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Integrated Circuit (IC) Design Process
Analog IC Design vs. Digital IC Design Processes
Outline
▫ Background
▫ Integrated Circuit
▫ CMOS Technology
▫ Technology Scaling
▫ Design Process & Criteria
▫ Analog IC Design Flow
▫ Digital IC Design Flow
▫ How are microchips made?
2
What is an IC?
3
An integrated circuit (IC), also called microelectronic circuit, microchip, or chip,
an assembly of electronic components, fabricated as a single unit, in which
miniaturized active devices, passive devices and their interconnections are
built up on a thin substrate of semiconductor material (typically silicon). The
individual circuit components are generally microscopic in size (in microns or
nm).
Source: Britannica
Semiconductors – at the heart of the technology wave
4
CMOS Technology
5
Manufacturing an integrated circuit is based on CMOS technology.
CMOS stands for “Complementary Metal Oxide Semiconductor”.
Source: PIIC
Technology Scaling
6
Source: EE Times
Decreasing transistor’s
gate length (L), allows
more transistors to fit
into the chip.
Design Criteria
7
P
e
r
f
o
r
m
a
n
c
e
P
o
w
e
r
Area
Denser integration
Longer
battery life
Higher clock
Frequencies
Source: Cadence
Design Process
8
Design: specify design
parameters, target values, etc
Implementation: refine the
design through all phases
Verification: verify the
correctness of design and
implementation
Analog IC Design Flow (Full-Custom)
9
Design Specifications
Circuit Level Design
Circuit Architecture
Layout
Fabrication
SPICE Simulation
Design Rule
Check, Layout vs.
Schematic
Pre-layout Simulation
Post-layout Simulation
Full custom design of a two-stage op amp
10
1. Design Specifications
11
Phase Margin > 60°
Gain 45dB
Slew Rate > 10uV/s
CMRR 45dB
2. Circuit Architecture
12
Current
Reference
Differential Amplifier
Common-Source
Amplifier
3. Circuit Level Design
13
4. Pre-layout Simulation
14
Target Specs
Pre-Sim
Results
Phase Margin > 45° 55.9°
Gain 45dB 48.2dB
Slew Rate > 10uV/s 12.1uV/s
CMRR 45dB 48.2dB
5. Layout
15
6. Post-layout Verification and Simulation
16
DRC LVS
LPE
6. Post-layout Verification and Simulation
17
Target
Specs
Pre-Sim
Results
Post-Sim
Results
Phase
Margin
> 45° 55.9° 54.3°
Gain 45dB 48.2dB 47.5dB
Slew Rate > 10uV/s 12.1uV/s 11.8uV/s
CMRR 45dB 48.2dB 47.3dB
Ready for
Fabrication!!!
Digital IC Design Flow (Cell-based)
18
Design Specifications
Logic Synthesis
Front End
Physical Design
Back End
RTL Coding &
Functional Verification
Logic Verification
Physical Verification &
Signoff
Fabrication
always@(A,B or C)
begin
S = A^B^C;
CO = (A&B)|(A&C)|(B&C)
end
Design Specs and RTL Coding
19
▫ Architecture:
▫ Key Algorithms (filtering, for example)
▫ Amount of on-chip Memories, sizes, clock frequency, etc
▫ RTL: Register Transfer Level
▫ Verilog, VHDL, SystemVerilog: an executable spec for the
chip, amounting to over a million lines of code
▫ Lots of simulations to verify the spec (literally billions of
cycles)
▫ Timing constraints, clock definitions, etc
Logic Synthesis
20
▫ Logic Synthesis: converts the RTL to logic gates (NAND-NORs,
NOTs, Registers)
▫ Many discrete optimization techniques used here: boolean
minimization, static timing analysis, state equivalence, etc,
▫ Key technique: how do you prove that two logic equations
are equivalent?
