Smart Vehicle Ensuring Safe Ride using accerolometer, laser sensor, Co sensor and also with use of GSM modem and Solar panel

International Journal of Engineering and Science Invention
ISO 9001: 2008 Certified
ISSN (Online): 2319 – 6757, ISSN (Print): 2319 – 6727
www.ijesi.org | Volume 2 | Issue 7| July. 2013 | PP.10 – 9
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SMART VEHICLE ENSURING SAFE RIDE
Project B
Submitted in partial fulfillment of the requirements
For the degree of
BACHELOR OF ENGINEERING
By
Parth. S. Cholera
Under the guidance of
Prof. K. Y. RAJPUT
DEPARTMENT OF ELECTRONIC
AND
TELECOMMUNICATION ENGINEERING
THADOMAL SHAHANI ENGINEERING COLLEGE
UNIVERSITY OF MUMBAI
(2012-2013)

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ACKNOWLEDGEMENT
“A master can tell what he expects from you, A teacher though awakens your
own expectations” - Patricia Neal
It is my great pleasure to acknowledge the assistance and contribution for
individuals who co-operated us to complete the project successfully. First and
foremost I like to thank my Project guide Prof K.Y.Rajput and Head of
department Dr. Ashwini Kunte for enthusiastic help in successful completion of
this project. We would also like to thank our honorable Principle Dr.G.T
Thampi for providing us with their precious and valuable suggestion and time
and also for their encouragement throughout the project. It’s their patience and
guidance the project has been completed successfully.
Teamwork of many teachers and my fellow friends we have been able to
complete our project. Their contributions of time and encouragement have
helped us a lot. We would like to thank our teachers and fellow friends for their
help and sharing time and suggestions and taking interest in our work.
www.ijesi.org |Smart Vehicle Ensuring Safe Ride
PARTH S CHOLERA
LUKESH N JAIN
SACHIN S JAIN
TARKESHWAR R MISHRA
I

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ABSTRACT
In this project, the design of “Smart Vehicle Ensuring Safe Ride” which
assists the driver in avoiding pot-holes on the roads, by giving prior information
about the potholes via GPS system. The entire subscribed user may be warned
in advanced regarding what road has how many potholes. Distribution of this
information is an important aspect which we study in our Pothole detection
system.
This system is divided into three subsystems.
First is to sense the potholes encountered by it, about which it did not
have the prior information. Then communication subsystem which transfers the
information between GSM interface and User. When a vehicle gets this data, it
sees if it has sensed any potholes which the database does not have information
about the potholes is transmitted to the GSM Module as a feedback. The GPS
Module updates its database with the new entries of potholes. And finally the
localization subsystem which reads the data given by GPS Module and warns
the driver regarding the occurrence of potholes.
Second is to sense the CO emission encounter by the vehicle, after some
particular value if the emission increase it warns the user via Message and the
same data is send to RTO giving all the information about the Vehicle
Third is to sense the Obstacles in front of the driving vehicle. Here Laser
sensor is used which radiates ray of light, if the light reflects back than it is
assumed that obstacle is present. If so happens Driver is warns by giving Buzz
alarm and Blinking LED.
II

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TABLE OF CONTENTS
1. INTRODUCTION……………………………………….……………..….1
1.1 Introduction………………………………………………………………………1
1.2 Motivation………………………………………………………………………..2
1.3 Objective (Need for the project) …………………………………………………3
1.4 Organization of report…………………………………………………………….4
2. PROJECT BACKGROUND………………………………………………6
2.1 Literature Survey………………………………………………………………….6
2.2 Problem faced……….…………………………………………………………….6
2.3 Solution to that Problem.....…………….…………………………………………8
2.4 System description..….……………………………………………………………9
2.5 System requirement..…………………………………………………………….10
3. PROJECT DESIGN AND ANALYSIS..…………………………………13
3.1 Introduction………………………………………………………………………13
3.2 Block diagram…………………………………………………...……………….14
3.3 Hardware require..………………………………………………………………..15
3.3.1 Component explanation...………………………………………………15
3.3.1.1 Power supply and Solar panel Module…...…………………..16
3.3.1.2 Microcontroller Module..…………………………………….18
3.3.1.3 Sensors Module…………………………………..…………..22
3.3.1.4 GSM and GPS Module………....……………………...……..23
3.3.1.5 LCD Module…………………………………...……………..25
3.3.1.6 LED and ALARM Buzz Module……………………..……...27
III

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3.3.2 PCB layouts ………………………………………………………….28
3.4 Software required ...…….………………………………………………………30
3.4.1 PIC tools kit ….………………………………………………………30
3.4.2 Eagle.…………………………………………………………………39
4. IMPLEMENTATION ……………………………….…………………..49
4.1 Introduction …………………………………………….………………………49
4.2 Hardware Implementation (PCB fabrication) ………………………….………50
4.2.1 Layouts ……………………………………………………………….50
4.2.2 PCB design ……………….…………………………….…………….51
4.2.2.1 Cleaning……………………………………………………..52
4.2.2.2 Ironing……………………………………………………….52
4.2.2.3 Patterning (etching) …………………………………………53
4.2.2.4 Cleaning……………………………………………………..54
4.2.2.5 Drilling………………………………………………………54
4.2.2.6 Soldering…………………………………………………….54
4.2.2.7 Finishing………………………………………….………….54
4.2.2.8 Testing the layouts…………………………………………...54
4.3 Software Implementation …………………………………………………..……55
4.3.1 Introduction ……………………………………………………………55
4.3.2 Creating Ports …………………………………………………………55
4.3.3 Algorithms ……………………….……………………………………56
4.3.1 PIC tool Algorithms……………………………………………56
4.3.4 Flow charts …………………………………………………………….59
4.4 Implemented PCB Circuit………………………………………………………..62
IV

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5. TESTING AND RESULT ANALYSIS…………………………………...63
5.1 Potholes Testing and its Result...………………………………………………...63
5.2 CO Testing and its Result ………………………………………………………..65
5.3 Obstacles Testing and its Result …………………………………………………66
6. CONCLUSION AND FUTURE SCOPE ………………………………...67
6.1 Conclusion ……………………………………………………………………….67
6.2 Future scope and Further Modification ……………………………..………...…68
7. REFERENCES …………………………………………………………….69
8. TECHNICAL PAPER PRESENTATION…………………………….....70
9. APPENDIX ………………………………………………………………..74
V

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1. INTRODUCTION
1.1 Introduction
With the increase in world’s population, there has been increasing load on
the infrastructure. Roads have been flooded with the vehicular traffic. Vehicular
traffic has been rapidly growing over the recent years with more privately
owned vehicles taking to the streets each day. Today, trucks weigh significantly
more than ever before and are capable of carrying much larger payloads.
Because of many reasons like rains, oil spills, road accidents or inevitable wear
and tear make the road difficult to drive upon. Unexpected hurdles on road may
cause more accidents. Also because of the bad road conditions, fuel
consumption of the vehicle increases, causing wastage of precious fuel. Because
of these reasons it is very important to get the information of such bad road
conditions, Collect this information and distribute it to other vehicles, which in
turn can warn other driver. The other Problems are visibility and CO emissions
from the vehicles. So as to stop accident in hilly regions due to low visibility
some techniques have to be implemented. For CO emissions there should be
some steps taken so as to control Environmental pollution. But to put these into
real time application there are various challenges involved.
The entire system consists of 3 sub-systems:
• Sensing.
• Communication.
• Localization, Display and Alarm
These three subsystems work independent of each other, but have one
center point on which they revolve around, that is data. Sensing system
generates the data, Communication collects co-ordinates and distributes the
data, and lastly Localization uses the data and generates information for the
Govt. bodies and for the driver. And also it displays the location and interrupts
the driver by alarm tone and LED.
www.ijesi.org |Smart Vehicle Ensuring Safe Ride Page 1

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1.2 Motivation
With the increase in world’s population, there has been increasing load on
the infrastructure. Roads have been flooded with the vehicular traffic. It has
become increasingly difficult to manage this traffic. This is the prime
motivation behind making a vehicle intelligent enough to aid driver in various
aspects. One of the increasing problems the roads are facing is worsened road
conditions. Because of many reasons like rains, oil spills, road accidents or
inevitable wear and tear make the road difficult to drive upon. Unexpected
hurdles on road may cause more accidents. Also because of the bad road
conditions, fuel consumption of the vehicle increases; causing wastage of
precious fuel. Because of these reasons it is very important to get the
information of such bad road conditions, Collect this information and distribute
it to other vehicles, which in turn can warn the driver. But there are various
challenges involved in this. First of all there are various methods to get the
information about the road conditions. Now second and most important thing is
about environment which is affecting by CO gas which emits from vehicles, so
as the traffic increases number of vehicles increases and hence the CO emission.
So various sensors are used to get the information about the CO emission. Then
this information must be collected and distributed to all the vehicles that might
need this information. Lastly the information must be conveyed in the manner
which can be understood and used by driver. We in this project try to design and
build such a system. In this system the access point collects the information
about the potholes, CO emission and Obstacle in front of vehicle using Laser
Sensor and further it vicinity of a wireless access point and distributes to other
vehicles using a wireless broadcast. Here 'vicinity' is a user defined term. Ideally
the vicinity is every rout till the next access point.

