STMicroelectronics LSM9DS0 9-Axis MEMS IMU teardown reverse costing report published by Yole Developpement

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not
bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The
quoted trademarks are property of their owners.
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
www.systemplus.fr
21 rue la Nouë Bras de Fer
44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr
December 2013 – Version 1 – Written by Romain Fraux

STMicroelectronics LSM9DS0 9-Axis MEMS IMU© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 2
Glossary
1. Overview / Introduction 4
– Executive Summary
– Reverse Costing Methodology
2. Company Profile 7
– STMicroelectronics
– LSM9DS0 Characteristics
3. Physical Analysis 14
– Synthesis of the Physical Analysis
– Physical Analysis Methodology
– Package
– Package Views, Dimensions & Pin Out
– Package Opening
– Wire Bonding Process
– Package Cross-Section
– ASIC dies
– View, Dimensions & Marking
– Delayering
– Main Blocks Identification
– Cross-Section
– MEMS Gyro/Accelero die
– Bond Pad Opening & Bond Pad
– Cap Removed & Cap Details
– Sensing Area Details
– Cross-Section (Sensor, Cap & Bonding)
– X/Y-Axis Magnetometer die
– Delayering
– Cross-Section
– Z-Axis Magnetometer die
– Delayering
– Cross-Section
4. Manufacturing Process Flow 121
– Global Overview
– ASICs Front-End & RDL Process
– ASIC Wafer Fabrication Unit
– MEMS Gyro/Accelero Process Flow
– MEMS Wafer Fabrication Unit
– Magnetometer Process Flow
– Magnetometer Wafer Fabrication Unit
– Packaging Process Flow
– Package Assembly Unit
5. Cost Analysis 146
– Synthesis of the cost analysis
– Main steps of economic analysis
– Yields Hypotheses
– ASICs Front-End Cost
– ASICs Back-End 0 : RDL, Probe Test & Dicing
– ASICs Wafer & Die Cost
– MEMS Gyro/Accelero Front-End Cost
– MEMS Gyro/Accelero Front-End Cost per process steps
– MEMS Gyro/Accelero Back-End 0 : Probe Test & Dicing
– MEMS Gyro/Accelero Wafer & Die Cost
– Magnetometer Front-End Cost
– Magnetometer Cost per process steps
– Magnetometer Back-End 0 : Probe Test & Dicing
– X/Y-Axis & Z-Axis Magnetometer Wafer & Die Cost
– Back-End : Packaging Cost
– Back-End : Packaging Cost per Process Steps
– Back-End : Final Test & Calibration Cost
– LSM9DS0 Component Cost
6. Estimated Price Analysis 197
– Manufacturer Financial Ratios
– Estimated Selling Price
Contact 204

• This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling
price of the STMicroelectronics LSM9DS0 component.
• The LSM9DS0 is a 9-axis MEMS IMU (3-axis gyroscope + 3-axis accelerometer + 3-axis magnetometer).
• It is suitable for portable applications: Indoor navigation, Smart user interface, Advanced gesture recognition, Gaming and
virtual reality input device, Display/map orientation and browsing, eCompass, Position and motion detection functions,
Click/double click recognition, Intelligent power saving for handheld devices).
• The LSM9DS0 provides accurate output across full-scale ranges up to ±2000dps (rotational acceleration), ±16g (linear
acceleration) and ±12 Gauss (magnetic field).
• Compatible with SMD process, the LSM9DS0 is provided in a 4x4x1mm LGA 24-pin package.
• Note : The LSM9DS0 integrates a 3-axis Gyroscope, a 3-axis Accelerometer and a 3-axis magnetometer. Notations bellow
are used in this report :
• One die constitute the 3-axis Gyroscope and the 3-axis Accelerometer, it is called :
 MEMS Gyro/Accelero: A microsystem which comprise two parts, MEMS Cap and MEMS Sensor.
• Two dies constitute the 3-axis Magnetometer, they are called :
 X/Y-Axis magnetometer : A sensor die which is used to measure the magnetic field on the X-axis and Y-axis.
 Z-Axis magnetometer A sensor die which is used to measure the magnetic field on the Z-axis.
• One die constitutes the control IC for the gyroscope function, it is called :
 Gyroscope ASIC : An IC die which is used to control the MEMS gyroscope.
• One die constitutes the control IC for the accelerometer and magnetometer functions, it is called :
 Accelero/Magneto ASIC : An IC die which is used to control the MEMS accelerometer and the 3 axes of the
magnetometer.
• These notations are used both in this report and in the excel file.

Package top view
Package back viewPackage Side View
• Package: LGA 24-pin
• Dimensions: 4.0 x 4.0 x 1mm
• Pin Pitch: 0.5mm
• Marking:
9S0
2343
R04AB

• The die marking includes the logo of STMicroelectronics and:
V701A
2010
ASIC Gyro Die Marking

V730A
2011
Accelero/Magneto ASIC Die Marking

GA02A
13
MEMS Gyro/Accelero Die Marking

• The die marking includes:
36041
HON
X/Y-Axis Magnetometer Die Marking

• The die marking includes:
58036040
HONEYWELL
Z-Axis Magnetometer Die Marking

STMicroelectronics LSM9DS0 9-Axis MEMS IMU
Return to TOC
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 14
Reverse costing analysis represents the best cost/price evaluation given the publically available data, and
estimates completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10%
correction on the manufacturing cost (if all parameters are cumulated).
These results are open for discussion. We can reevaluate this circuit with your information. Please contact
us:
USA Office
• Michael McLaughlin, Business Development Manager, Phone: (650) 931 2552 - Cell: (408) 839 7178 - Email: mclaughlin@yole.fr
• Jeff Edwards, Sales Associate, Yole Inc., Cell: (972) 333 0986- Email: edwards@yole.fr
Japan Office
• For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.
Phone: (81) 362 693 457 - Cell : (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: katano@yole.fr
• For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.
Email: onozawa@yole.fr
European Office
• Yves Devigne, Europe Business Development Manager, Cell : +33 6 75 80 08 25 - Email : devigne@yole.fr
• Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer Service, Tel: +33 472 83 01 90, Email:
jourdan@yole.fr
Korea Office
• Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 - Cell: (82) 10 4097 5810
- Fax: (82) 2 2010 8899 – Email: yang@yole.fr

STMicroelectronics LSM9DS0 9-Axis MEMS IMU teardown reverse costing report published by Yole Developpement

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STMicroelectronics LSM9DS0 9-Axis MEMS IMU teardown reverse costing report published by Yole Developpement