process begin
wait until not
CLOCK'stable
and CLOCK=1;
if(ENABLE='1') then
TOGGLE<= not
TOGGLE;
end if;
end process;
Functional Verification
21
▫ Verify that the logic gates will do what you want, when you want
them to (Simulation, Timing Analysis, Testbench Generation)
0
1
0
1
1
Physical Design (Layout)
22
▫ Floorplanning, Placement, and Routing
Floorplan
Placement
Routing
Verification
23
▫ Make sure "what you see is what you get"
▫ Compare what you designed to what's in your layout
▫ Layout versus Schematic (LVS)
▫ Make sure that minimum spacing, sizes, etc are met (Design Rule Check)
▫ Make sure that it meets timing requirements( Static Timing Analysis, etc.)
process begin
wait until not
CLOCK'stable
and CLOCK=1;
if(ENABLE='1') then
TOGGLE<= not
TOGGLE;
end if;
end process;
? ?
Design Goes to Fabrication
24
25
References
26
D. G. Bailey, “The advantages and limitations of high level synthesis for fpga-based image processing,” Proceedings of
the 9th International Conference on Distributed Smart Cameras, 2015.
Genus Synthesis Solution. Cadence Design Systems, Inc., 2021.
Genus Physical Guide. Cadence Design Systems, Inc., 2021.
PPA Push: Tips & Tricks (Innovus 17.1x).Cadence Design Systems, Inc.,2018.
A. B. Kahng, J. Lienig, I. Markov, and J. Hu, VLSI Physical Design: From Graph Partitioning to Timing Closure. New York City,
NY: Springer, 2011
Genus iSpatial - Rapid Adoption Kit. 2655 Seely Ave., San Jose, CA 95134,USA: Cadence Design Systems, Inc, 2021.
Innovus User Guide. 2655 Seely Ave., San Jose, CA 95134, USA: Cadence Design Systems, Inc, 2021.
Best Full-Flow PPA. Cadence Design Systems, Inc., 2020.
Thank you
for listening!
Any Questions???
27
susie.maestre@msumain.edu.ph

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Analog vs digital integrated circuit design

  • 1. Integrated Circuit (IC) Design Process Analog IC Design vs. Digital IC Design Processes
  • 2. Outline ▫ Background ▫ Integrated Circuit ▫ CMOS Technology ▫ Technology Scaling ▫ Design Process & Criteria ▫ Analog IC Design Flow ▫ Digital IC Design Flow ▫ How are microchips made? 2
  • 3. What is an IC? 3 An integrated circuit (IC), also called microelectronic circuit, microchip, or chip, an assembly of electronic components, fabricated as a single unit, in which miniaturized active devices, passive devices and their interconnections are built up on a thin substrate of semiconductor material (typically silicon). The individual circuit components are generally microscopic in size (in microns or nm). Source: Britannica
  • 4. Semiconductors – at the heart of the technology wave 4
  • 5. CMOS Technology 5 Manufacturing an integrated circuit is based on CMOS technology. CMOS stands for “Complementary Metal Oxide Semiconductor”. Source: PIIC
  • 6. Technology Scaling 6 Source: EE Times Decreasing transistor’s gate length (L), allows more transistors to fit into the chip.
  • 8. Design Process 8 Design: specify design parameters, target values, etc Implementation: refine the design through all phases Verification: verify the correctness of design and implementation
  • 9. Analog IC Design Flow (Full-Custom) 9 Design Specifications Circuit Level Design Circuit Architecture Layout Fabrication SPICE Simulation Design Rule Check, Layout vs. Schematic Pre-layout Simulation Post-layout Simulation
  • 10. Full custom design of a two-stage op amp 10
  • 11. 1. Design Specifications 11 Phase Margin > 60° Gain 45dB Slew Rate > 10uV/s CMRR 45dB
  • 13. 3. Circuit Level Design 13
  • 14. 4. Pre-layout Simulation 14 Target Specs Pre-Sim Results Phase Margin > 45° 55.9° Gain 45dB 48.2dB Slew Rate > 10uV/s 12.1uV/s CMRR 45dB 48.2dB
  • 16. 6. Post-layout Verification and Simulation 16 DRC LVS LPE
  • 17. 6. Post-layout Verification and Simulation 17 Target Specs Pre-Sim Results Post-Sim Results Phase Margin > 45° 55.9° 54.3° Gain 45dB 48.2dB 47.5dB Slew Rate > 10uV/s 12.1uV/s 11.8uV/s CMRR 45dB 48.2dB 47.3dB Ready for Fabrication!!!
