thick Hybrid materials…Rogers/ Nelco / Gtek /FR-4 Complete coordination with FAB, parts procurement, and assembly & test Pactron Confidential

Broad Product Range Product Evaluation Boards Reference Designs Validation Boards Evaluation / Demo Kits Emulation Boards TIU Boards Test Load Boards DUT Cards ESD Test Boards Characterization Boards System Boards Motherboards / PCI Cards Power supply and driver boards System Integration / Box Build Flex Circuits Pactron Confidential

Pactron’s End to End Services Pactron Confidential Design & Engineering Manufacturing Design Layout Simulation Analysis Parts Procurement PCB Fab/ Assembly Test Schematic Capture Orcad Concept DX Designer WG2K Allegro Expedition PADS Altium Ansoft HFSS - 3D Modeling HSPICE SpectraQuest PowerPlane Analysis Parts Sourcing Inventory Mgmt. SMD & PTH BGA/Fine Pitch X-Ray Inspection AOI Functional Boundary Scan Flying Probe Planarity

Typical Design Flow Pactron Confidential Customer Input ( Schematic or Block Diagram or Pin List ) Schematic and BOM Generation Routing Guidelines and Stack-up Placement Routing IPC Check and Gerber Out Customer Approval Customer Approval Parts Procurement (Newark) Signal Integrity Simulations

Pactron Signal Integrity Expertise Pactron Confidential

Challenges for High-end Designs Stack-Up -- Dielectric Material Selection Interconnect design ~ 50 ohms (Via/Connector Modeling) Routing challenges ~ BGA ~ fine pitch Stub reduction – back drill vias/blind vias Pactron Confidential

Signal Integrity Analysis High Speed Channel Simulation – Modeling Ansoft’s High Frequency Structural Simulator (HFSS) for S/Y/Z Parameter Extraction 3D Full-Wave Finite Element Method is used to extract electrical behavior of high frequency components Optimized footprint for SMA, Connectors, Contactor Optimized via structure – anti-pad, spacing to ground vias dimensions Ansoft SI Wave for any 2D extraction including traces Pactron Confidential

Signal Integrity Analysis Differential Via Optimization Pactron Confidential

Signal Integrity Analysis Insertion Loss of differential via Pactron Confidential

Signal Integrity Analysis Single ended via optimization Pactron Confidential

Signal Integrity Analysis Insertion Loss of single ended via Pactron Confidential

Signal Integrity Analysis S Parameter Extraction with SMA Connector Model Pactron Confidential

Signal Integrity Analysis Pactron Confidential Measured and Simulated Co-Relation

Pactron Confidential Differential Pair – S Parameter

Sample SMP Connector Footprint Pactron Confidential

Pactron Confidential Sample SMP Connector Footprint

Signal Integrity Analysis High Speed Channel Analysis -- Next Steps Synopsys HSPICE Circuit Simulator for complete Channel Analysis Eye-Diagrams Jitter Measurement Bit Error Rate W-Element Modeling Pactron Confidential

Signal Integrity Analysis Pre Layout Simulation Cadence SigXplorer Simulation Tool Analyze and simulate different topologies, termination schemes and I/O buffer selection for critical nets at desired frequency Provide placement and routing guidelines based on pre-layout analysis Post Layout Simulation Setup board file with layer stack-up information Extract topology along with via models from the layout file for critical nets Perform simulation to match results from pre-layout analysis Perform Crosstalk analysis on critical nets System Level Simulation involving board to board interconnects Pactron Confidential

Pre-Layout Analysis (Topology) Pactron Confidential

Pre-Layout Analysis (Waveform and Results) Pactron Confidential

Post-Layout Analysis (Extracted Topology) Pactron Confidential

Post-Layout Analysis (Waveform and Results) Pactron Confidential

Post-Layout Crosstalk (Results) Pactron Confidential

Pactron Sample Designs Final Test Boards Wafer Probe Boards Reference/Evaluation Boards Characterization Boards Pactron Confidential

Pactron Sample Designs Final Test Boards Pactron Confidential

ETS-364 Mixed Signal Board LAYERS : 18 BOARD THICKNESS : 0.187” 8 Sites Tester Resources used APU, SPU, QTMU, Digital IO Force and Sense Routing Digital IO signals routed in a separate layer with 50ohm impedance

