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International Journal of VLSI design & Communication Systems (VLSICS) Vol.5, No.5, October 2014 
ENERGY EFFICIENT FULL ADDER CELL 
DESIGN WITH USING CARBON NANOTUBE 
FIELD EFFECT TRANSISTORS IN 32 
NANOMETER TECHNOLOGY 
Ali Ghorbani and Ghazaleh Ghorbani 
Young Researchers and elite Club, Meymeh Branch, 
Islamic Azad University, Meymeh, Iran 
ABSTRACT 
Full Adder is one of the critical parts of logical and arithmetic units. So, presenting a low power full adder 
cell reduces the power consumption of the entire circuit. Also, using Nano-scale transistors, because of 
their unique characteristics will save energy consumption and decrease the chip area. In this paper we 
presented a low power full adder cell by using carbon nanotube field effect transistors (CNTFETs). 
Simulation results were carried out using HSPICE based on the CNTFET model in 32 nanometer 
technology in Different values of temperature and VDD. 
KEYWORDS 
Low power circuit; Carbon Nanotube Filed Effect Transistors; Nano Transistors; Full Adder 
1. INTRODUCTION 
Full adder cells are one of the most important parts of the arithmetic operations [1]. So, using an 
optimized full adder cell increase the performance of these operations. So, designing faster and 
low-power FAs was the driving force behind many results reported during the last decade. The 
main purpose of such designs has create faster FAs while also reducing their power consumption. 
In this paper we present a low power full adder cell. 
Moore believes that the number of transistors on a chip will be double about every two year 
[2].To achieve this aim, we have to reduce the size of the transistor into Nano-scale region 
[3-4]. Due to the limitations of silicon based Field Effect Transistors (FETs) we need to use an 
efficient alternative technology. 
Carbon Nanotube Field Effect Transistor (CNTFET) is an optimized alternative for the 
conventional CMOS technology [4]. 
This paper organize as follows: 
In section 2, we review the carbon nanotube field effect transistors (CNTFETs) and their 
Specifications, The previous designs of full adders discuss in section 3 and then present our 
DOI : 10.5121/vlsic.2014.5501 1
International Journal of VLSI design & Communication Systems (VLSICS) Vol.5, No.5, October 2014 
proposed design in section 4 and finally, simulation results in section 5. Conclusion will present 
in Section 6. 
2. CNTFETS 
Carbon Nano Tubes (CNTs) are cylindrical shape of graphite sheets that rolled as tube [5]. The 
carbon nanotubes have chirality vector (m, n) that depend on values of them and either they can 
be metallic or semiconducting [6-7]. 
Carbon nanotube field effect transistors (CNTFETs) are a kind of transistors that use carbon 
nanotubes as their channel. There are two form of CNTFET: Schottky Barrier CNTFET (SB-CNTFET) 
and MOSFET-like CNTFET. In MOSFET-like source and drain are made of 
doped carbon nanotubes and the intrinsic semiconducting carbon nanotubes are used in the 
channel region. The channel in the Schottky barrier (SB) CNTFET is an intrinsic semiconducting 
carbon nanotube and direct contacts of the metal with the semiconducting nanotubes made for 
source and drain regions [8-9]. 
2 
Figure 1. Schematic diagram of a CNTFET 
CNFETs are one of the molecular devices that avoid most fundamental silicon transistor 
restriction and have ballistic or near ballistic transport in their channel [10]. Therefore a 
semiconductor carbon nanotube is appropriate for using as channel of field effect 
transistors [7]. Applied voltage to the gate can be control the electrical conductance of the CNT 
by changing electron density in the channel. 
The diameter of carbon nanotube can be expressed as equation 1 [11]: 
(1) 
2 2 
a n m m D 
p 
CNT 
+ + 
= 
The threshold voltage has reversed relationship between nanotube diameters that shows in 
equation 2.
International Journal of VLSI design & Communication Systems (VLSICS) Vol.5, No.5, October 2014 
3 
0.42 
(2) V 
d nm 
V 
( ) 
TH 
= 
So, by changing the diameter of the nanotube threshold voltage can be define and also, we can 
define the behaviour of the transistors. 