  • 18. Digital IC Design Flow (Cell-based) 18 Design Specifications Logic Synthesis Front End Physical Design Back End RTL Coding & Functional Verification Logic Verification Physical Verification & Signoff Fabrication always@(A,B or C) begin S = A^B^C; CO = (A&B)|(A&C)|(B&C) end
  • 19. Design Specs and RTL Coding 19 ▫ Architecture: ▫ Key Algorithms (filtering, for example) ▫ Amount of on-chip Memories, sizes, clock frequency, etc ▫ RTL: Register Transfer Level ▫ Verilog, VHDL, SystemVerilog: an executable spec for the chip, amounting to over a million lines of code ▫ Lots of simulations to verify the spec (literally billions of cycles) ▫ Timing constraints, clock definitions, etc
  • 20. Logic Synthesis 20 ▫ Logic Synthesis: converts the RTL to logic gates (NAND-NORs, NOTs, Registers) ▫ Many discrete optimization techniques used here: boolean minimization, static timing analysis, state equivalence, etc, ▫ Key technique: how do you prove that two logic equations are equivalent? process begin wait until not CLOCK'stable and CLOCK=1; if(ENABLE='1') then TOGGLE<= not TOGGLE; end if; end process;
  • 21. Functional Verification 21 ▫ Verify that the logic gates will do what you want, when you want them to (Simulation, Timing Analysis, Testbench Generation) 0 1 0 1 1
  • 22. Physical Design (Layout) 22 ▫ Floorplanning, Placement, and Routing Floorplan Placement Routing
  • 23. Verification 23 ▫ Make sure "what you see is what you get" ▫ Compare what you designed to what's in your layout ▫ Layout versus Schematic (LVS) ▫ Make sure that minimum spacing, sizes, etc are met (Design Rule Check) ▫ Make sure that it meets timing requirements( Static Timing Analysis, etc.) process begin wait until not CLOCK'stable and CLOCK=1; if(ENABLE='1') then TOGGLE<= not TOGGLE; end if; end process; ? ?
  • 24. Design Goes to Fabrication 24
  • 25. 25
  • 26. References 26 D. G. Bailey, “The advantages and limitations of high level synthesis for fpga-based image processing,” Proceedings of the 9th International Conference on Distributed Smart Cameras, 2015. Genus Synthesis Solution. Cadence Design Systems, Inc., 2021. Genus Physical Guide. Cadence Design Systems, Inc., 2021. PPA Push: Tips & Tricks (Innovus 17.1x).Cadence Design Systems, Inc.,2018. A. B. Kahng, J. Lienig, I. Markov, and J. Hu, VLSI Physical Design: From Graph Partitioning to Timing Closure. New York City, NY: Springer, 2011 Genus iSpatial - Rapid Adoption Kit. 2655 Seely Ave., San Jose, CA 95134,USA: Cadence Design Systems, Inc, 2021. Innovus User Guide. 2655 Seely Ave., San Jose, CA 95134, USA: Cadence Design Systems, Inc, 2021. Best Full-Flow PPA. Cadence Design Systems, Inc., 2020.
  • 27. Thank you for listening! Any Questions??? 27 susie.maestre@msumain.edu.ph

Editor's Notes

  • #3: The individual circuit components are generally microscopic in size.