ETS-364 Mixed Signal Board LAYERS : 14 BOARD THICKNESS : 0.187” 4 Sites Tester Resources used APU, SPU, Digital IO Force and Sense Routing Digital IO signals routed in a separate layer with 50ohm impedance

ETS-364 Mixed Signal Board LAYERS : 12 BOARD THICKNESS : 0.187” 2 Sites Tester Resources used APU, SPU, Digital IO Force and Sense Routing Digital IO signals routed in a separate layer with 50ohm impedance

ETS-364 Mixed Signal Board LAYERS : 14 BOARD THICKNESS : 0.187” 3 Sites Tester Resources used APU, SPU, QTMU, Digital IO Force and Sense Routing Digital IO signals routed in a separate layer with 50ohm impedance Pactron Confidential

ETS-300 Mixed Signal Board LAYERS : 16 BOARD THICKNESS : 125 mils Tester Resources used APU, SPU, QTMU, Digital IO Force and Sense Routing Digital IO signals routed in a separate layer with 50ohm impedance Pactron Confidential

ETS-500 MIXED SIGNAL BOARD LAYERS : 8 BOARD THICKNESS : 0.125” 2 Sites Tester Resources SPU, APU. QTMU, IO, MPU Force and Sense Routing Analog and Digital Signal separation 50ohm impedance Pactron Confidential

ETS-564 MIXED SIGNAL BOARD LAYERS : 8 BOARD THICKNESS : 0.125” 2 Sites Tester Resources SPU, APU. QTMU, IO, MPU Force and Sense Routing Analog and Digital Signal separation 50ohm impedance Pactron Confidential

VLCT RASP Final Test Board LAYERS : 32 BOARD THICKNESS : 0.187” 8 Sites Tester Resources Force and Sense Routing Analog and Digital Signal separation 50ohm impedance Digital traces are length matched

VLCT RASP Final Test LAYERS : 14 BOARD THICKNESS : 0.187” 2 Sites Tester Resources Force and Sense Routing Analog and Digital Signal separation 50ohm impedance Digital traces are length matched

Final Test FUSION Board LAYERS : 24 BOARD THICKNESS : 0.187” 4 Sites 50ohm impedance Pin swapped for better routing

Final Test FUSION Board LAYERS : 14 BOARD THICKNESS : 0.187” 2 Sites 50ohm impedance Pin swapped for better routing

Final Test HFI Board Pactron Confidential LAYERS : 12 BOARD THICKNESS : 0.187” 2 Sites 3.5Gb/s High speed signals Via back drills 50ohm impedance

Final Test HFI Board Pactron Confidential LAYERS : 12 BOARD THICKNESS : 0.187” single site 3.5Gb/s High speed signals routed on the top Via back drills 50ohm +/- 5% impedance

Final Test HFI Board Pactron Confidential LAYERS : 12 BOARD THICKNESS : 0.187” Quad Site 3.5Gb/s High speed signals routed on the top Via back drills 50ohm impedance

Final Test HFI Board Pactron Confidential LAYERS : 16 BOARD THICKNESS : 0.187” Quad Site 3.5Gb/s High speed signals routed on the top Via back drills 50ohm impedance

Teradyne FLEX BOARD LAYERS : 12 BOARD THICKNESS : 0.187” MATERIAL : FR4 2 Sites Tester Resources DC75, DC30, HSD, UDB Force and Sense Routing Pactron Confidential

Teradyne FLEX BOARD LAYERS : 12 BOARD THICKNESS : 0.187” MATERIAL : FR4 Octal Site Tester Resources DC75, DC30, VHFAC, BBAC, HSD, UDB Force and Sense Routing Pactron Confidential

Teradyne MICROFLEX Board LAYERS : 14 BOARD THICKNESS : 0.187” MATERIAL : FR4 Octal Site DC30, DC75, HSD, UDB Force and Sense Routing Pactron Confidential