3. PREVIOUS DESIGNS 
Many full adder cells have presented in the past [1, 5, 12-19]. In [1, 5, and 12] full adders were 
designed based on XOR/XNOR circuits. The capability of majority function encourage the 
designers to use this function in their designs (figure 2) [13-18]. The majority function show in 
equation3. 
(3) MAJORITY(A,B,C) = AB + BC + AC = Cout 
Figure 2. Full adder designs with majority function
International Journal of VLSI design & Communication Systems (VLSICS) Vol.5, No.5, October 2014 
Using the capacitor and resistor elements affect the power of design. In [19] the full adder cell 
designed without any capacitors and resistors. In this paper we present a new CNTFET full adder 
design with reducing the number of transistors and also we don’t use any capacitor or resistor. 
(Figure 3) 
4 
Figure 3. Full adder 4 
4. NEW CNTFET FULL ADDER DESIGN 
In this paper we present a full adder cell design with using carbon nanotube field effect 
transistors in 32 nm technology. This design implements with 24 carbon nanotube field effect 
transistors (CNTFETs) and due to the implementation of this circuit in Nano-scale, the power of 
this design is better than the CMOS one. Also this circuit implemented by reducing the number of 
transistors in comparison with the previous CNTFET designs. This factor is also optimizes 
power supply of the circuit. This design implements based on equation 4.Schematic of this circuit 
design shows in figure 4. 
(4) 
Cout = AB+ BC + AC 
SUM = ABC + ABC + ABC + 
ABC 
( ) ( ) ( ) 
ABC A AB AC BC B AB AC BC C AB AC BC 
= + + + + + + + + + 
( ) ( ) ( ) 
ABC A AB AC BC B AB AC BC C AB AC BC 
= + + + + + + + + + 
(Cout) (Cout) (Cout) 
ABC A B C 
= + + +
International Journal of VLSI design & Communication Systems (VLSICS) Vol.5, No.5, October 2014 
5 
Figure 4. New CNTFET Full adder design 
5. SIMULATION RESULTS 
The simulation results show in tables 1-3. These Simulation results were carried out using 
HSPICE based on the CNTFET model in 32 nanometer technology. Tables1-3 show the Power, 
Delay and PDP results in Different values of temperature and VDD. As shown in table1 and 3, 
the Power and Power-Delay Product (PDP) of the circuit have increased by growing the VDD but 
it has not appreciably changes by growing the temperature (figure 5-6). The Delay parameter has 
decreases by increasing the VDD (as shown in table 2). 
Table 1: Power consumption results for various amounts of VDD and Temperature (*10-9) 
VDDTemp C 0 9 18 27 36 45 54 
0.7 2.6936 2.6913 2.7776 2.6864 2.72 2.6759 2.6842 
0.8 3.8247 3.7974 3.7915 3.8371 3.8419 3.8521 3.8769 
0.9 5.8277 5.834 5.8614 5.9341 5.842 5.9107 5.8542 
1 8.5178 8.5429 8.5635 8.6274 8.9283 8.6518 8.6511 
1.1 12.505 12.266 12.264 12.313 12.927 12.26 12.565 
1.2 18.692 19.459 18.808 18.326 18.504 19.466 18.645
International Journal of VLSI design  Communication Systems (VLSICS) Vol.5, No.5, October 2014 
6 
Table 2: Delay results for various amounts of VDD and Temperature(*10-10) 
VDDTemp C 0 9 18 27 36 45 54 
0.7 1.3229 1.3186 1.3138 1.3077 1.3032 1.2981 1.2944 
0.8 1.2403 1.2342 1.2301 1.2258 1.2208 1.2175 1.2132 
0.9 1.2004 1.1961 1.1938 1.1898 1.1851 1.1802 1.1775 
1 1.1385 1.134 1.1298 1.1235 1.1187 1.1142 1.1101 
1.1 1.1119 1.1087 1.1021 1.0969 1.0917 1.0892 1.0855 
1.2 1.0921 1.0891 1.083 1.0788 1.0735 1.0701 1.0671 
Table 3: PDP results for various amounts of VDD and Temperature(*10-19) 
VDDTemp C 0 9 18 27 36 45 54 
0.7 3.5634 3.5487 3.6492 3.5130 3.5447 3.4736 3.4744 
0.8 4.7438 4.6868 4.6639 4.7035 4.6902 4.6899 4.7035 
0.9 6.9956 6.9780 6.9973 7.0604 6.9234 6.9758 6.8933 
1.0 9.6975 9.6876 9.6750 9.6929 9.9881 9.6398 9.6036 
1.1 13.9043 13.5993 13.5162 13.5061 14.1124 13.3536 13.6393 
1.2 20.4135 21.1928 20.3691 19.7701 19.8640 20.8306 19.8961 
Figure 5. Chart of Power consumption results for various amounts of VDD and Temperature
International Journal of VLSI design  Communication Systems (VLSICS) Vol.5, No.5, October 2014 
7 
Figure 6. Chart of PDP results for various amounts of VDD and Temperature 
Finally we compare the simulation results of this Full Adder cell design with previous designs in 
