![REFERENCES
[1] R. M. Boysel, T. G. McDonald, G. A. Magel, G. C. Smith, and
J. L. Leonard, “Integration of deformable mirror devices with optical
fibers and waveguides,” in Proc. SPIE, 1992, vol. 1793, pp. 34–39.
[2] W. Kuehnel and S. Sherman, “A surface micromachined silicon accelerometer
with on-chip detection circuitry,” Sens. Actuators A, Phys.,
vol. 45, no. 1, pp. 7–16, Oct. 1994.
[3] M. Younis, D. Jordy, and J. M. Pitarresi, “Computationally efficient approaches
to characterize the dynamic response of microstructures under
mechanical shock,” J. Mciroelectromech. Syst., vol. 16, no. 3, pp. 628–
638, Jun. 2007.
[4] ASM Handbook, vol. 13, “Corrosion,” ISBN 0-87170-007-7, ASM Int.,
Novelty, OH, 1987.
[5] W. van Arsdell and S. B. Brown, “Subcritical crack growth in siliconMEMS,” J. Mciroelectromech.
Syst., vol. 8, no. 3, pp. 319–327,Sep. 1999.](https://image.slidesharecdn.com/mems-150205032205-conversion-gate01/85/Mems-Reliability-Review-23-320.jpg)
Mems Reliability Review
- 1. A STUDY ON MEMSA STUDY ON MEMS RELIABILITYRELIABILITY PRESENTED BY ANIL BHARADWAJ.R 8TH SEM TCE DEPT
- 2. INSIDE INTRODUCTION MEMS FABRICATION PROCESS DEPOSITION LITHOGRAPHY ETCHING MEMS FABRICATION TECHNIQUES BULK MICROMACHINING SURFACE MICROMACHINING MEMS RELIABILITY CONCLUSION
- 3. MEMS: MICRO ELECTRO MECHANICAL SYSTEM SIZE OF MEMS DEVICES RICHARD FEYNMAN INTRODUCTION
- 4. CLEAN ROOM AND SILICON WAFER
- 5. Same as the process steps used for making conventional electronic circuits MEMS PROCESS
- 7. DEPOSITION PROCESS PHYSICAL VAPOR DEPOSITION CHEMICAL VAPOR DEPOSITION
- 8. LITHOGRAPHY Application of photo resist Optical exposure to print an image of the mask onto the resist Immersion in an aqueous developer solution to dissolve the exposed resist
- 9. ETCHING PROCESS ETCHING IS PROCESS OF REMOVING UNPROTECTED PART WET ETCH DRY ETCH
- 10. ISTROPIC AND ANISOTROPIC ISOTROPIC ETCHING GIVES UNIFORM ETCH RATE ANISOTROPIC ETCHING GIVES NON UNIFORM ETCH RATE
- 11. MEMS FABRICATION TECHNIQUES BULK MICROMACHINING SURFACE MICROMACHINING
- 12. MEMS DEVICES
- 13. FAILURE MECHANISMS MECHANICAL FRACTURE CORROSION STICTION WEAR ELECTRIC SHOT AND OPEN CONTAMINATION
- 14. MECHANICAL FRACTURE Mechanical fracture is local separation of an object or material into two or more pieces
- 15. CORROSION Corrosion is disintegration of material into its constituent atoms due to chemical reactions with its surroundings
- 16. STICTION
- 17. WEAR Wear is defined as the removal of material from a solid surface as the result of mechanical action
- 18. ELECTRICAL SHORT AND OPEN THESE OCCURS DUE TO VARIOUS REASONS. IT’S DIFFICULT TO IDENTIFY THESE KINDS OF FAULTS
- 19. CONTAMINATION UNINTENTED MATERIAL SOURCE FOR CONTAMINATION ARE MANY
- 20. IMPRECISE FABRICATION METHODS EXPENSIVE AND COMPLEX PACKAGING CAD DESIGN TOOL INACCURACIES REASONS FOR FAILURE
- 22. CONCLUSION MEMS is an advancement over VLSI through its rugged and adaptable electro mechanical features. Many mechanical and electro mechanical processes involved in Lithography, Deposition and Etching is reduced in MEMS over VLSI Still the MEMS is fraught with some more mechanical and electro mechanical failures which can be overcome by understanding the mechanism and the physics underlying MEMS process more clearly.
- 23. REFERENCES [1] R. M. Boysel, T. G. McDonald, G. A. Magel, G. C. Smith, and J. L. Leonard, “Integration of deformable mirror devices with optical fibers and waveguides,” in Proc. SPIE, 1992, vol. 1793, pp. 34–39. [2] W. Kuehnel and S. Sherman, “A surface micromachined silicon accelerometer with on-chip detection circuitry,” Sens. Actuators A, Phys., vol. 45, no. 1, pp. 7–16, Oct. 1994. [3] M. Younis, D. Jordy, and J. M. Pitarresi, “Computationally efficient approaches to characterize the dynamic response of microstructures under mechanical shock,” J. Mciroelectromech. Syst., vol. 16, no. 3, pp. 628– 638, Jun. 2007. [4] ASM Handbook, vol. 13, “Corrosion,” ISBN 0-87170-007-7, ASM Int., Novelty, OH, 1987. [5] W. van Arsdell and S. B. Brown, “Subcritical crack growth in siliconMEMS,” J. Mciroelectromech. Syst., vol. 8, no. 3, pp. 319–327,Sep. 1999.
- 24. THANK YOU