Teradyne MICROFLEX Board LAYERS : 14 BOARD THICKNESS : 0.187” MATERIAL : FR4 Quad Sites DC30, DC75, HSD, UDB, BBAC, VHFAC Force and Sense Routing Ground Shielding for BBAC and VHFAC Pactron Confidential

Teradyne ULTRA FLEX Board LAYERS : 18 BOARD THICKNESS : 0.200” MATERIAL : Rogers 4350 & 370HR 4 Sites SB6G Routing on Top and Bottom Back drilling used to drill away Stubs. Ground Shielding Force and Sense Routing Differential Pairs and Equal Length Pactron Confidential

Teradyne Catalyst Board LAYERS : 12 BOARD THICKNESS : 187 mils MATERIAL : FR4 Single site RF routing – coplanar Matching components Pactron Confidential

NEXTEST – MAGNUM EV LAYERS : 10 BOARD THICKNESS : 0.250” Digital Routing 50ohm impedance Equal Length Pactron Confidential

Sample S93K Full Size Design LAYERS : 44 BOARD THICKNESS : 0.283” MATERIAL : ROGERS (High Speed Signals) NELCO4000-13 (Low Speed Signals) Ground shield on High Speed signals to minimize cross talk. Varied the Clearance in Gnd plane where high speed signals connected. Ground Isolation on all Power planes to avoid cross talk. Stubs are Backdrilled for High Speed Signals More no. of SMP’s are used for High Speed Testing Differential Pairs Equal Length Pactron Confidential

Sample S93K Full Size Design LAYERS : 44 BOARD THICKNESS : 310” MATERIAL : ROGERS (High Speed Signals) GETEK (Low Speed Signals) Ground shield on High Speed signals to minimize cross talk. Varied the Clearance in Gnd plane where high speed signals connected. Ground Isolation on all Power planes to avoid cross talk. Differential Pairs Equal Length DUT vias are Via-on-Pad pattern and conductive filled Pactron Confidential

Sample 3/4 SIZE S93K 3/4 Size S93K Template LAYERS : 24 BOARD THICKNESS : 0.187” MATERIAL : Nelco 4000-13 Differential Pairs Equal Length Pactron Confidential

Sample 1/2 SIZE S93K 1/2 Size S93K Template LAYERS : 26 BOARD THICKNESS : 0.187” MATERIAL : FR4 Differential Pairs Equal Length Pactron Confidential

Sample Credence Quartet LAYERS : 24 BOARD THICKNESS : 0.125” MATERIAL : FR408 2 Sites Ground Shielding for High Speed Signal and Clock traces Equal length routing Backrilling used Differential Pairs Pactron Confidential

Sample Credence Design LAYERS : 48 BOARD THICKNESS : 0.310” MATERIAL : ROGERS (High Speed Signals) GETEK (Low Speed Signals) High Speed Signals are backdrilled Differential Pairs Equal Length DUT vias are Via-on-Pad pattern and conductive filled Pactron Confidential

Pactron Confidential CMT Sample Design LAYERS : 34 BOARD THICKNESS : 270” MATERIAL : ROGERS (High Speed Signals) GETEK (Low Speed Signals) High Speed Signals routed to 6.5GDM connectors. Low Speed signals routed to DM250 Connectors. Ground shield on High Speed signals to minimize cross talk. Varied the Clearance in Gnd plane where high speed signals connected. Ground Isolation on all Power planes to avoid cross talk. Differential Pairs and Equal Length DUT vias are Via-on-Pad pattern and conductive filled

Pactron Confidential CMT Sample Design LAYERS : 34 BOARD THICKNESS : 270” MATERIAL : Nelco 4000-13 High Speed Signals routed to 6.5GDM connectors. Low Speed signals routed to DM250 Connectors. Blind Vias and backdrilling used for High Speed Signals Ground shield on High Speed signals to minimize cross talk. Ground Isolation on all Power planes to avoid cross talk. Differential Pairs and Equal Length

Pactron Sample Designs Wafer Probe Boards Pactron Confidential

ETS-364 Probe Card LAYERS : 12 BOARD THICKNESS : 0.187” MATERIAL : FR4 Analog and Digital separation Via Tenting Cantilever Probe