0.65 V VDD (Table 4). 
Table4. Comparing the results with previous designs 
Full adder-1[14] 5.23E-07 7.97E-11 4.17E-17 
Full adder-2[16] 4.71E-07 8.82E-11 4.15E-17 
Full adder-3[17] 7.12E-07 7.51E-11 5.35E-17 
Full adder-4[19] 1.35E-08 3.45E-11 4.663E-19 
New FA design 2.66E-09 1.30E-10 3.513E-19 
6. CONCLUSION 
Power Delay PDP 
In this paper we presented a low power full adder cell with using carbon nanotube field effect 
transistors. We used lower number of transistors and reduced the chip area by using these Nano-scale 
transistors. Results of section 5 carried out using HSPICE based on the CNTFET model in 
32 nanometer technology in Different values of temperature and VDD. We compared these 
simulation results with previous similar works and showed that we achieve an optimized power 
saving.
International Journal of VLSI design  Communication Systems (VLSICS) Vol.5, No.5, October 2014 
ACKNOWLEDGEMENTS 
This paper is extracted from a research project with the title “A new binary full adder cell by 
using carbon Nanotube field effect transistors. 
REFERENCES 
[1] Bui H T, Wang Y, and Jiang. Design and analysis of low-power 10-transistor full adders using XOR– 
XNOR gates. Circuits and Systems II: Analog and Digital Signal Processing, IEEE Transactions. 
Jan.2002; 49, 1: 25–30. 
[2] Moore G E. Progress in digital integrated electronics. In: IEEE. Retrieved 2011 Electron Devices 
8 
Meeting 1975; 11–27. 
[3] Wu J, Shen Y, Reinhardt K, Szu H, Dong B. A Nanotechnology Enhancement to Moore's Law. 
Applied Computational Intelligence and Soft Computing; 2013: Article ID 426962, 13 pages, 2013. 
doi:10.1155/2013/426962. 
[4] Appenzeller J. Carbon Nanotubes for High-Performance Electronics Progress and Prospect. 
Proceedings of the IEEE. Feb 2008; 96, 2, 201-211. 
[5] Lin J, Hwang Y. A Novel High-Speed and Energy Efficient 10-Transistor Full Adder Design. IEEE 
Transactions on Circuits and Systems. May 2007; 54, 5, May 2007: 1050-1059. 
[6] Jiang Y, Al-Sheraidah A, Wang Y,Sha E, Chung J. A novel multiplexer-based low power full-Adder. 
Circuits and Systems II: Express Briefs, IEEE Transactions; 51, 7: 345 – 348. 
[7] Raychowdhury A, Roy K. Carbon Nanotube Electronics: Design of High-Performance and Low- 
Power Digital Circuits. Circuits and Systems I: Regular Papers, IEEE Transactions, Nov 2007; 54, 
11:2391-2401. 
[8] Abdolahzadegan SH, Keshavarzian P, Navi K. MVL Current Mode Circuit Design Through Carbon 
Nanotube Technology. European Journal of Scientific Research.2010; 42, 1:152-163. 
[9] Javey A, Guo J, Wang Q, Lundstrom M, Dai H. Ballistic carbon nanotube field-effect transistor, 
Nature,2003; 424:654-657. 
[10] Raychowdhury A, Roy K. Carbon-Nanotube-Based Voltage-Mode Multiple-Valued Logic Design. 