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1.3 Goals and Objectives
The goal of our project work was to develop an automated data collection
system that can be installed in any automotive vehicle to monitor road or
highway pavement conditions. In order to reach this goal, we had to meet all of
our objectives by our set deadlines. Meeting these deadlines will assure that we
are where we need to be to successfully achieve our goal. Within the context of
our overall goal, we developed the following objectives:
The first goal of our project was to research potholes, GPS,
accelerometers, and hardware and software solutions.
This involves two main steps:
• How to design a working prototype for an automated data collection
system that can monitor road conditions.
• How to process data with Geographical Information System software to
map surface roughness data from GPS coordinates on a user-viewable
city map.
The health effects of carbon monoxide (CO) on the human body are well
known, but there has recently been an increasing awareness and interest
amongst the general public. One reason has been a number of well-publicized
incidents, stimulating media interest in the subject. It has long been recognized
that incomplete combustion, for whatever reason, can create hazardous levels of
CO.
The Second goal of our project was to install a system that will identify
levels of CO emission and inform the consumers via message, which have a role
to play as a further safety assurance to consumers as well to environment.
The Third goal of our project was to install a system that will identify
conditions of low visibility and notify approaching drivers of obstacle before
they encounter it. This information is provided to Driver with alarm and
Blinking LED.

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1.4 Organization of report
Chapter I Describes the causes of pothole formation and detection. Also it
detects CO emission and obstacles in front of vehicles. The detection of
obstacles is also possible in Foggy condition.
Chapter II Presents all the relevant literature reviewed on a case study.
The literature review is divided into 3 categories,
• Sense the potholes encountered and its detection and send information
to GOVT. bodies and all subscribed users.
• CO emission encounter by the vehicle and the user is informed via
Message and the same data is send to RTO.
• Sense the Obstacles in front of the driving vehicle and the user is
informed via Buzz alarm and Blinking LED.
Chapter III Involves in detail the Designing of Project.
The Designing of Project is divided into 4 categories,
• Design Outline.
• Phases of the Project.
• Development plan.
• Testing Plan.
Chapter IV Implementation of Project.
This chapter divided into 6 categories
• Implementing Packaging Requirements.
• Reviewing Data Processing Requirements.
• PCB Fabrication.
• Hardware Implementation
• Software Implementation.
• Interfacing both of them.

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Chapter V Testing and Result Analysis of complete Project designed.
This chapter has 3 testing to be performed
1) Potholes testing and analyzing the result.
2) CO testing and analyzing the result.
3) Obstacles testing and analyzing the result.
Chapter VI Summarizes the achievements of this thesis. This chapter also
includes pros and cons of the designed project.
Chapter VII Includes Conclusion, Future Scope and Its further Modification.
Chapter VIII References taken for developing the project.
Chapter IX Contents Technical paper presentation of the project.
Chapter X Appendix.
This has two sections which are as follows:-
1. Hardware
2. Software

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2. PROJECT BACKGROUND
2.1 Literature Survey and Problem Faced
In this article we will be talking about something that Indian drivers have
come to accept as part of their suffering. As there are 3 major problem drivers
are facing Potholes, Low visibility and the maintenances of their vehicles. Now
we will look step by step each problems.
Very few Indian roads are made of concrete. Concrete roads can last up to
sixty years and only require maintenance every 5 – 10 years, but our bituminous
roads don’t last this long and require to be serviced every eight or ten months.
Despite the huge amount of money sanctioned to maintain the roads, the
assignments are often given to contractors who use poor quality material. India
has the world’s second largest road network and this network is clogged due to
India’s booming automobile industry that adds about 7 million new vehicles to
the roads every year. India is no stranger to traffic jams; indeed, during peak
hours, drivers in Bangalore can’t go over 16 kilometers per hour and in Delhi
and Mumbai they crawl at 18 kilometers per hour. There are undoubtedly many
reasons for these traffic jams, including the blatant disregard for the rules, the
inadequate number of lanes, overworked traffic police and the endless potholes
present on Indian roads. It would be impossible to expect the disappearance of
these altogether. Potholes also cause Economic losses.
According to studies that have been conducted by the World Bank, poor
road infrastructure i.e. potholes, result in a loss of 300 billion INR every year.
Despite the fact that India makes up only a small part of this figure, in the long
list of nuisances to the Indian driver, potholes feature quite prominently.
Besides causing delays in transportation, potholes require more consumption of
fuel and require an increased Vehicle Operating Cost or a VOC. Running over a
pothole can cause the tier to wear out unevenly and alter the alignment of the

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wheel and steering which is dangerous when turning corners or when driving at
high speeds.
A 2009 study conducted by IIM in collaboration with the Transport
Corporation of India stated that Indian truckers clocked only 100,000 kilometers
a year which was 300,000 less than their American counterparts.
In 2010 BMC (Brihanmumbai Municipal Corporation) of Mumbai had
sanctioned INR 40Crores to fill in the potholes before the monsoon. But it is
estimated that Mumbai has 723 major arterial and minor roads that have
potholes and it looks like the Mumbaikers are in for another post-difficult
monsoon.
As other major Losses are due to Low visibility in hilly areas due to
which there are major accident taking place. As per the review in 2010 there
were many accident cases filed in many hilly areas and it has be important to
find out some solution. The Government of INDIA have spend many Crores of
INR to implement some of the technologies, so as to figure out the obstacles in
front of vehicles
The environmental organizations have started their protest against the CO
emission from the vehicles and these have been worldwide accepted and many
technologies have been implemented to overcome these problem. The major
problem is that if a leakage path (blocked or disconnected vent) of appliance
exhaust to living space is present, then a CO exposure hazard is created.

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2.2 Solution to that Problem
The Solution is that we have to design a device that is automatic data
collection system that can be installed in any automotive vehicle to monitor
road or highway pavement conditions. In order to reach this goal, we had to
meet all of our objectives by our set deadlines. Meeting these deadlines will
assure that we are where we need to be to successfully achieve our goal. Within
the context of our overall goal, we developed the following objectives:
The first goal of our project was to research potholes, GPS,
accelerometers, and hardware and software solutions.
This involves two main steps:
• How to design a working prototype for an automated data collection
system that can monitor road conditions.
• How to process data with Geographical Information System software to
map surface roughness data from GPS coordinates on a user-viewable
city map.
The health effects of carbon monoxide (CO) on the human body are well
known, but there has recently been an increasing awareness and interest
amongst the general public. One reason has been a number of well-publicized
incidents, stimulating media interest in the subject. It has long been recognized
that incomplete combustion, for whatever reason, can create hazardous levels of
CO.
The Second goal of our project was to install a system that will identify
levels of CO emission and inform the consumers via message, which have a role
to play as a further safety assurance to consumers as well to environment.
The Third goal of our project was to install a system that will identify
conditions of low visibility and notify approaching drivers of obstacle before
they encounter it. This information is provided to Driver with alarm and
Blinking LED.

_________________________________________________________________________________________________________________________
2.3 System Descriptions
The entire system consists of 3 sub-systems:
• Sensing.
• Communication.
center point they revolve around; that is data.
Sensing system generates the data, Communication collects co-ordinates
and distributes the data, and lastly Localization uses the data and generates
information for the Govt. bodies and for the driver. And also it displays the
location and interrupts the driver by alarm tone and LED.
This subsystem is responsible for getting the data. The data in this case
would be the data about pothole e.g. location of pothole, the severity of the
pothole. There were two methods under consideration for this subsystem one is
Vision based and the other is vibration based.