ETS-364 Probe Card LAYERS : 10 BOARD THICKNESS : 0.187” MATERIAL : FR4 Analog and Digital separation Via Tenting Cantilever Probe

ETS-364 Vertical Probe Card LAYERS : 8 BOARD THICKNESS : 0.187” MATERIAL : FR4 Analog and Digital separation Via Tenting Cantilever Probe

Wafer Probe Board Pactron Confidential

Teradyne Catalyst – Probe Card Impedance Control Device Checker Pactron Confidential

Teradyne Flex – Probe Card Multiple Sites Impedance Control Device Checker Pactron Confidential

Teradyne Flex Wafer Probe Multiple Sites Impedance Control POOL BOX Guard Pactron Confidential

UltraFlex Probe Card Multiple Sites Impedance Control High Speed Routing Pactron Confidential

Teradyne Flex Wafer Probe Daughter Board with Probe Ring Analog Routing Pactron Confidential

Teradyne Flex Wafer Probe LAYERS : 14 BOARD THICKNESS : 0.187” MATERIAL : FR4 DC30, DC75, HSD, UDB Force and Sense Routing BBAC routing with Ground Shielding Pactron Confidential

Pactron Sample Designs Evaluation/Reference Boards Pactron Confidential

Evaluation Board SFP Optical Transceiver Module Gigabit Ethernet Hyper Transport Edge Connectors SATA Interface On-Board DDR2 Memory High Speed USB Interface Manual Routing and length matching Sample Evaluation Board Pactron Confidential

Sample Evaluation Board LAYERS : 12 BOARD THICKNESS : 0.093” MATERIAL : FR4 Gigabit Ethernet Ground Shielding for High Speed Signal and Clock traces DDR2 DIMM SERDES Pactron Confidential

Sample Evaluation Board LAYERS : 12 BOARD THICKNESS : 0.093” MATERIAL : FR4 High Speed routing PCIe 4 lane DDR2 Interface QDR Memory SODIMM Interface Pactron Confidential

LAYERS : 14 Thickness: 0.125” MATERIAL : FR-4 Differential Pairs High Speed/Equal Length DFT: Boundary SCAN Pactron Confidential Sample Evaluation Board

Demonstration platform Voice over WLAN SoC RF Baseband transceiver 2.4GHz Band Radio 802.11g Wireless Standard Balun and Band Pass Filter USB, RS-232, SDIO Interface Keypad and LCD Connectors Audio Codec with Mic/Speaker Interface USB/Ethernet for PC Interface 8 Layers, FR4 Material Sample System Board

Optical Transceiver Connector Analog and Digital Portion Ethernet Interface Mini PCi Interface USB 2.0 Interface 1 GSPS ADC Sample System Board

Evaluation Board Gigabit Ethernet PHY SERDES Differential Pairs SDRAM Interface Sample System Board

Sample Evaluation Boards Pactron Confidential

Analog and Digital Components Proper separation of digital and analog components during placement Local digital current loops reducing noise in analog side SERDES Interface Sample Mixed Signal Board

Pactron Confidential Sample RF Design

Dual Radio: WLAN (802.11an 5GHz) WLAN (802.11bgn 2.4 GHz) MAC SoCs with Mini PCI (2GHz) and PCI Express (5GHz) Interfaces Layers: 6 Material: FR408 SPDT Switch Diplexer Antenna Connector Pactron Confidential Sample RF Design RF SoC BP filter LNA

Pactron Sample Designs Characterization Boards Pactron Confidential

Characterization Board LAYERS : 28 BOARD THICKNESS : 0.134” MATERIAL : Nelco4000-13 5GHz High-speed RF traces Differential Pairs and Equal Length Ground Shielding for the High-speed Traces Traces were routed in arc pattern 10 Sets of Backdrilling used to reduce stub. Pactron Confidential

Characterization Board Pactron Confidential

Pactron Manufacturing and Test Capability Pactron Confidential

Manufacturing Procurement Long lead parts are ordered during design. Component Engineering for long lead and high minimum order quantity parts Obsolete parts Assembly requirements Tooling requirements Sockets, stiffener and fixtures Cables Procure and manage inventory through ERP system Maintain minimum stock level for long lead parts Publish real time inventory report to customer Frequent cycle count ftp site to publish inventory Pactron Confidential

