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The  Convergence of fabless Companies to Application Driven DesignDavid Dahan Primesense COO May 4, 2011
Presentation TopicsUser Experience / Application driven product Solution layers and sales cycle Industry supply chain and trends Delivering a complete solution and implicationsSuccess storySummary  2
User Experience Driven Product Silicon Requirement System HW+SWApplication  What  I can do with that ? End user cares about
Experience and Value … Nevertheless mostly the doesn’t know that he needs it at all….
"I think there is a world market for about five computers" — Remark attributed to Thomas J. Watson (IBM Chairman)
Product Cost / Performance (retail price) price needs to be factored in at the same time and drive the cost targets Typical Solution Layers ApplicationMiddleware OSSystem (RD) Chip + FW
Consumer Product Launch Cycle   EVT/DVT/PVTSystem and SW DevFAB   Cycle RTM Validation and QualX-mass Holiday SeasonSale CM/ODM  Production Ramp ChipSample DesignStartRTL FreezeProduction TO Oct.             Dec                  Dec.                    Apr201120122010Note: At the consumer market ~60%—70% of the yearly sales happen at Q4
Electronics Equipment  Industry Supply ChainSale ChannelSemiconductor DesignSystem DesignFablessIDM ODMManufacturing & Procurement Retail Distribution Marketing EquipmentDistributorElectronic RetailerOEMEMSODM: Original Device ManufacturerEMS: Electronics Manufacturing ServicesOEM: Original Equipment Manufacturer
Industry TrendTraditionally OEM/ODM derived requirement to Fabless and chip makers, nowadays OEM looking for complete and holistic solution and brand the product FablessOEMInvolve at the Application level Control the BOM and COGS cost Copy Ready reference Design (SW/HW) Si consolidate and merges  SoCPerformance Retail Price Time to Revenues Pass for Cost down
Fabless and OEM/ODM RelationODM Reference DesignATESupportFablessProduct OEM   SiliconRetail Chain
What is a Complete Solution ?Reference Design (RD) is a product(HW+SW) in a production level form and qualityFully QA SW that support the relevant OSApplication eco system Qualified Reference Design Pass Reliability, Environmental and CertificationFull BOM (Production files)The COGS meet the target price (Retail = 3X BOM) AVL Suppliers that meet cost and capacity needs Production line set up (at final destination)
Development Consideration          Electronic Design          Mechanical Design         Thermo           Optics Design          Audio / Video Design           RF Design          Select vendor and Tech.         Simple production flow         … Control the cost ManufacturingSystem/EngineeringSWBOM and COGS NPI process Qualified design (EV/DV/PV)DFxComponents and AVL Tool (Optics / Mechanical etc)Stable Production lineYield and SPC (>90% FPY)SW  Architecture Configurable Structural Development Release Methodology QA, RN, Bug Fix, patch etc …. Room for customization Chip Requirement Cost, Process Technology, IP, Si Speed, Memory Size, IF, Package , Test and Qual
Fabless Manpower Distribution Reference: Primesense      To support this industry trends Fabless shall invest more and more in System, SW and Manufacturing 11
MediaTek as an Example Taiwanese fabless chip vendor that secured design wins in handsets by enabling the handset OEM to roll out a product rapidly 12MediaTek 3G Reference Phone

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Track A- The convergence of fabless - primesens

  • 1. The Convergence of fabless Companies to Application Driven DesignDavid Dahan Primesense COO May 4, 2011
  • 2. Presentation TopicsUser Experience / Application driven product Solution layers and sales cycle Industry supply chain and trends Delivering a complete solution and implicationsSuccess storySummary 2
  • 3. User Experience Driven Product Silicon Requirement System HW+SWApplication What I can do with that ? End user cares about
  • 4. Experience and Value … Nevertheless mostly the doesn’t know that he needs it at all….
  • 5. "I think there is a world market for about five computers" — Remark attributed to Thomas J. Watson (IBM Chairman)
  • 6. Product Cost / Performance (retail price) price needs to be factored in at the same time and drive the cost targets Typical Solution Layers ApplicationMiddleware OSSystem (RD) Chip + FW
  • 7. Consumer Product Launch Cycle EVT/DVT/PVTSystem and SW DevFAB Cycle RTM Validation and QualX-mass Holiday SeasonSale CM/ODM Production Ramp ChipSample DesignStartRTL FreezeProduction TO Oct. Dec Dec. Apr201120122010Note: At the consumer market ~60%—70% of the yearly sales happen at Q4
  • 8. Electronics Equipment Industry Supply ChainSale ChannelSemiconductor DesignSystem DesignFablessIDM ODMManufacturing & Procurement Retail Distribution Marketing EquipmentDistributorElectronic RetailerOEMEMSODM: Original Device ManufacturerEMS: Electronics Manufacturing ServicesOEM: Original Equipment Manufacturer
  • 9. Industry TrendTraditionally OEM/ODM derived requirement to Fabless and chip makers, nowadays OEM looking for complete and holistic solution and brand the product FablessOEMInvolve at the Application level Control the BOM and COGS cost Copy Ready reference Design (SW/HW) Si consolidate and merges  SoCPerformance Retail Price Time to Revenues Pass for Cost down
  • 10. Fabless and OEM/ODM RelationODM Reference DesignATESupportFablessProduct OEM SiliconRetail Chain
  • 11. What is a Complete Solution ?Reference Design (RD) is a product(HW+SW) in a production level form and qualityFully QA SW that support the relevant OSApplication eco system Qualified Reference Design Pass Reliability, Environmental and CertificationFull BOM (Production files)The COGS meet the target price (Retail = 3X BOM) AVL Suppliers that meet cost and capacity needs Production line set up (at final destination)
  • 12. Development Consideration Electronic Design Mechanical Design Thermo Optics Design Audio / Video Design RF Design Select vendor and Tech. Simple production flow … Control the cost ManufacturingSystem/EngineeringSWBOM and COGS NPI process Qualified design (EV/DV/PV)DFxComponents and AVL Tool (Optics / Mechanical etc)Stable Production lineYield and SPC (>90% FPY)SW Architecture Configurable Structural Development Release Methodology QA, RN, Bug Fix, patch etc …. Room for customization Chip Requirement Cost, Process Technology, IP, Si Speed, Memory Size, IF, Package , Test and Qual
  • 13. Fabless Manpower Distribution Reference: Primesense To support this industry trends Fabless shall invest more and more in System, SW and Manufacturing 11
  • 14. MediaTek as an Example Taiwanese fabless chip vendor that secured design wins in handsets by enabling the handset OEM to roll out a product rapidly 12MediaTek 3G Reference Phone
  • 15. Primesense Solution Layers Content is created by Primesense Partners and Developer ApplicationPrimeSense is piloting the consortium of OpenNI developersMiddleware OSPrimeSensor Reference Design Develop by PrimeSense and ODM partnerSystem (RD) PS1080 SoC + FW Develop and sale by PrimeSense Chip + FW 13
  • 16. Key Take Away Product is driven by Experience/ Application Vs. CostOEM focus on the product branding and retail chainThe “D” at the ODM isn't so strong Fabless needs to feel the gap and to do “more then Moore”This drive Fabless to be more system company and incorporate competence at System / SW and manufacturing domain but still revenue to flow in from Chip sale !14