IEEE Trans. Nanotechnology, March 2005; 4, 2:168-179. 
[11] McEuen P L, Fuhrer M S, Park H. Single Walled Carbon Nanotube Electronics. Nanotechnology, 
IEEE Transactions, 2002; 1, 1:78-85. 
[12] Goel S, Kumar A, Bayoumi M A. Design of robust, energyefficient full adders for deep 
submicrometer design using hybrid-CMOS logic style. IEEE Trans on VLSI Systems, 2006; 14, 
12:1309-1321. 
[13] Navi K, Maeen M, Foroutan V, Timarchi S, Kavehei O. A novel low power full-adder cell for low 
voltage. INTEGRATION, the VLSI Journal, 2009; 42:457-467. 
[14] Navi K, Momeni A, Sharifi F, Keshavarzian P. Two novel ultra high speed carbon nanotube Full- 
Adder cells. IEICE Electronics Express, 2009; 6, 19:1395-1401. 
[15] Navi K, Foroutan V, Rahimi Azghadi M, Maeen M, Ebrahimpour, Kaveh M, Kavehei O. A Novel 
Ultra Low-Power Full Adder Cell with New Technique in Designing Logical Gates Based on 
Static CMOS Inverter. Microelectronics Journal, Elsevier, 2009; 40:1441-1448. 
[16] Navi K, Sharifi Rad R, Moaiyeri M H, Momeni A. A Low-Voltage and Energy-efficient Full Adder 
Cell Based on Carbon Nanotube Technology. Nano Micro Letters, 2010; 2,2:114-120. 
[17] Navi K, Rashtian M, Khatir A, Keshavarzian P, Hashemipour O. High Speed Capacitor-Inverter 
Based Carbon Nanotube Full Adder. Nanoscale Ress Lett, 2010; 5:859-862. 
[18] Khatir A, Abdolahzadegan SH, Mahmoudi I.High Speed Multiple Valued Logic Full Adder Using 
Carbon Nano Tube Field Effect Transistor. International Journal of VLSI design  Communication 
Systems (VLSICS), 2011; 2, 1. 
[19] Ghorbani A, Sarkhosh M, Fayyazi E, Mahmoudi N, Keshavarzian P.A Novel Full Adder Cell Based 
On Carbon Nanotube Field Effect Transistor. International Journal of VLSI design  Communication 
Systems (VLSICS), 2012; 3, 3.

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Energy Efficient Full Adder Cell Design with Using Carbon Nanotube Field Effect Transistors in 32 Nanometer Technology

  • 1. International Journal of VLSI design & Communication Systems (VLSICS) Vol.5, No.5, October 2014 ENERGY EFFICIENT FULL ADDER CELL DESIGN WITH USING CARBON NANOTUBE FIELD EFFECT TRANSISTORS IN 32 NANOMETER TECHNOLOGY Ali Ghorbani and Ghazaleh Ghorbani Young Researchers and elite Club, Meymeh Branch, Islamic Azad University, Meymeh, Iran ABSTRACT Full Adder is one of the critical parts of logical and arithmetic units. So, presenting a low power full adder cell reduces the power consumption of the entire circuit. Also, using Nano-scale transistors, because of their unique characteristics will save energy consumption and decrease the chip area. In this paper we presented a low power full adder cell by using carbon nanotube field effect transistors (CNTFETs). Simulation results were carried out using HSPICE based on the CNTFET model in 32 nanometer technology in Different values of temperature and VDD. KEYWORDS Low power circuit; Carbon Nanotube Filed Effect Transistors; Nano Transistors; Full Adder 1. INTRODUCTION Full adder cells are one of the most important parts of the arithmetic operations [1]. So, using an optimized full adder cell increase the performance of these operations. So, designing faster and low-power FAs was the driving force behind many results reported during the last decade. The main purpose of such designs has create faster FAs while also reducing their power consumption. In this paper we present a low power full adder cell. Moore believes that the number of transistors on a chip will be double about every two year [2].To achieve this aim, we have to reduce the size of the transistor into Nano-scale region [3-4]. Due to the limitations of silicon based Field Effect Transistors (FETs) we need to use an efficient alternative technology. Carbon Nanotube Field Effect Transistor (CNTFET) is an optimized alternative for the conventional CMOS technology [4]. This paper organize as follows: In section 2, we review the carbon nanotube field effect transistors (CNTFETs) and their Specifications, The previous designs of full adders discuss in section 3 and then present our DOI : 10.5121/vlsic.2014.5501 1