Manufacturing PCB Complex boards built 52 layer board 330 mils thick 8 site .4mm pitch BGA board High aspect ratio 30:1 HDI boards .3 mm pitch with stacked/staggered micro via and copper fill 5% impedance tolerance with 100% tdr measurement. Hybrid boards with 3mil per inch warpage tolerance Material Hybrid construction with high speed material Nelco 4000-13, Nelco 4000-13SI, Getek, Rogers RO4350, RO4403, RO4003, P95 polyimide, (Taconic) Pactron Confidential

Manufacturing Assembly Pick and Place Methodology for ATE & Reference boards. Faster turn around Better quality Capability to handle fine pitch and leadless components Assembly of fine pitch components like .28 mm pitch BGA Specialized rework stations for assembling and reworking BGA and fine pitch components Solder Paste Height Measurement ROHS Compliance IPC-610- Inspection Standards Flying Probe, Boundary Scan & Functional Test Pactron Confidential

BGA/Emerging Technology Assembly ONYX AIR-VAC Assembly / Rework Station 0201, Flip Chip, MicroBGA/CSP, BGA Assembly Lead Free Assembly Position accuracy of up to 10 microns 2000W Top Heater/ 6000W Bottom Heater Interactive Thermal Profiling “On the Fly” adjustments Next Generation Process Control System Non-Contact Site Cleaning Pactron Confidential

BGA/QFN 3D X-Ray Maximum Inspection Area – 24” X 24” Oblique views at highest magnification (2800X) Tilt 60 degree, rotate 360 degree for inspection at different angles In the production of BGAs and flip-chips, non-destructive testing and inspection capability of X-ray has become an important factor in quality control and process analysis Inspection of BGA and fine pitch area array devices(uBGAs and flip-chips), multi-layer boards , high density interconnects and encapsulated components Pactron Confidential

Examples – BGA X-Ray BGA Open BGA Voids BGA Overview BGA Overview Pactron Confidential

Solder Paste Printer Automated Process Uniform Paste Deposition Fiducial alignment recognition through lighting Post Optical Inspection for missed Paste printing Board Size : 24” x 20” to 2” x 2” Board Thickness: 0.008” to 0.138” or 0.032” to 0.196” Pactron Confidential

Automatic Optical Inspection Fast Program Setup Full Defect Coverage Low False call rate High Resolution Imaging Capability: 0201 and 01005 Board Size: 22” X 20” (560mm X 510mm) Yield Management Tools - SPC Pactron Confidential

Board Level Testing Planarity Testing Fixture established 3 point plane of reference parallel to the top surface of the Granite table Measurements are taken around perimeter of top surface of the board. Measurement locations are supplied by customer. Measurements are then compared to those of customer specs at said test point. Automatically determines whether board is in spec. Current setup is only on unpopulated boards. Working on enhancements to test methodology such as populated boards and automated measurements. Pactron Confidential

Board Level Testing Boundary Scan Testing Asset Interconnect Boundary Scan Tool Uses the TAP Port & Scan Chain for verification Check High Pin count BGA connectivity to PCB BSDL Validation Flying Probe SEICA Pilot Flying Probe Equipment Utilizes moving probes & accessible test Points Checks for all assembly issues (opens, shorts, wrong value, missing components, device orientation..) Effectively verifies mounting of BGAs, ICs, passives, sockets and connectors. Pactron Confidential

Board Level Testing Leakage Test Current measurement in pico amp range Measure leakage between adjacent nets Measure leakage between power and ground Automated with Flying Probe Pactron Confidential

In Summary ~ Why Pactron? Ideal model for constantly evolving technology Engineering Talent Investment in high end tools Scalable capacity (zero queue time) Flexible & Agile Fab Strategy Pactron = Multiple fab vendors Strategic global presence US – Sunnyvale, Dallas Asia – India, Penang One Stop Shop for both ATE Hardware & Reference/Evaluation Boards Pactron Confidential A Turn-Key Solutions Provider High End Designs – Manufacturing - Final Test

Pactron Ate Introduction

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