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2.4 System Requirements
• Rugged Design.
• Device must be able to display if the device is correctly
working.
• Device must log the location of road conditions.
• The device must be able to operate for a week’s worth of data.
• Get Power from the Cigarette Lighter.
• Display if memory is almost full.
• Display if device is writing to memory.
• Have a standby button.
• Display if system is in standby mode.
• Must be portable.
• Must be easy to mount.
Technical Specification :
• WORKING VOLTAGE - 12V DC
• OPRATING CURRENT - 250MA
• OUTPUT RATING - 230V AC / 500W
• IR FREQUENCY - 38KHZ
• OPRATING RANGE - 10 METERS
Component List :
1. Micro controller: PIC 16F877A
• At least 4 Serial Ports
• At least 8 8-bit Analog to Digital Converters
• At least 18 Digital I/O ports
• External Flash memory
• Ports are designated for the LCD display, one for GPS, one
for programming, and a final one for debugging.
2. Accelerometer: ADXL203
• Single axis accelerometer
• Respond to frequencies below 20 Hz

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3. Co sensor: MQ 7
• High reliability sensor
• Operating temp range: -4 to +122 °F (-20 to +50 °C)
• Available for Natural gas, LPG, CO
• High sensitivity to Carbon Monoxide (CO)
• Stable and long life
• Malfunction auto-check indicator and Auto-reset after alarm
4. Laser sensor
• Non-contact detection
• Highly accurate detection
• Detection of targets of virtually any material
5. GSM and GPS INTERFACE : MAX 232
6. Power supply: 12 V
7. Solar panel: 12V 500m AMP
8. LED and ALARM
9. LCD (16 x 2)

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10. Transmitter Board
• R1, 6 - 47K [yellow, violet, orange]
• R2 - 22E [red, red, black]
• R3 - 1K [brown, black, red]
• R4 - 6K8 [blue, gray, red]
• R5 - 1K8 [brown, gray, red]
• C1 - 47UF / 25V ELECTROLYTIC
• C2 - 0.1UF DISC (100nf / 104)
• C3 - 0.001UF DISC (1nf / 102)
• D1 - 5.1V / ½ W ZENER DIODE
• D2 - IN4007 DIODE
• D3 - 5mm IR LED
• U1 - CD4093 CMOS IC
• Q1 - BC557 PNP TRANSISTOR
• J2 - PCB MOUNT DC JACK
• 1nos - 14 PIN IC SOCKET
11. Receiver Board
• R1, 4, 5 - 470E [yellow, violet, brown]
• R2, 3 - 6K8 [blue, gray, red]
• R6 - 47K [yellow, violet, orange]
• C1 - 47UF / 16V ELECTROLYTIC
• C2 - 100UF / 16V
• C3, 4 - 10UF / 16V
• C5 - 1UF / 16V
• D1, 2 - IN4007 DIODE
• D3 - 5.1V ZENER DIODE
• D4 - 5 mm RED LED
• D5, 6 - IN4148 DIODE
• U1 - IR RECEIVER MODULE
• Q1 - BC557 - PNP TRANSISTOR
• Q2 - BC547 – NPN TRANSISTOR
• RL1 - 12V / 1CO PCB MOUNT RELAY
• J1 - PCB MOUNT DC JACK
• J2 - PCB MOUNT POWER CONNECTOR

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3. PROJECT DESIGN AND ANALYSIS
3.1 Introduction
In the following sections, the overall system design of the project will be
presented. The entire system consists of 3 sub-systems:
• Sensing.
• Communication.
center point they revolve around; that is data.
Sensing system generates the data, Communication collects co-ordinates
and distributes the data, and lastly Localization uses the data and generates
information for the Govt. bodies and for the driver. And also it displays the
location and interrupts the driver by alarm tone and LED.
This subsystem is responsible for getting the data. The data in this case
would be the data about pothole e.g. location of pothole, the severity of the
pothole. There were two methods under consideration for this subsystem one is
Vision based and the other is vibration based.
The overall design can be broken down into 8 sub-to-sub systems which include
the
• Accelerometer module.
• Co module.
• Laser Module.
• GSM and GPS module.
• LCD module.
• LED and Alarm module.
• Microcontroller module.
• Power supply with Solar panel module.

International Journal of Engineering ngineering and Science Invention
ISSN (Online): 2319 – 6757, ISSN (Print): 2319
www.ijesi.org | Volume 2 | Issue 7| July. 2013
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3.2 Block diagram
– 6727
| PP.10 – 9
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3.3 Hardware Required
For enhancing any project there are two types of requirement hardware
and software. In hardware there are many types of component. These are listed
below as follows:-
3.3.1 Component Explanation
3.3.1.1 Microcontroller Module:
Microcontroller: PIC 16F877A
PIC stands for Peripheral Interface Controller .Microcontroller
16F877 is the heart of the project. It is an 8-bit microcontroller. It has
3KB of data memory, 8KB of flash memory, and 2KB of EEPROM.
Now we are using PIC 16F877A for these project.
Features of PIC 16F877A:
• Small instruction set to learn
• High-Performance RISC architecture
• Built in oscillator with selectable speeds
• Operating speed: 20 MHz, 200 ns instruction cycle
• Operating voltage: 4.0-5.5V
• Industrial temperature range (-40° to +85°C)
• 15 Interrupt Sources
• 35 single-word instructions
• All single-cycle instructions except for program branches (two-cycle)
• Flash Memory: 14.3 Kbytes (8192 words)
• Data SRAM: 368 bytes
• Data EEPROM: 256 bytes

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• Watchdog Timer with on-chip RC oscillator
• Programmable code protection
• Power-saving Sleep mode
Analog Features of PIC 16F877A:
• 10-bit, 8-channel A/D Converter
• Brown-Out Reset
• Analog Comparator module
2 analog comparators
Programmable on-chip voltage reference module
Programmable input multiplexing from device inputs and internal
VREF
Comparator outputs are externally accessible.
3.3.1.2 Accelerometer Module:
Accelerometer:
This is a device that measures total specific external force on the
sensor. For example if the device is stationary, it will show some reading
corresponding to earth's gravitational force. An accelerometer falling
freely in the vacuum will show zero reading. The design of the
accelerometer is often very simple. The simplest design can be a mass
hanging by a thread and some sensor to measure its deflection for
original. The device is popularly used to measure vibration or inclination.
It is popularly used in iTouch and some cameras to detect inclination and
change the view of the display.

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But we are using ADXL203. It is a high precision, low power, dual-axis
accelerometers with signal conditioned voltage outputs on a single
IC. The output signals are analog voltages proportional to acceleration.
ADXL203 can measure acceleration, both static and dynamic, with a full-scale
range of 1.7 g.
Features of ADXL203:
• High performance, dual-axis accelerometer on a single IC chip.
• Low power: 700 μA at VS = 5 V (typical).
• High zero g bias stability and sensitivity accuracy.
• −40°C to +125°C temperature range.
• X and Y axes aligned to within 0.1° (typical).
• Bandwidth adjustment with a single capacitor.
• Single-supply operation.
• 3500 g shock survival.
• Qualified for automotive applications.
3.3.1.3 Laser sensor Module:
Laser sensor:
A laser sensor emits a beam of light from its transmitter. A
reflective type photoelectric sensor is used to detect the light beam
reflected from the target and the thru beam type is used to measure the
change in light quantity caused by the target crossing the beam.

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Features Laser sensor:
• Non-contact detection.
• Detection of targets of virtually any material.
• Long-detecting distance.
• High response speed.
• Highly accurate detection.
3.3.1.4 CO Sensor Module:
CO (Carbon Monoxide) Gas Sensor:
The CO (Carbon Monoxide) Gas Sensor is used in gas detection
equipment for detecting Carbon Monoxide in home, automotive or
industrial settings. This line of sensors can be interfaced with any of the
Parallax microcontrollers, and would be a good addition to any projects
needing to sense the presence of carbon monoxide. Here we are using
model MQ-7
Feature of MQ-7:
• High reliability sensor, excellent stability
• Auto-reset after alarm
• MCU processing adopted
• Malfunction auto-check indicator
• Alarm output N. C. / N. O. Optional

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• Available for Natural gas, LPG, CO
• High sensitivity to Carbon Monoxide (CO)
• Stable and long life
• Simple drive circuit
Key Specifications:
• Power requirements: 5 VDC @ ~160mA
• Interface Type: Resistive
• Operating temp range: -4 to +122 °F (-20 to +50 °C)
3.3.1.5 LCD Module:
LCD (Liquid Crystal Display) screen is an electronic display module and
find a wide range of applications. A 16x2 LCD display is very basic module and
is very commonly used in various devices and circuits. These modules are
preferred over seven segments and other multi segment LEDs. The reasons
being: LCDs are economical; easily programmable; have no limitation of
displaying special even custom characters(unlike in seven segments),
animations and so on.
A 16x2 LCD means it can display 16 characters per line and there are 2
such lines. In this LCD each character is displayed in 5x7 pixel matrix. This
LCD has two registers, namely, Command and Data. The command register
stores the command instructions given to the LCD. A command is an instruction
given to LCD to do a predefined task like initializing it, clearing its screen,
setting the cursor position, controlling display etc. The data register stores the
data to be displayed on the LCD. The data is the ASCII value of the character to
be displayed on the LCD.