  • 2. International Journal of VLSI design & Communication Systems (VLSICS) Vol.5, No.5, October 2014 proposed design in section 4 and finally, simulation results in section 5. Conclusion will present in Section 6. 2. CNTFETS Carbon Nano Tubes (CNTs) are cylindrical shape of graphite sheets that rolled as tube [5]. The carbon nanotubes have chirality vector (m, n) that depend on values of them and either they can be metallic or semiconducting [6-7]. Carbon nanotube field effect transistors (CNTFETs) are a kind of transistors that use carbon nanotubes as their channel. There are two form of CNTFET: Schottky Barrier CNTFET (SB-CNTFET) and MOSFET-like CNTFET. In MOSFET-like source and drain are made of doped carbon nanotubes and the intrinsic semiconducting carbon nanotubes are used in the channel region. The channel in the Schottky barrier (SB) CNTFET is an intrinsic semiconducting carbon nanotube and direct contacts of the metal with the semiconducting nanotubes made for source and drain regions [8-9]. 2 Figure 1. Schematic diagram of a CNTFET CNFETs are one of the molecular devices that avoid most fundamental silicon transistor restriction and have ballistic or near ballistic transport in their channel [10]. Therefore a semiconductor carbon nanotube is appropriate for using as channel of field effect transistors [7]. Applied voltage to the gate can be control the electrical conductance of the CNT by changing electron density in the channel. The diameter of carbon nanotube can be expressed as equation 1 [11]: (1) 2 2 a n m m D p CNT + + = The threshold voltage has reversed relationship between nanotube diameters that shows in equation 2.
  • 3. International Journal of VLSI design & Communication Systems (VLSICS) Vol.5, No.5, October 2014 3 0.42 (2) V d nm V ( ) TH = So, by changing the diameter of the nanotube threshold voltage can be define and also, we can define the behaviour of the transistors. 3. PREVIOUS DESIGNS Many full adder cells have presented in the past [1, 5, 12-19]. In [1, 5, and 12] full adders were designed based on XOR/XNOR circuits. The capability of majority function encourage the designers to use this function in their designs (figure 2) [13-18]. The majority function show in equation3. (3) MAJORITY(A,B,C) = AB + BC + AC = Cout Figure 2. Full adder designs with majority function
  • 4. International Journal of VLSI design & Communication Systems (VLSICS) Vol.5, No.5, October 2014 Using the capacitor and resistor elements affect the power of design. In [19] the full adder cell designed without any capacitors and resistors. In this paper we present a new CNTFET full adder design with reducing the number of transistors and also we don’t use any capacitor or resistor. (Figure 3) 4 Figure 3. Full adder 4 4. NEW CNTFET FULL ADDER DESIGN In this paper we present a full adder cell design with using carbon nanotube field effect transistors in 32 nm technology. This design implements with 24 carbon nanotube field effect transistors (CNTFETs) and due to the implementation of this circuit in Nano-scale, the power of this design is better than the CMOS one. Also this circuit implemented by reducing the number of transistors in comparison with the previous CNTFET designs. This factor is also optimizes power supply of the circuit. This design implements based on equation 4.Schematic of this circuit design shows in figure 4. (4) Cout = AB+ BC + AC SUM = ABC + ABC + ABC + ABC ( ) ( ) ( ) ABC A AB AC BC B AB AC BC C AB AC BC = + + + + + + + + + ( ) ( ) ( ) ABC A AB AC BC B AB AC BC C AB AC BC = + + + + + + + + + (Cout) (Cout) (Cout) ABC A B C = + + +