  • #4: Semiconductors have been the driving force of technology for many years now. The remarkable growth in the semiconductor industry is primarily due to the advances in large-scale integration technologies. <clcik> In the era of gigascale integration, Millions to billions of transistors are integrated in a single chip. This paves way to the increasing capabilities of microprocessors in consumer electronics such as <click> smartphones, tablets, gaming devices, wireless appliances and car electronics, even more so in the emerging technologies like 5G and AI.
  • #6: According to Moore’s law, The number of transistors in a computer chip doubles roughly every two years. As the number of transistors increases, so does processing power. As the number of transistors increases, the cost per transistor falls. In the era of gigascale integration, millions to billions of transistors are integrated in a single chip.
  • #7: <click>Performance, <click> Power, <click> Area. These three are the most cited criteria for a successful design. However.. At advanced process nodes, IC designers are facing three major challenges. First, the strong correlation between chip performance <click> and frequency poses a challenge to support higher clock frequencies. The second challenge <click> is lowering the power consumption to support longer battery life of portable devices. Third, <click> technology scaling allows denser integration leading to higher net/signal loading that may degrade performance if not addressed accordingly .
  • #18: A digital IC design flow is a sequence of operations that transform RTL code into layout for fabrication. Shown here are just basic steps in digital design flow. <click>The design starts with design specifications of the IC. During this step, the overall goals of the design is specified. These goals and requirements span functionality, performance, physical dimensions and production technology. <click> The design is implemented at the register-transfer level (RTL) using a hardware description language (HDL) such as VHDL and Verilog. This is done by means of programs that define the functional and timing behavior of a chip. The HDL modules must then be thoroughly simulated and verified to ensure its functionality. <click> Once the functionality of the RTL Code has been verified, logic synthesis converts HDL into low-level circuit elements such as standard cells , gates and transistors. . The logic synthesis maps the described functionality to a list of signal nets called netlist. <click> Logic Verification ensures that the gate-level netlist meets the design constraints. <click> During physical design, all design components in the netlist are instantiated with their geometric representations. In other words, all cells, gates, transistors with fixed shapes and sizes per fabrication layer are assigned spatial locations (placement) and have appropriate routing connections (routing) completed in metal layers. In short, physical design creates the layout based on the netlist provided by the logic synthesis. <click> Physical verification ensures that Physical design is performed with respect to design rules that represent the physical limitations of the fabrication medium. For instance, all wires must be a prescribed minimum distance apart and have prescribed minimum width. <click> The final result of physical design will then be handed for fabrication.
  • #20: A manual process in the past, still mostly manual for Analog Logic Synthesis (1989): automate the process Many discrete optimization techniques used here: boolean minimization, static timing analysis, state equivalence, etc, etc. End point is a “netlist”, meaning a set of logic gates and their connections. A large netlist is in the 10s of millions of gates Can be simulated or “formally verified” versus the RTL.
  • #21: Click first! This step is very important before moving on to the next step. To make sure that your gate-level netlist is logically equivalent with the RTL code
  • #22: Floorplanning Where do we place the large blocks? Where do we place the “random” logic and “structured blocks”? A combination of manual and automated approaches is used Need to keep connections short to meet timing, but also cannot “congest” the design too much or we cannot complete the connections Note that connections do have R and C (to substrate and coupling between wires) so they introduce delay! Meeting timing can be very difficult! The Power and Ground lines usually get decided here Placement: Now we need to complete the exact details of where each block and gate will be Automation has been a key for many years (1980). A block may contain hundreds of thousands of cells, so it is very hard problem: minimize area, be routable and meet timing Note may have to add logic: repeaters to restore signals a key example Routing Complete all the connections! But, need to meet timing and keep signal integrity. This also involve separating some wires, for example, to avoid bad couplings Automation is the norm here (1980)
  • #23: Spacing and sizing rules are checked for all polygons (1980) Parasitics are extracted, netlists back annotated and time analyzed using static techniques (1990) Manufacturing requires complicated rules, such as wire density been “uniform”
  • #24: Finally
  • #25: Thank you po for listening.
  • #27: Thank you po for listening.