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Features of LCD:
• 5 x 8 dots with cursor
• Built-in controller (KS 066 or Equivalent)
• + 5V power supply (Also available for + 3V)
• 1/16 duty cycle
• B/L to be driven by pin 1, pin 2 or pin 15, pin 16 or A.K (LED)
• N.V. optional for + 3V power supply
3.3.1.6 LED and ALARM Buzz Module:
LED
A light-emitting diode (LED) is a semiconductor light source.
LEDs are used as indicator lamps in many devices, and are increasingly
used for lighting. LEDs emitted low-intensity red light, but modern
versions are available across the visible, ultraviolet and infrared
wavelengths, with very high brightness.

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When a diode is forward biased (switched on), electrons are able to
recombine with holes within the device, releasing energy in the form of
photons. This effect is called electroluminescence and the color of the
light (corresponding to the energy of the photon) is determined by the
energy gap of the semiconductor..LEDs present many advantages over
incandescent light sources including lower energy consumption, longer
lifetime, improved robustness, smaller size, faster switching, and greater
durability and reliability. Current LED products for general lighting are
more expensive to buy than fluorescent lamp sources of comparable
output. They also enjoy use in applications as diverse as replacements for
traditional light sources in automotive lighting (particularly indicators)
and in traffic signals. The compact size of LEDs has allowed new text
and video displays and sensors to be developed, while their high
switching rates are useful in advanced communications technology.
ALARM Buzz :
A device for the purpose of detecting obstacle that produces a
distinct audible alarm.
A device for the purpose of detecting obstacle that produces a
distinct audible alarm, and is listed or labeled with the appropriate
standard, either ANSI/UL 2034 - 96, Standard for Single and Multiple
Station CO Alarms, or UL 2075 – 04.

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3.3.1.7 GSM and GPS Module:
GSM and GPS INTERFACE: MAX 232
GSM- GSM stands for Global System for Mobile Communications.GSM
is a system that involves telecommunications such as mobile
phones.GSM modem using RS232 communication, by the GSM modem
connection to the PIC through the MAX232. PIC UART to send and
receive UART according to her protocol.GSM Modem AT Command set
to operate through. The interfacing of a GSM Module with a PIC
microcontroller. It also covers a way to dial a particular GSM mobile
number as well as send a message to it using AT Commands with the
help of PIC16F877A:
Examples of AT Command are listed below.
AT+CGMI Manufacturer identification
AT+CGMM Request model identification
AT+CGMR Request revision identification
AT+CGSN Product Serial Number
ATD Dial command
ATH Hang-Up command
AT+CMGF Preferred Message Format
AT+CMGS Send message

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MAX232-
The MAX232 was the first IC which in one package contains the
necessary drivers (two) and receivers (also two), to adapt the RS-232
signal voltage levels to TTL logic. It became popular, because it just
needs one voltage (+5V) and generates the necessary RS-232 voltage
levels (approx. -10V and +10V) internally. This greatly simplified the
design of circuitry. The MAX232 has a successor, the MAX232A. It
should be noted that the MAX232 (A) is just a driver/receiver. It does not
generate the necessary RS-232 sequence of marks and spaces with the
right timing, it does not decode the RS-232 signal, it does not provide a
serial/parallel conversion. All it does is to convert signal voltage levels.
Generating serial data with the right timing and decoding serial data has
to be done by additional circuitry.
The original manufacturer offers a large series of similar ICs, with different
numbers of receivers and drivers, voltages, built-in or external capacitors, etc.
E.g. The MAX232 and MAX232A need external capacitors for the internal
voltage pump, while theMAX233 has these capacitors built-in.

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3.3.1.8 Power Supply and Solar panel Module:
Power Supply:
The performance of the master box depends on the proper functioning of
the power supply unit. The power supply converts not only A.C into D.C, but
also provides output voltage of 5V, 1 amp. The essential components of the
power supply are Transformer, four diodes which forms bridge rectifier,
capacitor which work as a filter and positive voltage regulator IC 7805. It
provides 5v to each block of the transmitter.
Solar panel: 12V 500m AMP
They are the preferred method of power sourcing for remote areas that
lack access to the main power grid, or can be used in any home emergency
situation during a power loss. A solar generator literally can supply power for
free and as needed. They are typically highly efficient and powerful, easy to
use, and compact, making storage and usage convenient.
Best of all, solar generators emit no fumes into the air, so they represent
the very best in green power. You will find a huge selection of solar generators
using our store links below, at a variety of price points sure to fit any budget.
3.3.1.9 PCB Module:

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3.3.1.9.1 Design of Microcontroller PCB:
After having successful simulations, the circuit was constructed on a
bread board, tested, and was then put onto PCB board. The module was then
coated in an epoxy to protect it from environmental hazards such as water and
sand. Using this coated module, field testing was able to be done.
3.3.1.9.2 Design of Accelerometer PCB:

International Journal of Engineering ngineering and Science Invention
ISSN (Online): 2319 – 6757, ISSN (Print): 2319
– 6727
www.ijesi.org | Volume 2 | Issue 7| July. 2013
| PP.10 – 9
_________________________________________________________________________________________________________________________
After having successful simulations, the circuit was constructed
on a bread board, tested, and was then put onto PCB board. The module was
then coated in an epoxy to protect it from
and sand. Using this coated module, field testing was able to be done.
3.3.1.9.3 Design of CO sensor
In one version, an adjustable voltage regulator is used to get a 1.4v
power line. A really tiny relay toggles between that voltage and the 5v from the
Adriano circuit. The other version uses 4 diodes, in series, to drop the voltage
down (it went about 1.2v each time).
These are 4148 300mv diodes.
used to toggle between the voltages
send it HIGH, and 5v is pumped to the sensor.
sketches with the board so that you can be doing whatever you’d like in the
sketch, and don’t need to worry about the toggling
background.
3.3.1.9.4 Design of LASER sensor
environmental hazards such as water
PCB:
2v In both boards, a single digital pin can be
– just send the pin LOW, and you get 1.4v,
I will be releasing timer
hes – it will happen in the
PCB:
timer-based

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I used SMD components to fit the circuit on the bottom side of the sensor's
PCB. I used resistors with 0805 form-factor. The PCB size was 39.25 x 16.7
mm. I used a laser printer to print PCB layout and a hot iron to transfer the
printed image to the bottom copper layer of the interface board. Then I used
Ferric Chloride (FeCl3) to remove uncovered parts of the copper layer. After
mounting electronic components on the PCB I formed contacts of the S6986 to
place it into the lens focus. I measured the lens focus distance and found that it
was about 10 mm.
3.3.1.9.4 Design of GPS:
GPS accuracy in our deployment is important if potholes are to be
properly located and multiple detections combined to report a single pothole. To
measure accuracy, we placed a thick metal bar across a road, and repeatedly
drove over it. For each drive, we first identify the peak accelerometer reading r
in the drive, and then find the estimated location of the car when r occurred,
using linear interpolation between GPS readings. We found the standard
deviation of the positions reported for the bar to be 3.3 meters, which is
consistent with typical measurement errors from modern GPS receivers
outdoors.
3.3.1.9.6 Design of LCD and LED PCB:

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Looking at the schematic it can be seen that this circuit is not
challenging to understand but provides all the necessary components to let the
LCD work easily with minimal wiring mess. In the upper left hand corner .The
standard pin out for the Hitachi can be seen even though pins seven through ten
aren’t used by the 16-pin LCD header due to this board being specifically built
for four-bit mode.
Input Port: The input port from the microcontroller is the first place to
start. A standard eight-pin header is used here because most 8-bit
microcontrollers use eight pin ports and on development boards that is generally
how the pins are pulled out.
5V Step Down Regulator: LCD model (S) runs on 5V DC so attaching
the output of the 7805 directly to pin two of the LCD header takes care of my
input voltage requirements. Second, if I were using the U-model LCD and had
an low-power input voltage of 3.3V it would be necessary to create a negative
voltage between -0.7 and -1.4V so that the potential voltage differential between
Vcc and Vo is greater than about 4.0V in order for the contrast to work. This
circuitry, depending on how it is implemented, can cost more PCB real estate
and can actually cost more in components than putting in a 5.0V regulator.
Note: When the input voltage is large (greater than 12 or 15V) or when the
voltage regulator is sourcing a good amount of current the chip will get very
hot to the touch. If the chip gets extremely hot with no load then there’s a good
chance there is a power and ground short somewhere on the board.
3.3.1.9.7 Design of GSM/GPRS along with MAX232:

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This can be said as the backbone of the system. This subsystem collects
the data from different vehicles; Co-ordinates the data and broadcasts it to other
vehicles. This system uses GPS infrastructure for communication between
Access point and Mobile nodes. There are multiple approaches in which this
subsystem can be implemented some of which are as explained below.
MAX 232:
3.4 Software required

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3.4.1 PIC tools kit
The PICBASIC PRO™ Compiler (or PBP) makes it even quicker and
easier for you to program Microchip Technology’s powerful PIC®
microcontrollers (MCUs). The English-like BASIC language is much easier to
read and write than assembly language. The PICBASIC PRO Compiler is
“BASIC Stamp II like” and has most of the libraries and functions of both the
BASIC Stamp I and II. Being a true compiler, programs execute much faster
and may be longer than their Stamp equivalents. PBP is not quite as compatible
with the BASIC Stamps as our original PICBASIC™ Compiler is with the BS1.
Decisions were made that we hope improve the language overall. One of these
was to add a real IF..THEN..ELSE..ENDIF instead of the IF..THEN(GOTO) of
the Stamps. These differences are spelled out later in this manual. PBP defaults
to create files that run on a PIC16F84 clocked at 4MHz. Only a minimum of
other parts are necessary: 2 22pf capacitors for the 4MHz crystal, a 4.7K pull-up
resistor tied to the MCLR pin and a suitable 5- volt power supply. PIC MCUs
other than the 16F84, as well as oscillators of frequencies other than 4MHz,
may be used with the PICBASIC PRO Compiler.
PICBASIC PRO Compiler (PBP) is intended to be used within a system
comprised of several tools. Below is a brief list of commonly used components,
listed in the order in which you are likely to encounter them. Your PBP
installation typically includes PICBASIC PRO Compiler, Mecanique's
MicroCode Studio IDE, Microchip's MPLAB IDE, and Microchip's MPASM
assembler. If you obtained PBP as a reduced file size download, the installation
does not include MPLAB and MPASM, but the installation process will offer
you the chance to download and install MPLAB. MPLAB includes MPASM.
The latest version of MPLAB can always be downloaded from Microchip's
website (www.microchip.com)
Integrated Development Environment (IDE)
The IDE is the user interface, in which you create and edit your program.
A good IDE will also manage the following tools, invoking them when needed.
Examples of IDEs include MicroCode Studio from Mecanique and MPLAB
from Microchip
Compiler

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The compiler is the tool that converts your BASIC program into
Assembly Language. PBP is a compiler. PBP depends on an IDE for user
interface, and an assembler to finish the conversion to machine language
Assembler
The assembler is the tool that converts the Assembly Language into
machine language. The assembler runs after the compiler, and is normally
invoked automatically. PBP is designed to use Microchip's MPASM assembler,
which is included with MPLAB.
Device Programmer
The device programmer takes the machine language code and burns it
into the microcontroller. Examples of device programmers are the U2
Programmer from melabs and the PICkit 3 from Microchip. The melabs U2
Programmer is recommended for ease of use and availability of technical
support.
Debugger
A debugger is used to see what is happening inside the microcontroller
when it runs. The simplest method of debugging is to write bits of code into
your program that display information like variable and register values. The
term In Circuit Debugger (ICD) refers to a device or method that gives you
steps – by - step control of program execution via a connection to the
microcontroller.
Examples of debuggers are the ICD3 from Microchip and the software -
based ICD system offered in MicroCode Studio PLUS from Mecanique.
Special Terminology and Acronyms
Some acronyms and terms that will be used extensively in this manual
are:
PBP PICBASIC PRO™ Compiler
PBPW PBP in WORD mode
PBPL PBP in LONG mode
Melabs micro Engineering Labs, Inc
Ports and Other Registers

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All of the PIC MCU registers, including the ports, can be accessed
just like any other byte-sized variable in PICBASIC PRO. This means
that they can be read from, written to or used in equations directly:
PORTA = %01010101 ‘Write value to PORTA
anyvar = PORTB $0f ‘ Isolate lower 4 bits of PORTB and place result
into anyvar
Pins
Pins may be accessed in a number of different ways. The simplest
way to specify a pin for an operation is to simply use its PORT name and
bit number:
PORTB.1 = 1 ‘ Set PORTB, bit 1 to a 1
To make it easier to remember what a pin is used for, it may be assigned
a name using the VAR command. In this manner, the name may then be
used in any operation:
led Var PORTA.0 ‘ Rename PORTA.0 as led
High led ‘ Set led (PORTA.0) high
For compatibility with the BASIC Stamp, pins used In PICBASIC PRO
Compiler commands may also be referred to by a number, 0 - 15. This
number references different physical pins on the PIC MCU hardware
ports dependent on how many pins the microcontroller has.
PICBASIC PRO Compiler 28 No.
PIC MCU Pins 0-7
8 - 158-pin GPIO GPIO1
And
20-pin PORTA PORTC
18-pin PORTB PORTA
28-pin (except 14000) PORTB PORTC
14000 PORTC PORTD

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40-pin and up PORTB PORTC
If a port does not have 8 pins, such as PORTA, only the pin numbers that
exist may be used, i.e. 8 - 12. Using pin numbers 13 - 15 will have no
discernible effect. This pin number, 0 - 15, has nothing to do with the
physical pin number of a PIC MCU. Depending on the particular PIC
MCU, pin number 0 could be physical pin 6, 21 or 33, but in each case it
maps to PORTB.0
(or GPIO.0 for 8-pin devices, or PORTA.0 for 14 and 20-pin devices, or
PORTC.0 for a PIC14000).
High 0 ‘ Set PORTB.0 (or GPIO.0)
High B0 = 9 ‘ Select PORTC.1 (or PORTA.1)
Toggle B0 ‘ Toggle PORTC.1 (or PORTA.1)
Pins may be referenced by number (0 - 15), name
(e.g. Pin0, if BS1DEFS.BAS or BS2DEFS.BAS is included or you have
defined them yourself), or full bit name (e.g. PORTA.1). Any pin or bit of
the microcontroller can be accessed using the latter method. The pin
names (i.e.Pin0) are not automatically included in your program. In most
cases, you would define pin names as you see fit using the
VAR command:
led Var PORTB.3
However, two definition files have been provided to enhance BASIC
Stamp compatibility. The files BS1DEFS.BAS Or BS2DEFS.BAS may
be included in the PICBASIC PRO program to provide pin and bit names
that match the BASIC Stamp names. Include “bs1defs.bas”
or PICBASIC PRO Compiler 29
Include “bs2defs.bas”
BS1DEFS.BAS