  • 5. International Journal of VLSI design & Communication Systems (VLSICS) Vol.5, No.5, October 2014 5 Figure 4. New CNTFET Full adder design 5. SIMULATION RESULTS The simulation results show in tables 1-3. These Simulation results were carried out using HSPICE based on the CNTFET model in 32 nanometer technology. Tables1-3 show the Power, Delay and PDP results in Different values of temperature and VDD. As shown in table1 and 3, the Power and Power-Delay Product (PDP) of the circuit have increased by growing the VDD but it has not appreciably changes by growing the temperature (figure 5-6). The Delay parameter has decreases by increasing the VDD (as shown in table 2). Table 1: Power consumption results for various amounts of VDD and Temperature (*10-9) VDDTemp C 0 9 18 27 36 45 54 0.7 2.6936 2.6913 2.7776 2.6864 2.72 2.6759 2.6842 0.8 3.8247 3.7974 3.7915 3.8371 3.8419 3.8521 3.8769 0.9 5.8277 5.834 5.8614 5.9341 5.842 5.9107 5.8542 1 8.5178 8.5429 8.5635 8.6274 8.9283 8.6518 8.6511 1.1 12.505 12.266 12.264 12.313 12.927 12.26 12.565 1.2 18.692 19.459 18.808 18.326 18.504 19.466 18.645
  • 6. International Journal of VLSI design Communication Systems (VLSICS) Vol.5, No.5, October 2014 6 Table 2: Delay results for various amounts of VDD and Temperature(*10-10) VDDTemp C 0 9 18 27 36 45 54 0.7 1.3229 1.3186 1.3138 1.3077 1.3032 1.2981 1.2944 0.8 1.2403 1.2342 1.2301 1.2258 1.2208 1.2175 1.2132 0.9 1.2004 1.1961 1.1938 1.1898 1.1851 1.1802 1.1775 1 1.1385 1.134 1.1298 1.1235 1.1187 1.1142 1.1101 1.1 1.1119 1.1087 1.1021 1.0969 1.0917 1.0892 1.0855 1.2 1.0921 1.0891 1.083 1.0788 1.0735 1.0701 1.0671 Table 3: PDP results for various amounts of VDD and Temperature(*10-19) VDDTemp C 0 9 18 27 36 45 54 0.7 3.5634 3.5487 3.6492 3.5130 3.5447 3.4736 3.4744 0.8 4.7438 4.6868 4.6639 4.7035 4.6902 4.6899 4.7035 0.9 6.9956 6.9780 6.9973 7.0604 6.9234 6.9758 6.8933 1.0 9.6975 9.6876 9.6750 9.6929 9.9881 9.6398 9.6036 1.1 13.9043 13.5993 13.5162 13.5061 14.1124 13.3536 13.6393 1.2 20.4135 21.1928 20.3691 19.7701 19.8640 20.8306 19.8961 Figure 5. Chart of Power consumption results for various amounts of VDD and Temperature
  • 7. International Journal of VLSI design Communication Systems (VLSICS) Vol.5, No.5, October 2014 7 Figure 6. Chart of PDP results for various amounts of VDD and Temperature Finally we compare the simulation results of this Full Adder cell design with previous designs in 0.65 V VDD (Table 4). Table4. Comparing the results with previous designs Full adder-1[14] 5.23E-07 7.97E-11 4.17E-17 Full adder-2[16] 4.71E-07 8.82E-11 4.15E-17 Full adder-3[17] 7.12E-07 7.51E-11 5.35E-17 Full adder-4[19] 1.35E-08 3.45E-11 4.663E-19 New FA design 2.66E-09 1.30E-10 3.513E-19 6. CONCLUSION Power Delay PDP In this paper we presented a low power full adder cell with using carbon nanotube field effect transistors. We used lower number of transistors and reduced the chip area by using these Nano-scale transistors. Results of section 5 carried out using HSPICE based on the CNTFET model in 32 nanometer technology in Different values of temperature and VDD. We compared these simulation results with previous similar works and showed that we achieve an optimized power saving.