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Defines Pins, B0-B13, W0-W6 and most of the other BS1 pin and
variable names. BS2DEFS.BAS defines Ins ,Outs ,InL, Inh, OutL, Outh,
B0-B25,W0-W12 and most of the other BS2 pin and variable names.
PORTL and PORTH are also defined in PBP.
PORTL encompasses Pin0 - Pin7
And
PORTH encompasses Pin8 - Pin15.
When a PIC MCU powers-up, all of the pins are set to input. To
use pin as an output, the pin or port must be set to an output or a
command must be used that automatically sets a pin to an output. To set a
pin or port to an output (or input), set Its TRIS register. Setting a TRIS bit
to 0 makes its corresponding port pin an output. Setting a TRIS bit to 1
makes its corresponding port pin an input.
For example:
TRISA = %00000000 ‘Or TRISA = 0sets all the PORTA pins to outputs.
TRISB = %11111111 ‘Or TRISB = 255 sets all the PORTB pins to
inputs.
TRISC = %10101010 Sets all the even pins on PORTC to outputs, and
the odd pins to inputs.
Individual bit directions may be set in the same manner.
TRISA.0 = 0 sets PORTA, pin 0 to an output.
All of the other pin directions on PORTA are unchanged.
The BASIC Stamp variable names Dirs , Dirh , Dirl and Dir0 - Dir15 are
not defined and must not be used with the PICBASIC PRO Compiler.
TRIS must be used instead, but has the opposite state of Dirs.
PICBASIC PRO Compiler 30. This does not work in PICBASIC PRO:
Dir0 = 1 ‘Doesn’t set pin PORTB.0 to output Do this instead: TRISB.0

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Features
Familiar BASIC syntax
o IF (condition) THEN / ELSE / ELSEIF /ENDIF
o SELECT CASE
o FOR… NEXT
o DO WHILE/UNTIL
Direct Register Access
o All Special Function Registers are pre-mapped by
PBP and accessible by name
Built-In Commands for operations common to embedded
development
o Accurate Delays in uS and mS resolutions
o Analog to Digital Conversion
o Asynchronous Serial Communications (RS-232,
RS-485, etc)
o Synchronous Serial including I2C and SPI
o Character LCD
o PWM
o USB
o Parsing and Formatting of ASCII Strings
o Sinusoidal Frequency Generation and DTMF
(requires hardware filtering)
o Pulse-Width Measurement
o Low-Power Mode
Conditional Compilation with Command-Line Constants
In-Line Assembly Language
Easy Device Configuration
o Configuration settings listed for each supported
device
o New #CONFIG directive eliminates the need to
edit header files
Interrupts in BASIC or Assembly Language
Newly revised and expanded, 300+ page reference
manual.
MPLAB/MPLABX compatible.
Micro Engineering Labs technical support via telephone,
email, and community forum (phone and email support
not available for Experimenter Edition.)

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3.4.2 Eagle
The PCB View
So your circuit works and also looks great in Fritzing's Breadboard
View. Let's now have a look at the PCB View. To switch to the PCB View
use the Navigator or the View Switcher. While it is very easy to recognize
parts in the Breadboard View, the PCB View might look a bit confusing at
first glance. The reason for this is that the PCB View only shows the
necessary information needed for the PCB design. This information is shown
in different layers. To view or hide layers, use the View options in the menu
bar. Learn more about the PCB View layers.
As an example, lets have a look first at the following circuit which was
created in Breadboard View:

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Selecting PCB View in the Navigator will show a completely different
illustration of the same circuit. The green rectangle is the board itself, on which
parts will be arranged. It is automatically placed as you open a new sketch.
Parts are shown as footprints, including the Arduino footprint, and you can
identify them by selecting or placing the cursor on them to see their labels.
The thin connecting lines are the Rat's Nest (more about the Rat's Nest below).
You might want to resize the board, or use an Arduino shield or a board with a
custom shape. Select the board and choose/edit your prefered shape in the
Inspector.

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Arranging parts on the board
The first step in designing a PCB layout is arranging the parts on the
board. There are some very important issues to consider here, because the
location of parts on the board will have a great effect on how successful the
routing process will be.
Follow these guidelines:
1. Place the parts with the most connections in the middle of the
board.
2. Notice that Arduino's footprint should also be positioned on the
board, just like other parts (new in version 3.0).
3. Rotate and position parts, leaving enough space between them
(don't forget their actual size!).

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4. If the board is too small, redefine its width and height in the
Inspector or alternatively resize the board by dragging its corners.
Learn how to design a PCB with a custom shape.
5. Don't place parts too close to the edges of the board.
6. To avoid short circuits, don't place parts too close to the USB
connector outline on the Arduino Shield.
7. When designing stack shields, parts' heights should also be
considered.
The following screenshot shows one out of many possible part arrangements for
the given circuit:

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Auto-routing
After positioning all parts on the board, be aware that parts are not really
connected to each other yet. The thin connecting lines that you see (Rat's Nest
Layer) only act as a guideline. We would now want Fritzing to automatically
generate the connection traces between parts. Click the Auto-route function
from the bottom menu bar. If you notice that Fritzing is struggling trying to
generate a connection, you can press the Skip this Trace button or Cancel
Auto-routing in the bottom menu while in process.
Such a problem might happen because parts were not arranged properly on the
board or when there is just no possible route. You will then need to Hand-route
the trace (more about hand-route below) or create a jumper. Jumpers are
connections that need to be soldered with external wires. These are shown as
blue connections while traces are shown as orange ones. In the screenshot

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below, two jumper wires were created after the routing between connectors
failed.
If you are happy with some of the traces and want to keep them
untouched, or you know in advance that some connections need jumpers, you
might want to tell Frizzing to exclude some connections in the auto-routing
process. To do so, select the connections you want to exclude, choose Don't
Auto route this trace in the right-click menu or in the Trace menu. Only then
press Auto-route. The selected traces will be left untouched while all other
connections will be auto-routed. Any traces that were hand routed are
automatically marked as Don't Auto route.

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Be aware that if you moved a part after auto-routing or hand-routing, the routing
traces are not corrected automatically. You will need to be cautious when
moving parts and make sure you don't create any short circuits.
Hand-routing
Use any of the following methods to hand-route traces and
jumpers:
1. The safest way is to right-click a Rat’s nest wire and chooses Create
Trace from Selected Wire(s) or Create Jumper from Selected Wire(s).
This will avoid making any changes in the circuit that you built in
Breadboard View.
2. Another way is to simply click a part's connector, and drag to make a
connection. A trace will be created. To create a jumper, just right-click on

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the trace and choose Create Jumper from Selected Wire(s). To avoid
incorrect wiring, we strongly recommend you follow the Rat's nest wire
connections while using this method.
Note that while clicking and holding on a connector, all equipotential
connectors are highlighted (in yellow). This shows the whole set of connections
attached to this particular connection, and can really help to make hand-routing
decisions. Once again, take good care not to cross wires!
Guidelines for better routing
For both auto- and hand-routing, follow these guidelines:
1. Place the parts with the most connections in the middle of the board.
2. Try to get short connections by moving and rotating parts.
3. Use the highlighting of equipotential connectors feature.

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4. Add bend points for tidy routing and so that lines do not cross.
5. Don't forget the traces can go under parts like resistors.
6. Use jumper wires instead of watching the auto-route go crazy.
Editing Traces
To achieve a better and nicer design, you would need to edit traces by
moving, adjusting width and adding bend points. Width adjustment can be
done in the Inspector. Please note that thin traces might ruin in a DIY PCB
production, so keeping traces in medium thickness is safer. To create a bend
points drag it simply out of a trace. Sometimes, it would be possible to edit
traces in a way that will reduce the number of jumpers. The routing in the
screenshot above was edited and a better design was achieved:

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Export Options
Frizzing features a variety of export options. When you are happy with
your PCB design, you can choose to export JPG, PNG, etch able PDF and
even Gerber files (for sending a professional PCB manufacturing service).
The Bill of Materials option generates a list of all parts in the circuit.
From the menu bar choose File Export and the desired format.
• For DIY PCB production, use the Etch able PDF option which exports
only the necessary design for etching.
• When exporting Gerber files, create a folder for the gerberas, and zip.
it before sending to a manufacturer.

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4. IMPLEMENTATION
4.1 Introduction
This chapter outlines the methods used by our project team to accomplish
our project goals. Briefly, we had to determine our system requirements when
choosing a microcontroller to fit our needs. The team also had to research
different means of measuring road conditions. As a result, the approach used to
develop our system was as follows:
1. Reviewed different methods to collect potholes and road conditions
2. Reviewed System Requirements
3. Implemented the design from system requirements
4. Implemented packing requirements (Size of case, user interface)
5. Reviewed data processing requirements
(How data from unit was going to be used to produce maps)
Our system depends on the accelerometer producing consistent results for
a given pothole, and on having accurate localization of events from the on-board
GPS. In this section, we describe a few experiments we performed to validate
the functioning of our sensors. We also discuss how our training data was
gathered. The signals from the dashboard and windshield appear to be quite
similar, while the accelerometer attached to the computer produced
unpredictable results. Consequently, we firmly attached the accelerometer to the
dashboard inside the car’s glove box, which is a relatively easy location to
install sensors on, and which keeps the sensors out of the way of passengers in
the cabin.

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4.2 Hardware Implementation (PCB fabrication)
4.2.1 Circuit Diagram

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4.2.2 PCB design
Designing of a pcb is a major slip in the production of pcbs. It forms
adistinct factor n electronic perfomance and reliability.The productivity of a
pcb with assembly and servicability also depends on design. The lay out should
include all the relevant aspects and details of the pcb design while the network
might be produced at 1:1 or 2:1 or even 4:1 scale.it is best prepared ona 1:1
scale
Steps Involved
1. Prepare the required circuit diagram
2. List out the components, their sizes etc.
3. Draft it onto a graph sheet
4. Place all pads and finish thin tracks
5. Put it on the mylor sheet and then on the graph sheet
6. Place parts including screw holes with the help of knife.
7. Fix all the tracks and Keep one component as the key.
Conversion of circuit diagram
1. Cutting lines , Mounting lines are done
2. List all the components their length diameter thickness code names
3. Keep one component as key component
4. Keep key component first and their supporting tools
5. All tracks are straight lines
6. In between ICs no signal lines should be passed
7. Mark the pin number of IC on the lay out for avoiding dislocations
8. The length of the conductor should be as low as possible
9. Place all the components, resistors ,diodes etc. parallel to each
other

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PCB layout
Lay out approaches
First the board outlines and the connectors are marked on a sheet of paper
followed by sketching of the component outlines with connecting point and
conductor patterns. Prepare
The layout as viewed from the component side first, so as to avoid any
confusion. The layout is developed in the direction of signal flow as far as
possible
Among the components the larger ones are filled first and the space
between is filled with smaller ones. Components, rewiring input, output
connections came near the connectors.
All the components are placed in such a manner that desoldering of the
component is not is not necessary, if they have to be re placed. While designing
the conductors, the minimum spacing requirement for the final network should
be known.
Transforming the lay out to copper
The lay out made on the graph sheet should be redrawn on the copper
clad using paint or nail polish.

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Etching
The final copper pattern is formed by selective removal of the unwanted
copper which is not protected by an electric rebist . FeCl3 solution is popularly
used etching solution. FeCl3 powder is made into a solution using water and
kept in a plastic tray. Immerse the marked copper clad in this solution for two or
three hours. Due to the reaction solution will became weak and it is not
recommended for further etching process. Take out the etched sheet from the
tray and dry out for in sunlight for an hour.
Etchants
Many factors have to be considered to choose the most suitable etchant
system for a PCB process. Some commonly used etchants are FeCl3, Cupric
chloride, Chromic acid etc. After etching FeCl3 is washed from the board and
cleaned dry. Paint is removed using suitable from the component insertion.
Holes are drilled into appropriate position and the components are soldered into
PCB carefully Etching using FeCl3

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Practical implementation
Take a copper clad of the required dimensions. Transfer the circuit layout
to the copper clad using cotton paper. The layout area should be marked with
nail polish. Put the copper clad into FeCl3 solution and warm it. Stage by stage
transformation of the copper clad occurs. Warm the solution Intermittently
according to the requirement. After about 4 hours etching will be completed.
Wash the board using soap solution to remove the remaining of FeCl3 solution.
Scrap off the nail polish and drill holes wherever required using appropriate
drill bits. PCB is fabricated.
Fabrication
Route the perimeter of the board using NC equipment.

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4.3 Software Implementation
4.3.1 Introduction
This section presents the results, from a software standpoint, when the
microcontroller was programmed to bring functionality to the entire system. In
addition, this section describes the functions of our program by means of a
software flow chart. A complete version of our C++ program source code is
included in Appendix C: C++ Embedded Program Source Code. The software
flow chart of our embedded program. The basic operation of our code, from
looking at this software flow chart, can be followed from the initialization of
variables down to the Main Loop. Our functions check to see which GPS string
type (From the GPS receiver) was received from the SER1 serial port. The
program executes different procedures depending on the GPS String.
If the GPS string is type GPGGA the program first parses for time and
stores the most recent time. It also parses for the number of satellites “in view”
from the GPGGA string. If the GPS string is type GPRMC the program stores it
as the most recent GPS coordinates on onboard memory. If the GPS string is
type GPVTG the program parses and stores the most recent velocity.
4.3.2 Creating Ports
The input/output ports on the PIC are addressed in PB Pro using their port
name followed by the pin you want the states of these pins are stored in special
memory registers, so when you ask for PORTB.0, for example, you're actually
reading the first bit of that byte of memory.
There two important memory registers for addressing the pins: The data
direction register, or TRIS, which tells you what the state of the pin is (input or
output). The PORT register then tells what the state of the pin is. So, for
example, to set pin 0 of port B (RB0) to an output and set it high.

_________________________________________________________________________________________________________________________
4.3.3 Algorithms
DEFINE OSC 20
CLEAR
;76543210
TRISA=%00001111 '0=output
TRISB=%11110000 '1 = input
TRISC=%10000000
TRISD=%00000000
TRISE=%00000000
;-------------------- [LCD definitions]------------------------------------------
DEFINE LCD_DREG PORTD
DEFINE LCD_DBIT 0
DEFINE LCD_EREG PORTD
DEFINE LCD_EBIT 5
DEFINE LCD_RSREG PORTD
DEFINE LCD_RSBIT 4
DEFINE LCD_BITS 4
DEFINE LCD_LINES 2
DEFINE HSER_RCSTA 90h
DEFINE HSER_TXSTA 24h
GPSin VAR PORTA.0
SMS_SENT VAR BIT
ADC1 VAR BYTE
ADC2 VAR BYTE
ADC3 VAR BYTE
' TEMP VAR WORD
TIME VAR BYTE
DIR1 VAR PORTB.0
DIR2 VAR PORTB.1
PWM1 VAR PORTB.2
PWM2 VAR PORTB.3
BUZ VAR PORTE.0 ' BUZZER
SMS_DATA VAR BYT
GOTO MAIN

_________________________________________________________________________________________________________________________
SEND_SMS1:
high buz
HSEROUT [AT+CMGS=, 34, 08976669322,34, 13]
PAUSE 500
HSEROUT [POTHOLES DETECTED ,13]
PAUSE 3000
low buz
RETURN
SEND_SMS2:
HSEROUT [AT+CMGS=, 34, 08976669322,]
PAUSE 500
HSEROUT [OBSTACLE AHEAD,13]
LOW BUZ
DIR1 = 0 :DIR2 = 0:PWM1=0: PWM2=0
RETURN
SEND_SMS3:
HSEROUT [AT+CMGS=, 34, 08976669322,34, 13]
PAUSE 500
HSEROUT [CO LEVEL HIGH VEHICLE NO MH-3454/LIC NO-8978SD,13]
LOW BUZ
RETURN
readgps:
SerIn2 GPSin,84,Timeout,readgps,[wait($GPRMC),wait(,),DEC2 hh,DEC2
mm,wait(,),fix,wait(,),DEC2 latdeg,DEC2 latmin,wait(,),NS,wait(,),DEC3 londeg,DEC2
lonmin,wait(,),EO,wait(,),knots,wait(.),DEC2 knotsten,wait(,),DEC3 lcdout $fe,1,SENDING
SMS
LCDOut $fe,$c0,DEC2 latdeg,223,DEC2 latmin,39,NS, ,DEC2 londeg,223,DEC2 lonmin,39,EO
'----------------------------------------------------------
HSEROUT [AT+CMGS=, 34, 08976669322,34, 13]
PAUSE 500
HSEROUT [POTHOLES DETECTED,13]
HSEROUT [LAT:,DEC2 latdeg,-,DEC2 latmin,39,NS, LON:,DEC2 londeg,-lonmin,]
PAUSE 3000
RETURN
MAIN:

_________________________________________________________________________________________________________________________
low buz
CLEAR
SMS_SENT = 0
lcdout $fe,1,SMART VEHICLE
lcdout $fe,$c0,ENSURING
PAUSE 3000
lcdout $fe,1,SAFE RIDE
lcdout $fe,$c0,2012-13
pause 3000
DIR1 = 1 :DIR2 = 0:PWM1=1: PWM2=1
PAUSE 3000
DIR1 = 0 :DIR2 = 0:PWM1=1: PWM2=1
PAUSE 3000
WHILE 1 = 1
ADCIN 0, ADC1 ' Read channel 0 to TEMP
ADCIN 1, ADC2 ' Read channel 1 to HUM
ADCIN 2, ADC3
lcdout $fe,1,ANGLE:, DEC3 ADC1,OB:, DEC3 ADC2
lcdout $fe,$c0,Gas: , DEC3 ADC3
IF ADC1 110 THEN
HIGH BUZ
lcdout $fe,1,POTHHOLE
lcdout $fe,$c0,DETECTED.
GOSUB SEND_SMS1
' HIGH RLY1 : LOW RLY2 : LOW RLY3 : LOW RLY4
ENDIF
IF ADC2 35 THEN
HIGH BUZ
lcdout $fe,1,OBSTACLE
lcdout $fe,$c0,AHEAD
GOSUB SEND_SMS2
ENDIF
IF ADC3 120 THEN
HIGH BUZ
lcdout $fe,1,CO2 LEVEL HIGH
lcdout $fe,$c0,DETECTED.
GOSUB SEND_SMS3
ENDIF
PAUSE 300
WEND

_________________________________________________________________________________________________________________________
4.3.4 Flow charts

_________________________________________________________________________________________________________________________
4.4 Implemented PCB Circuit

_________________________________________________________________________________________________________________________
5. TESTING AND RESULT ANALYSIS
These section deals with the practical working of the thesis and it has 3
main Phase of Project:
Potholes Testing and its Result
CO Testing and its Result
Obstacles Testing and its Result
5.1 Potholes Testing and its Result
We shall be following a testing program that will involve unit testing,
integration testing, and validation testing. More information will be known after
further discussion.
Fig: A testing plane with Accelerometer reading
A program implementing the algorithm explained in Section 5.3.3 was
written to test the pothole-detection module. A wooden platform, shown in
Figure 6.3, was constructed for the experiment. Two potholes with the same
maximum depth of 4 cm were used. One pothole had a gradual decline to the
maximum depth while the other had a sharp fall.

_________________________________________________________________________________________________________________________
Multiple runs were conducted. This is because in the latter case the available
sampling time of 2.5–3 ms was not fast enough to record all the encoder counts.
However, so long as the maximum count recorded. Exceeds the minimum
threshold, the primary function of pothole detection remains. Unaffected
because an infrared distance sensor is used for end-point detection. Also, due to
the very nature of pothole formation described in pervious section, potholes
tend to have gradually sloping edges and are usually bowl shaped.
Fig B: LCD display showing detection of Pothole
Fig C: LCD display showing sending of SMS to subscribed user

_________________________________________________________________________________________________________________________
5.2 CO Testing and its Result
Here we are implementing the MQ-7 under the test purpose. The entire
circuitry is connected to the LED for Alerting the user regarding the emission of
CO gas. If there is emission of CO gas LED will glow and hence the testing is
done.
Fig A: LED has glow and it indicates emission of CO gas
Fig B: LCD display showing detection of CO emission from vehicle

_________________________________________________________________________________________________________________________
5.3 Obstacles Testing and its Result
Consider, Laser sensor which is used to detect the object in front of the
vehicle which is also helpful during fog. Now in the below dig.
The rays are passed from the transmitter which hits the target. The light
beam is interrupted so it considers that there is no obstacle in front of the
vehicle. Now in other case if the rays are not interrupt but is reflected back then,
it is assume that there is an object in front of vehicle. So, the Diver will get an
alert regarding that object.
Fig A: Real time representation of LASER sensor
Fig B: LCD display showing Obstacle ahead
These how it works when laser sensor is put in front side of vehicle. The
green ray indicates the transmission of signal and Red rays indicates Receiving
of signal from the obstacles.

_________________________________________________________________________________________________________________________
6. CONCLUSION AND FUTURE SCOPE
6.1 Conclusion
Our project group was able to successfully implement a GPS-GIS pothole
mapping system along with CO emission and Fog and vehicles detector across
10m which can be used in any vehicle. Our system can be easily redesigned to
fit smaller enclosures, and also, the user interface can be easily updated for
other functions and applications, making our system very useful for other
projects. There are some improvements that could be looked into such as
wireless accelerometers and the use of multiple accelerometers (1 per each
wheel).The next generation system should also use constant logging to
determine road smoothness, and use algorithms that would help map these road
conditions. Overall, our current system could potentially lower the percentage
of damaged roads by properly allocating road repair resources and also has the
potential to lower the CO emission by detecting it in the environment. Also our
current system has some extra features like Fog and obstacle detector, LCD,
Alarm and LED for the user to see, judge and analyze the location. We also
evaluated our system on data from thousands of kilometers of “uncontrolled”
taxi drives, and found that out of reported detections, 90% contain road
anomalies in need of repair and 25% of vehicles on the road emit CO in the air.
So Consumers can be protected before CO enters the living space.

_________________________________________________________________________________________________________________________
6.2 Future scope and Further Modification
Vision-based method for any potholes detection :
• Camera Based:
This method uses 'Camera' as sensor to scan the road for any
potholes. The camera captures the images in real time. These
images are applied to image processing algorithms like edge
detection. This requires lot of processing time and power. There
many design approaches possible. Hardware based methods like
use of special Digital Signal Processors or Application Specific
Integrated Circuits improve the performance over software based
method. But still the response time of the operations required like
windowing convolution for the image processing algorithm is still
large. This method has one advantage over the other is, it can sense
a pothole without experiencing it i.e. Vehicle does not actually has
to pass through the pot hole to sense it. Characterization of pothole
can be done on the basis of size of the pothole.
• RADAR Based:
Other vision based methods for obstacle detection are
RADAR but they have little use in pothole detection. So it is
avoided.
• Automated Image Analysis Systems (AIAS) Based:
The cameras used by most of the (AIAS) are based on
Charge-Coupled Device (CCD) image sensors where a visible ray is
projected. However, the quality of the images captured by the CCD
cameras was limited by the inconsistent illumination and shadows
caused by sunlight. To enhance the CCD image quality, a high-power
artificial lighting system has been used, which requires a complicated
lighting system and a significant power source. In this paper, we can
introduce an efficient and more economical approach for pavement
distress inspection by using laser imaging. After the pavement images
are captured, regions corresponding to potholes are represented by a
matrix of square tiles and the estimated shape of the pothole is
determined. The vertical, horizontal distress measures, the total
number of distress tiles and the depth index information are
calculated providing input to a three-layer feed-forward neural
network for pothole severity and crack type classification. The
proposed analysis algorithm is capable of enhancing the pavement
image, extracting the pothole from background and analyzing its
severity.

_________________________________________________________________________________________________________________________
7. REFERENCES
1. R Gass, J Scott, C Diot, “Measurements of In-Motion 02.11Networking”,
IEEE Workshop on Mobile Computing System and Applications, 2006.
2. X Zhang, JK Kurose, BN Levine, D Towsley, H Zhang, “Study of a bus-based
disruption-tolerant network: mobility modeling and impact on
routing”, 13th annual ACM international conference, 2007.
3. “http://www.its.dot.gov/vii”, RITA | ITS | Vehicle Infrastructure
Integration, JAN 2007.
4. “http://dev.emcelettronica.com/datasheet/st/LIS3L06AL”, Datasheet of
STLIS3L06AL accelerometer, JAN 2008.
5. “http://www.gps.gov/”, Global Positioning System, JAN 2007.
6. JW Byers, M Lubyt, M Mitzenmachert, “A Digital Fountain Approach to
Reliable Distribution of Bulk Data”, SIGCOMM, 1998.
7. .M Mitzenmacher, “Digital fountains: a survey and look forward”,
Information Theory Workshop, 2004. IEEE, 2004.
8. “Pothole detection System using Wi-Fi”, Mtech project Report submitted
by Shonil Vijay, JUL 2007.
9. “FireBird Reference manual”, Embedded and real Time Systems Lab,
Computer science and Engineering Department, IITB.
10. Manufacturers of Emission Controls Association (MECA).
11. Emission Control Systems on FamilyCar.com.
12. National Vehicle and Fuel Emissions Laboratory of the United States
Environmental Protection Agency.
13. K. De Soya, C. Keppitiyagama, G. Seneviratne, and W. Shihan, “A
public transport system based sensor network for road surface condition
monitoring,” in Proc. NSDR’07, 2007, pp.

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