  • 8. International Journal of VLSI design Communication Systems (VLSICS) Vol.5, No.5, October 2014 ACKNOWLEDGEMENTS This paper is extracted from a research project with the title “A new binary full adder cell by using carbon Nanotube field effect transistors. REFERENCES [1] Bui H T, Wang Y, and Jiang. Design and analysis of low-power 10-transistor full adders using XOR– XNOR gates. Circuits and Systems II: Analog and Digital Signal Processing, IEEE Transactions. Jan.2002; 49, 1: 25–30. [2] Moore G E. Progress in digital integrated electronics. In: IEEE. Retrieved 2011 Electron Devices 8 Meeting 1975; 11–27. [3] Wu J, Shen Y, Reinhardt K, Szu H, Dong B. A Nanotechnology Enhancement to Moore's Law. Applied Computational Intelligence and Soft Computing; 2013: Article ID 426962, 13 pages, 2013. doi:10.1155/2013/426962. [4] Appenzeller J. Carbon Nanotubes for High-Performance Electronics Progress and Prospect. Proceedings of the IEEE. Feb 2008; 96, 2, 201-211. [5] Lin J, Hwang Y. A Novel High-Speed and Energy Efficient 10-Transistor Full Adder Design. IEEE Transactions on Circuits and Systems. May 2007; 54, 5, May 2007: 1050-1059. [6] Jiang Y, Al-Sheraidah A, Wang Y,Sha E, Chung J. A novel multiplexer-based low power full-Adder. Circuits and Systems II: Express Briefs, IEEE Transactions; 51, 7: 345 – 348. [7] Raychowdhury A, Roy K. Carbon Nanotube Electronics: Design of High-Performance and Low- Power Digital Circuits. Circuits and Systems I: Regular Papers, IEEE Transactions, Nov 2007; 54, 11:2391-2401. [8] Abdolahzadegan SH, Keshavarzian P, Navi K. MVL Current Mode Circuit Design Through Carbon Nanotube Technology. European Journal of Scientific Research.2010; 42, 1:152-163. [9] Javey A, Guo J, Wang Q, Lundstrom M, Dai H. Ballistic carbon nanotube field-effect transistor, Nature,2003; 424:654-657. [10] Raychowdhury A, Roy K. Carbon-Nanotube-Based Voltage-Mode Multiple-Valued Logic Design. IEEE Trans. Nanotechnology, March 2005; 4, 2:168-179. [11] McEuen P L, Fuhrer M S, Park H. Single Walled Carbon Nanotube Electronics. Nanotechnology, IEEE Transactions, 2002; 1, 1:78-85. [12] Goel S, Kumar A, Bayoumi M A. Design of robust, energyefficient full adders for deep submicrometer design using hybrid-CMOS logic style. IEEE Trans on VLSI Systems, 2006; 14, 12:1309-1321. [13] Navi K, Maeen M, Foroutan V, Timarchi S, Kavehei O. A novel low power full-adder cell for low voltage. INTEGRATION, the VLSI Journal, 2009; 42:457-467. [14] Navi K, Momeni A, Sharifi F, Keshavarzian P. Two novel ultra high speed carbon nanotube Full- Adder cells. IEICE Electronics Express, 2009; 6, 19:1395-1401. [15] Navi K, Foroutan V, Rahimi Azghadi M, Maeen M, Ebrahimpour, Kaveh M, Kavehei O. A Novel Ultra Low-Power Full Adder Cell with New Technique in Designing Logical Gates Based on Static CMOS Inverter. Microelectronics Journal, Elsevier, 2009; 40:1441-1448. [16] Navi K, Sharifi Rad R, Moaiyeri M H, Momeni A. A Low-Voltage and Energy-efficient Full Adder Cell Based on Carbon Nanotube Technology. Nano Micro Letters, 2010; 2,2:114-120. [17] Navi K, Rashtian M, Khatir A, Keshavarzian P, Hashemipour O. High Speed Capacitor-Inverter Based Carbon Nanotube Full Adder. Nanoscale Ress Lett, 2010; 5:859-862. [18] Khatir A, Abdolahzadegan SH, Mahmoudi I.High Speed Multiple Valued Logic Full Adder Using Carbon Nano Tube Field Effect Transistor. International Journal of VLSI design Communication Systems (VLSICS), 2011; 2, 1. [19] Ghorbani A, Sarkhosh M, Fayyazi E, Mahmoudi N, Keshavarzian P.A Novel Full Adder Cell Based On Carbon Nanotube Field Effect Transistor. International Journal of VLSI design Communication Systems (VLSICS), 2012; 3, 3.